Patents for B23K 1 - Soldering, e.g. brazing, or unsoldering (16,089)
05/2000
05/24/2000EP1002611A1 Solder ball connections and assembly process
05/24/2000EP1002610A1 Solder ball connections and assembly process
05/23/2000US6065664 Method of installing heat pipes using internal vapor pressure
05/23/2000US6065534 Aluminum alloy article and method of use
05/18/2000WO2000027570A1 Method for making self-brazing components using powder metallurgy
05/18/2000DE19851009A1 Actuator assembly for electromagnetic valve control in an internal combustion engine is produced by brazing an armature plate to a tappet of different material and final magnetic annealing in same furnace
05/17/2000EP0800755B1 Dual air knife for hot air solder levelling
05/16/2000US6064026 Method for producing an electrical bond between conductors and electrical connector contacts
05/16/2000US6062464 Method of brazing aluminium with flux and a furnace therefor
05/16/2000US6062460 Apparatus for producing an electronic circuit
05/11/2000WO2000025975A1 Method of manufacturing diamond cutting tools through instantaneous heating process and cooling process and such a diamond cutting tool
05/11/2000WO2000025971A1 Apparatus and method for inerting a wave soldering installation
05/10/2000EP0999730A2 Lead-free solder process for printed wiring boards
05/10/2000EP0999729A2 Process for laser soldering and for temperature monitoring of semi-conductor chips, and chip cards manufactured according to this process
05/10/2000EP0999007A1 Flux management system for a solder reflow oven
05/10/2000EP0998994A2 Multi-wall tube
05/10/2000CN1252505A Multiple wall pipe
05/10/2000CN1252331A Machining process of high-accuracy and great-depth small hole
05/09/2000US6059174 Flux composition for brazing of aluminum material and method for brazing of aluminum material
05/09/2000US6059170 Method and apparatus for insulating moisture sensitive PBGA's
05/04/2000DE19950843A1 Flow soldering apparatus for printed circuit board, has gripping mechanism moved over solder tank
05/04/2000DE19849449A1 Connecting heat exchange parts used for e.g. water coolers involves using laser welding
05/03/2000EP0997222A1 Device for the laser processing of materials
05/03/2000EP0996770A1 Method and apparatus for treating metal surfaces by dry process
05/02/2000US6057527 Portable electric desoldering tool
05/02/2000US6056507 Article with brazed end plate within an open body end
05/02/2000US6056190 Solder ball placement apparatus
05/02/2000US6056189 Fluxing media for non-VOC, no-clean soldering
05/02/2000US6056184 Apparatus for shaping liquid portions of solder in soft soldering semiconductor chips
04/2000
04/28/2000CA2282143A1 Multi-wall tube
04/27/2000WO2000023844A1 Device and method for the optical inspection of concealed soldered connections
04/26/2000EP0994777A1 Method and device for producing a metallic or ceramic body
04/25/2000US6054693 Microwave technique for brazing materials
04/25/2000US6054687 Heating apparatus for a welding operation and method therefor
04/25/2000US6054682 Method and system for reducing water vapor in integrated circuit packages prior to reflow
04/25/2000US6053394 Column grid array substrate attachment with heat sink stress relief
04/25/2000US6053393 Shaving blade for chip site dressing
04/20/2000WO2000022898A1 Heating device and heating method
04/20/2000WO2000022883A1 Matrix-inductor soldering apparatus and soldering process
04/19/2000CN2374298Y Multisensing heads rotary heating welder and its water gas rotary distributor
04/18/2000US6050479 Defluxing agent cleaning method and cleaning apparatus
04/18/2000US6050477 Moving brazing alloy deposit and directionally solidified or monocrystalline component through heated zone, heating alloy above liquidus temperature but below incipient melting point of component while maintaining thermal gradient between them
04/18/2000US6050473 Brazing apparatus
04/18/2000US6049976 Method of mounting free-standing resilient electrical contact structures to electronic components
04/13/2000WO2000020154A1 Method and apparatus for placing solder balls on a substrate
04/13/2000DE19846705A1 Soldering of low melting point highly conductive thin sheet components, especially stud soldering to a sheet, is effected using a solder deposit of low melting solder and high electrical resistance high melting solder
04/12/2000CN1051435C Method and apparatus for aligning and attaching a surface mount component
04/12/2000CN1051434C Jig for detecting warp of printed circuit board
04/11/2000US6049656 Method of mounting an integrated circuit on a printed circuit board
04/11/2000US6047876 Process of using an active solder alloy
04/11/2000US6047875 Reflow soldering self-aligning fixture
04/05/2000EP0876216B1 Layered sheet metal with rolled-on solder and process for manufacturing a honeycombed body therefrom
04/05/2000CN1249360A Micro etching agent of copper and copper alloy
04/04/2000US6045030 Sealing electronic packages containing bumped hybrids
