| Patents for B23H 5 - Combined machining (1,281) |
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| 10/26/2004 | US6808617 Measuring thickness equivalent data of a film on wafer, making cathode member smaller than surface face region thereof, interposing electrolytic solution between surface and cathode member, applying voltage, electrolytic polishing |
| 10/21/2004 | US20040206634 Electrolytic processing apparatus and substrate processing apparatus and method |
| 10/20/2004 | EP1467840A1 Process control in electro-chemical mechanical polishing |
| 10/14/2004 | US20040200733 Method and apparatus for substrate polishing |
| 10/14/2004 | US20040200732 Method and apparatus for eliminating defects and improving uniformity in electrochemically processed conductive layers |
| 10/13/2004 | CN1170656C Method for grinding non-axial-symmetry and non-ball-surface mirror |
| 10/12/2004 | US6802955 Polishing pad, platen comprising first conductive layer in contact with polishing pad for coupling to first potential, second conductive layer for coupling to second potential, insulating layer, electrical contact, electrolyte reservoir |
| 10/07/2004 | US20040195111 Performs uniform electrodeposition and electroetching |
| 10/07/2004 | US20040195110 Method and apparatus for electrochemical planarization of a workpiece |
| 09/30/2004 | US20040188273 Measurement electrical resistance of electroconductive coatings on substrate; detection of end-points |
| 09/29/2004 | CN1533485A Method for working nut screw of ball screw |
| 09/28/2004 | US6797623 Methods of producing and polishing semiconductor device and polishing apparatus |
| 09/23/2004 | US20040182721 Process control in electro-chemical mechanical polishing |
| 09/23/2004 | US20040182720 Measuring thickness equivalent data of a film on a wafer, making a cathode member smaller than the surface face a region, interposing an electrolytic solution between the surface and the cathode member, applying a voltage using the cathode member as a cathode and the film an anode, electrolytic polishing |
| 09/23/2004 | US20040182715 Process and apparatus for air bubble removal during electrochemical processing |
| 09/22/2004 | CN1531747A Planarization of substrates using electrochemical mechanical polishing |
| 09/22/2004 | CN1531473A Conductive polishing article for electrochemical mechanical polishing |
| 09/21/2004 | US6793797 Alternately electrodepositing and electro- mechanically polishing to selectively fill a semiconductor feature with metal including a) providing an anode assembly and a semiconductor wafer disposed in spaced apart relation |
| 09/16/2004 | WO2004079809A1 Electropolishing endpoint detection method |
| 09/16/2004 | WO2004078411A2 Method and apparatus for local polishing control |
| 09/16/2004 | US20040178064 Ball supports and puller for pulling a cable through a pipe |
| 09/09/2004 | US20040173461 Method and apparatus for local polishing control |
| 09/08/2004 | EP1453991A1 Electrolytic processing apparatus and method |
| 09/07/2004 | US6787728 Method and apparatus for near net shape rapid rough electromachining for blisks |
| 09/02/2004 | WO2004073926A1 Polishing article for electro-chemical mechanical polishing |
| 09/02/2004 | US20040168926 Electrodeposition; supplying solution; rotating wafers |
| 08/31/2004 | US6783658 Electropolishing method |
| 08/31/2004 | US6783657 Dissolution, etching, or polishing; semiconductors |
| 08/26/2004 | WO2004072332A1 Polishing fluid, method of polishing, and polishing apparatus |
| 08/26/2004 | US20040163946 Pad assembly for electrochemical mechanical processing |
| 08/25/2004 | CN1523647A Apparatus for electropolishing metal interconnections on semiconductor devices |
| 08/19/2004 | US20040159558 Electricoconductive compound formed into layer comprising mixture of polymer and filler; semiconductors, integrated circuits |
| 08/19/2004 | US20040159557 Contains abrasive particles and electrolyte; oxidation of metal film surface; preventing defects; wear resistance |
| 08/17/2004 | US6776693 Method and apparatus for face-up substrate polishing |
| 08/12/2004 | US20040154931 Polishing liquid, polishing method and polishing apparatus |
| 08/05/2004 | US20040149592 Electropolishing apparatus and polishing method |
| 07/15/2004 | US20040134792 electroplating; ball assemblies comprises interior housing, annular seat, conductive adapter, and coupled conductive contact |
| 07/14/2004 | CN1511667A Method and device for nearly forming quick coarse working for round disc with blade |
| 07/08/2004 | US20040132381 Integrated circuit interconnect fabrication systems and methods |
| 07/01/2004 | US20040124181 Method and apparatus for near net shape rapid rough machining for blisks |
| 06/30/2004 | EP1433557A2 Method and apparatus for near net shape rapid rough machining for blisks |
| 06/30/2004 | EP1432852A2 Electrolytic processing apparatus and method |
| 06/29/2004 | US6756307 Apparatus for electrically planarizing semiconductor wafers |
| 06/24/2004 | US20040121708 Pad assembly for electrochemical mechanical processing |
| 06/22/2004 | US6752916 Electrochemical planarization end point detection |
| 06/22/2004 | US6752699 Working method for curved surface of a work and an apparatus thereof |
| 06/17/2004 | US20040112760 Constant low force wafer carrier for electrochemical mechanical processing and chemical mechanical polishing |
