Patents for B23H 5 - Combined machining (1,281)
06/2006
06/27/2006US7067048 Method to improve the control of electro-polishing by use of a plating electrode an electrolyte bath
06/27/2006US7066800 Conductive polishing article for electrochemical mechanical polishing
06/22/2006WO2006065436A2 Gear surface treatment procedure
06/22/2006US20060131185 Gear surface treatment procedure
06/22/2006US20060131184 Electrochemical machining in which the linear oscillation of the electrode acting as a tool is superimposed by a circular oscillation, enabling the electrode to turn into the workpiece conformally with its shape; further forming by circular oscillation with circular feed in the and/or the other direction
06/21/2006EP1672101A1 Process for the electrochemical removal of refractory metals or their alloys and use of a solution for this process
06/15/2006US20060124474 Method and apparatus for local polishing control
06/14/2006DE102005058934A1 Verfahren und Vorrichtung für das ELID-Schleifen des Düsentyps Method and apparatus for the ELID grinding of the nozzle type
06/14/2006CN2787355Y Electrolytic machinery combined cutter for ultra-thick metal material
06/14/2006CN1785566A Electric spark-mechanical compound shaping method of metal bindnig agent extra hard abradant sand wheel
06/13/2006US7059948 Articles for polishing semiconductor substrates
05/2006
05/31/2006EP1381491B1 Conductive polishing article for electrochemical mechanical polishing
05/11/2006WO2005092010A3 Chemical mechanical polishing retaining ring
05/11/2006WO2005090648A3 Electrolytic processing apparatus and electrolytic processing method
05/10/2006CN1771355A Method and apparatus for local polishing control
05/02/2006US7037414 Photoelectrolysis of water using proton exchange membranes
04/2006
04/27/2006WO2006043688A1 Method of processing electrically conductive workpiece and combined processing apparatus
04/26/2006EP1648658A2 Cell, system and article for electrochemical mechanical processing (ecmp)
04/25/2006US7033464 Apparatus for electrochemically depositing a material onto a workpiece surface
04/20/2006US20060081460 Method and apparatus for electrochemical planarization of a workpiece
04/18/2006US7029365 Pad assembly for electrochemical mechanical processing
04/13/2006WO2006039627A2 Active matrix electrochemical machining apparatus and method
04/13/2006CA2582147A1 Active matrix electrochemical machining apparatus and method
04/11/2006US7025861 Contact plating apparatus
04/11/2006US7025860 Method and apparatus for the electrochemical deposition and removal of a material on a workpiece surface
04/06/2006WO2006036412A1 Endpoint adjustment in electroprocessing
04/06/2006US20060070887 Arrayed multi-electrode electrochemical machining apparatus and shaping an infinite variety of part surfaces fromstatic, generically-shaped cathode array.eliminate sacrificial stock for less energy/material consumption and higher accuracy; programmable control of the part surface profile by a computer
04/04/2006US7021991 Polishing apparatus
03/2006
03/30/2006US20060065548 Method for removing lead sulfate film formed in lead-acid battery
03/30/2006US20060065518 Method and apparatus for polishing an internal surface of an aluminum extrusion hollow shape
03/29/2006EP1640113A1 Conductive polishing article for electrochemical mechanical polishing
03/29/2006EP1638733A1 Polishing pad for electrochemical-mechanical polishing
03/22/2006EP1637265A1 Rotation surface-reducing head, electrolytic surface-reducing device, and electrolytic surface-reducing method
02/2006
02/07/2006US6995089 Method to remove copper without pattern density effect
02/07/2006US6994610 Electrolytic integrated polishing apparatus that integrates elution by electrolyte and abrasion by a grindstone and enables high precision polishing of the internal surface of a long sized cylindrical aluminum tube such as hydraulic cylinder
01/2006
01/31/2006US6991528 Polishing article for processing a substrate comprises a fabric layer having a conductive layer disposed thereover. The conductive layer has an exposed surface adapted to polish a substrate. The fabric layer may be woven or non-woven. The
01/31/2006US6991526 Control of removal profile in electrochemically assisted CMP
01/24/2006US6988942 Conductive polishing article for electrochemical mechanical polishing
01/18/2006CN2751972Y Polishing product for processing base material
01/12/2006US20060006074 Method and composition for polishing a substrate
01/11/2006EP1613794A2 Algorithm for real-time process control of electro-polishing
12/2005
12/29/2005WO2005123317A1 Edge bead removal by an electro polishing process
12/29/2005US20050284770 A multilayer pad having a ring-shaped upper polish layer and replaceable conductive layer; attaching to exterior power source; controlling the rate of copper material removal from printed circuits, determining each polishing time in each zone; tools for making semiconductors
12/29/2005DE102005024406A1 Verfahren und System zur Herstellung von Komponenten A method and system for the production of components
12/27/2005US6979248 Conductive polishing article for electrochemical mechanical polishing
12/22/2005US20050282322 Retaining ring with conductive portion
12/20/2005US6977036 includes a conductive polishing pad and an electrode having a spacer disposed therebetween; chemical mechanical polishing
12/15/2005US20050274626 Polishing pad and polishing method