04/04/2000US6045025 Method and apparatus for soldering and soldering land of a printed circuit board
03/2000
03/30/2000WO2000017923A1 Bump forming method, soldering preprocessing method, soldering method, soldering preprocessing apparatus and soldering apparatus
03/30/2000WO2000017409A1 Corrosion protective sacrificial aluminum alloy for heat exchanger and aluminum alloy composite material highly resistant to corrosion for heat exchanger and heat exchanger using said composite material
03/30/2000DE19928299A1 Mehrfach gewickeltes rostfreies Stahlrohr Multi-wound stainless steel pipe
03/30/2000DE19844384A1 Automatic wave soldering method for printed circuit board uses solder bath maintained at constant solder temperature by precise regulation of gas heating device
03/30/2000DE19842276A1 Paste zum Verschweißen von Keramiken mit Metallen und Verfahren zur Herstellung einer Schweißverbindung Paste for welding ceramic materials with metals and methods for producing a welded joint
03/29/2000EP0988919A1 Screen printable and dispensable active brazing paste and its method of manufacturing
03/29/2000EP0988129A1 Method and device for repairing defective soldered joints
03/29/2000EP0988128A1 Processing station for heat treatment of surfaces using a process gas
03/29/2000EP0988127A1 Method for producing a metallic honeycomb element by means of a gas permeable soldering foil
03/28/2000US6042932 Braided buss bar with selectively clad solder pad attachments
03/28/2000US6042659 Method of coating the seams of a welded tube
03/28/2000US6041573 Apparatus and method for charging canisters with a high pressure gas
03/23/2000WO2000015578A1 Metal-aluminium-nitride assembly with rare earth nitride present in the interface to ensure heat transfer
03/23/2000WO2000015384A1 Paste for welding ceramics to metals and method for producing a welded joint
03/23/2000WO2000015355A1 Method of treating ceramics for use as tips in saws and other tools or other structures
03/23/2000DE19843015A1 Soldering of pipes and fittings, especially of copper, comprises applying or dripping an aqueous flux solution onto the pipe and fitting ends prior to assembly and soldering
03/22/2000CN1247785A Golf club head braze welding process with dissimilar metal
03/21/2000US6040563 Bonded assemblies
03/21/2000US6039241 Mechanism for removal of surface mount connectors using heat conduction through pins
03/21/2000US6039236 Reflow soldering apparatus with improved cooling
03/21/2000CA2033134C Fluxless solder coating and joining
03/16/2000WO2000015014A1 Device for soldering or unsoldering components arranged on a circuit support
03/16/2000DE19840450A1 Vorrichtung zum Ein- oder Auslöten von auf einem Schaltungsträger angeordneten Bauelementen Apparatus for switching or desolder arranged on a circuit board components
03/16/2000DE19839343A1 Verfahren zum Bearbeiten eines Bauteils oder einer Bauteilanordnung mittels elektromagnetischer Strahlung sowie Vorrichtung zum Fügen, insbesondere Verlöten A method for processing a part or component assembly by means of electromagnetic radiation and apparatus for joining, in particular soldering
03/15/2000EP0985991A2 Apparatus and method for automatically correcting soldering
03/15/2000EP0985450A1 Exhaust gas cleaning catalyst metal honey comb element and its manufacture
03/15/2000EP0851797B1 Brazing of catalyzed converter bodies
03/15/2000EP0764352A4 Microelectronic contacts and assemblies
03/14/2000US6036528 Hollow contact for solder connection
03/14/2000US6036084 Screen printing method and apparatus therefor, and electronic component soldering method using screen printing and apparatus therefor
03/14/2000US6036083 Method for braze flux application
03/14/2000US6035927 Tube/fin block for a heat exchanger and manufacturing process therefor
03/09/2000WO2000012256A1 Method for processing and for joining, especially, for soldering a component or a component arrangement using electromagnetic radiation
03/09/2000WO1999060323A8 Aluminum alloy composition, article and method of use
03/07/2000US6032356 Wafer-level test and burn-in, and semiconductor process
03/02/2000WO2000011921A1 Method and device for placing and remelting shaped pieces consisting of solder material
03/02/2000WO2000010762A1 Solderable structures
03/01/2000EP0982096A1 Method of manufacturing core of heat exchanger
03/01/2000EP0982095A1 Method of manufacturing heat exchange tube
02/2000
02/29/2000US6031303 Method of joining a member of soft magnetic material to a member of hardened material using a brazing technique
02/24/2000WO1999061195A9 Cobalt-chromium-palladium-based brazing alloys
02/24/2000DE19838068C1 Production of vacuum containers comprises assembling individual parts together after application of solder between them and soldering in vacuum
02/23/2000CN1245098A Technology for producing metallic composition by means of soldering technique and principle
02/17/2000WO2000008684A1 High performance flip chip package
02/16/2000EP0781185B1 Method for manufacturing metallic structures