| 06/03/2004 | US20040104128 Filling concave portions formed on wafer surface; determining electropolishing end point of metal film in accordance with change of current waveform |
| 06/02/2004 | EP1423868A2 Forming a semiconductor structure using a combination of planarizing methods and electropolishing |
| 05/27/2004 | WO2004044273A1 Electropolishing system and process |
| 05/25/2004 | US6739951 Method and apparatus for electrochemical-mechanical planarization |
| 05/21/2004 | WO2004041467A1 Electrochemical machining device and electrochemical machining method |
| 05/18/2004 | US6737602 EDM apparatus and method incorporating combined electro-erosion and mechanical sawing features |
| 05/18/2004 | US6736952 Platen of conductive material is disposed proximate to the polishing pad and is configured to have a negative charge during planarization process; demetallization of a workpiece surface such as semiconductor |
| 05/18/2004 | US6736699 Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing |
| 05/13/2004 | US20040092110 Polishing method and polishing apparatus |
| 04/29/2004 | US20040082289 Conductive polishing article for electrochemical mechanical polishing |
| 04/27/2004 | US6726823 Assembly for holding wafer comprising wafer chuck having bottom section and spring member configured to apply electric charge to wafer disposed between bottom section and wafer, and actuator assembly configured to move wafer chuck |
| 04/22/2004 | WO2003029531A3 Electrolytic processing apparatus and method |
| 04/21/2004 | EP1410430A2 Planar metal electroprocessing |
| 04/21/2004 | CN1146966C Methods and appts. for electropolishing metal intennections on semiconductor devices |
| 04/20/2004 | US6722950 Method and apparatus for electrodialytic chemical mechanical polishing and deposition |
| 04/20/2004 | US6722942 Chemical mechanical polishing with electrochemical control |
| 04/15/2004 | US20040072445 Effective method to improve surface finish in electrochemically assisted CMP |
| 04/14/2004 | EP1406742A2 Method for working nut screw for ball screw |
| 04/08/2004 | US20040067718 Polishing apparatus |
| 03/25/2004 | WO2004024394A1 Control of removal profile in electrochemically assisted cmp |
| 03/25/2004 | US20040056003 Edm apparatus and method incorporating combined electro-erosion and mechanical sawing features |
| 03/23/2004 | US6709565 For planarizing metal surfaces having low aspect ratio recesses or trenches as well as raised regions; fluid exchange rate changes with elevation |
| 03/18/2004 | US20040053560 Control of removal profile in electrochemically assisted CMP |
| 03/18/2004 | US20040053512 Process control in electrochemically assisted planarization |
| 03/18/2004 | US20040053499 Method and composition for polishing a substrate |
| 03/17/2004 | EP1397828A1 Electrolytic processing device and substrate processing apparatus |
| 03/11/2004 | WO2004020148A1 Method and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
| 03/04/2004 | US20040043608 Method for manufacturing semiconductor device and apparatus for manufacturing thereof |
| 03/04/2004 | US20040043582 Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates |
| 03/04/2004 | US20040040864 Using rotating, electroconductive superabrasive grindstone; supplying direct current voltage |
| 03/04/2004 | US20040040853 Systems and methods for the electrolytic removal of metals from substrates |
| 02/10/2004 | US6689258 Electrochemically generated reactants for chemical mechanical planarization |
| 02/05/2004 | US20040023610 Polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The |
| 02/05/2004 | US20040023495 Contacts for electrochemical processing |
| 02/05/2004 | US20040020789 For planarizing a substrate surface |
| 02/05/2004 | US20040020788 For electrochemical mechanical polishing and/or electropolishing |
| 02/04/2004 | EP1386695A2 Conductive polishing article for electrochemical mechanical polishing |
| 01/29/2004 | WO2004010477A2 Adaptive electropolishing using thickness measurements and removal of barrier and sacrificial layers |
| 01/29/2004 | CA2491951A1 Adaptive electropolishing using thickness measurements and removal of barrier and sacrificial layers |
| 01/21/2004 | EP1381491A2 Conductive polishing article for electrochemical mechanical polishing |
| 01/20/2004 | US6679985 Electrolytically machining a tool fed by a three-dimensional tool feeder which can accurately feed a tool in three dimensions |
| 01/15/2004 | US20040009668 Process for planarizing upper surface of damascene wiring structure for integrated circuit structures |
| 01/15/2004 | US20040007478 Electroetching system and process |
| 01/13/2004 | US6676822 Method for electro chemical mechanical deposition |
| 01/08/2004 | WO2002041369A3 Electropolishing and chemical mechanical planarization |
| 12/25/2003 | US20030234184 Method and composition for polishing a substrate |
| 12/24/2003 | CN1463467A Electrolytic processing device and substrate processing appts. |
| 12/18/2003 | WO2003009361A3 Planar metal electroprocessing |
| 12/11/2003 | US20030226764 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
| 12/10/2003 | EP1368826A2 Planarization of substrates using electrochemical mechanical polishing |
| 12/04/2003 | WO2003099519A1 Polishing pad for electrochemical-mechanical polishing and methods to manufacture it |
| 11/27/2003 | WO2003098676A1 Substrate processing apparatus and substrate processing method |
| 11/27/2003 | WO2003098673A1 Polishing method and polishing system, and method for fabricating semiconductor device |