12/15/2005US20050273999 Method and system for fabricating components
12/14/2005CN1706580A Method and system for fabricating components
12/13/2005US6974525 Method and apparatus for electrochemical planarization of a workpiece
12/08/2005US20050269212 Method of making rolling electrical contact to wafer front surface
12/01/2005US20050263406 Polishing pad for electrochemical mechanical polishing
11/2005
11/30/2005CN1702840A Polishing pad for electrochemical mechanical polishing
11/23/2005CN1701136A Low-force electrochemical mechanical processing method and apparatus
11/23/2005CN1700970A Control of removal profile in electrochemically assisted CMP
11/16/2005EP1594656A1 Polishing article for electro-chemical mechanical polishing
11/10/2005WO2005105356A2 Electrochemical mechanical planarization process and apparatus
11/10/2005WO2005083159A3 Apparatus adapted for membrane mediated electropolishing
11/08/2005US6962524 Conductive polishing article for electrochemical mechanical polishing
11/03/2005US20050245086 Adaptive electropolishing using thickness measurement and removal of barrier and sacrificial layers
11/02/2005CN2737501Y Polising product for processing base material
10/2005
10/27/2005US20050239283 Polishing method, polishing apparatus, and method of manufacturing semiconductor device
10/26/2005CN1688411A Methods and apparatus for electromechanically and/or electrochemically removing conductive material from a microelectronic substrate
10/26/2005CN1686652A Composite processing technology of fine injection type hole
10/25/2005US6957511 Single-step electromechanical mechanical polishing on Ni-P plated discs
10/20/2005US20050233578 Method and composition for polishing a substrate
10/13/2005WO2005042810A3 Membrane -mediated electropolishing
10/13/2005US20050227483 Planar metal electroprocessing
10/13/2005US20050224368 Polishing system and polishing method
10/06/2005WO2005093135A1 Electrolytic processing apparatus
10/06/2005WO2005092010A2 Chemical mechanical polishing retaining ring
10/06/2005US20050221608 Method for manufacturing semiconductor device and apparatus for manufacturing thereof
10/06/2005US20050218010 Chelating agents, corrosion inhibitors, a suppresor, a solvent, a passivating polymer, and inorganic acid based electrolyte; minimal damage to the substrate during planarization; microelectronics
10/06/2005US20050218009 Electrochemical planarization system and method of electrochemical planarization
10/05/2005CN2730554Y Polishing-part for polishing substrate
10/05/2005CN2730553Y Polishing-part for electrochemical mechanical polishing
09/2005
09/29/2005WO2005090648A2 Electrolytic processing apparatus and electrolytic processing method
09/29/2005US20050215181 Chemical mechanical polishing retaining ring, apparatuses and methods incorporating same
09/28/2005CN1220798C Pad designs and structures for universal material working equipment
09/22/2005US20050205432 Method, an apparatus, a control system and a computer program to perform an automatic removal of cathode depositions during a bipolar electrochemical machining
09/15/2005US20050199511 Semiconductor electrochemical etching processes employing closed loop control
09/14/2005EP1573783A2 Adaptive electropolishing using thickness measurements and removal of barrier and sacrificial layers
09/09/2005WO2005083159A2 Apparatus adapted for membrane mediated electropolishing
09/09/2005WO2005082574A1 Methods and apparatuses for electrochemical-mechanical polishing
09/08/2005US20050196963 Methods and apparatuses for electrochemical-mechanical polishing
09/06/2005US6939457 Using rotating, electroconductive superabrasive grindstone; supplying direct current voltage
08/2005
08/25/2005US20050184596 Safety system for power equipment
08/18/2005US20050178743 A multilayer pad having a plurality of independent electrical biasable zones, attaching to exterior power source from one layer; controlling the rate of copper material removal from printed circuits, determining each polishing time in each zone; electrical apparatus for making semiconductors
08/18/2005US20050178672 electropolishing a metallic film formed on a substrate by passing an electric current to the metallic film; current passing electrode is used in non-contact state and no pressure is exerted on inter-layer insulation film at the time of passing the electric current, breakage of inter-layer insulation film
08/17/2005CN1654148A Electric spark machining liquid storage case device for treatment fluid containing addition agent
08/11/2005WO2005008806A3 Photoelectrolysis of water using proton exchange membranes
08/11/2005US20050173259 Endpoint system for electro-chemical mechanical polishing
08/11/2005US20050172487 Method for working nut screw for ball screw
08/10/2005CN1653597A Substrate processing apparatus and substrate processing method
08/10/2005CN1652898A Process control in electro-chemical mechanical polishing
08/10/2005CN1214133C Method and apparatus for electrochemical mechanical deposition
07/2005
07/28/2005US20050161341 Electrochemical machining, applying different voltage potentials to different electrodes; supply a higher potential to the substrate edge, removing the copper conductive layer from the substrate edge; making semiconductor, integrated circuits
07/27/2005CN1646649A Method and composition for polishing a substrate
07/27/2005CN1646264A Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
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