Patents for B23H 5 - Combined machining (1,281)
10/2002
10/24/2002US20020153097 Electroetching process and system
10/17/2002US20020148732 Method and apparatus for electrochemically depositing a material onto a workpiece surface
10/15/2002US6464855 Method and apparatus for electrochemical planarization of a workpiece
09/2002
09/26/2002WO2002075804A2 Planarization of substrates using electrochemical mechanical polishing
09/24/2002US6454916 Selective electroplating with direct contact chemical polishing
09/19/2002US20020130049 Forming a passivation layer on a substrate surface; polishing substrate in an electrolyte solution; applying an anodic bias to substrate surface; removing material from portion of substrate surface
09/19/2002US20020130034 Pad designs and structures for a versatile materials processing apparatus
09/03/2002US6444994 Apparatus and method for processing the components of a neutron lens
08/2002
08/29/2002US20020119286 Conductive polishing article for electrochemical mechanical polishing
08/27/2002US6440295 Method for electropolishing metal on semiconductor devices
08/22/2002WO2002064314A1 Method and apparatus for electrochemical planarization of a workpiece
08/15/2002US20020111121 Method and apparatus for electrochemical-mechanical planarization
08/15/2002US20020110502 Method and device for electro-chemical discharge processing with self-acting bubble layer
08/15/2002US20020108864 Processing nonconductive materials; bubbles are created by electrolysis to form insulating bubble layers; applying high voltage across the electrodes causes air molecules ionic breakdown in the bubble layers, generating arc discharge
08/15/2002US20020108861 Platen of conductive material is disposed proximate to the polishing pad and is configured to have a negative charge during planarization process; demetallization of a workpiece surface such as semiconductor
08/08/2002US20020104764 Applying a voltage across a polishing pad and the substrate, while an electropolishing electrolyte is dispensed at an interface of the substrate and the polishing pad, and while pooling the electrolyte about the substrate
08/01/2002US20020102853 Articles for polishing semiconductor substrates
07/2002
07/25/2002US20020098698 Method for polishing semiconductor device
07/16/2002US6420265 Method for polishing semiconductor device
07/11/2002US20020090884 Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing
07/04/2002US20020086538 Method for polishing semiconductor device
07/02/2002US6413403 Controlling electrolyte flow and distribution of electric, magnetic or electromagnetic field; depositing, removing, polishing, and/or modifying conductive material; uniformity; chemical mechanical polishing
07/02/2002US6413388 Pad designs and structures for a versatile materials processing apparatus
06/2002
06/20/2002US20020074238 For planarizing metal surfaces having low aspect ratio recesses or trenches as well as raised regions; fluid exchange rate changes with elevation
06/13/2002US20020072309 Polishing method and polishing apparatus
06/13/2002US20020070126 Polishing method, polishing apparatus, plating method, and plating apparatus
06/11/2002US6402925 Prevent accumulation by polishing
06/05/2002CN1351916A Electrochemical mechanical and optical finishing process for rolling bearing rollway nest
05/2002
05/28/2002US6395152 Methods and apparatus for electropolishing metal interconnections on semiconductor devices
05/23/2002WO2002041369A2 Electropolishing and chemical mechanical planarization
05/02/2002US20020052126 Electro-mechanical polishing of platinum container structure
04/2002
04/30/2002US6379223 Method and apparatus for electrochemical-mechanical planarization
04/23/2002US6376793 Method and device for electric discharge surface treatment using a wire electrode
04/11/2002WO2002029859A2 Method and apparatus for electrochemical planarization of a workpiece
04/11/2002WO2002028597A1 Method and apparatus for electrochemical planarization of a workpiece
02/2002
02/28/2002US20020025763 Methods and apparatus for electrical, mechanical and/or chemical removal of conductive material from a microelectronic substrate
02/28/2002US20020025760 Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate
02/28/2002US20020025759 Microelectronic substrate having conductive material with blunt cornered apertures, and associated methods for removing conductive material
02/21/2002US20020022437 Working method for curved surface of a work and an apparatus thereof
02/19/2002US6348668 Method and apparatus for treating surface of tool
02/13/2002CN2476377Y Mirror bearing electrolytic grinding processing equipment
02/06/2002CN1078832C Method and apparatus for electrolytic dressing
01/2002
01/24/2002WO2002006008A1 Contact-discharge truing/dressing method and device therefor
01/08/2002US6336855 Grindstone for ELID grinding and apparatus for ELID surface grinding
01/02/2002CN1329681A Method and apparatus for electrochemical mechanical deposition
11/2001
11/27/2001US6322426 Method for mirror process of external surface of long sized metal
11/27/2001US6322424 Electrolytic integrated polishing method for metal workpieces using special abrasive materials
11/22/2001US20010042690 Method and apparatus for electroplating and electropolishing
11/13/2001US6315883 Providing partially fabricated integrated circuit having dielectric layer with trenches; forming conformal layer of conductive material over dielectric layer, selectively applying diffusion barrier film to recesses; electropolishing
11/01/2001US20010036746 Methods of producing and polishing semiconductor device and polishing apparatus
10/2001
10/17/2001CN1318207A Methods and appts. for electropolishing metal intennections on semiconductor devices
10/11/2001US20010029098 Process for fabricating semiconductor device and apparatus for fabricating semiconductor device
10/03/2001CN1315235A Magnetically grinding method for machining micro hole or micro part
09/2001
09/27/2001WO2001071066A1 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating
09/27/2001US20010024934 Method of grinding an axially asymmetric aspherical mirror
09/27/2001US20010024878 Flat soft magnetic powder with strain removed and binder which includes chlorinated polyethylene and a vinyl chloride resin; electromagnetic interference supression; reducing permeability of radiation noise
09/19/2001EP1134056A1 Removable electrode
09/13/2001US20010021629 Apparatus and method for processing micro-V grooves
09/13/2001US20010020585 Removable electrode
09/11/2001US6287449 Method of electrolytic texturing and electrolytic liquid slurry
09/05/2001EP1129817A2 Apparatus and method for processing micro-v grooves
09/05/2001EP1129237A2 Method and apparatus for electrochemical mechanical deposition
09/05/2001CN1311079A Method for grinding non-axial-symmetry and non-ball-surface mirror
08/2001
08/30/2001WO2001063019A1 Pad designs and structures with improved fluid distribution
08/30/2001WO2001063018A1 Pad designs and structures for a versatile materials processing apparatus
07/2001
07/04/2001CN1301609A Electric spark wire-electrode cutting device with attached supersonic vibration
06/2001
06/05/2001US6242343 Process for fabricating semiconductor device and apparatus for fabricating semiconductor device
05/2001
05/31/2001US20010002001 Part fabricating method and part fabricating apparatus
05/30/2001EP1103346A2 Method and apparatus for electrochemical-mechanical planarization
05/25/2001WO2001036138A1 Combined electrolytic polishing and abrasive super-finishing process
05/22/2001US6234870 Serial intelligent electro-chemical-mechanical wafer processor
05/09/2001EP1097474A1 Methods and apparatus for electropolishing metal interconnections on semiconductor devices
05/08/2001US6228445 Austenitic stainless steel article having a passivated surface layer
05/03/2001DE10042613A1 Electrolysis dressing for honing grindstone, involves impressing preset voltage between grinding stone, separated from grindstone processing surface and electrode with simultaneously supply of electroconductive fluid
05/01/2001US6224972 Method of making a PVD-coated HSS drill
04/2001
04/26/2001DE10042612A1 Internal grinding method for fuel injection nozzle, involves simultaneous grinding and pressing of non-conductive film provided on bonded surface of grinding wheel during contact with workpiece
04/24/2001US6221228 Maching and molding, electrodeposition of metal and removal
04/10/2001US6213843 Method for grinding surfaces of workpieces
03/2001
03/07/2001EP1080836A2 Apparatus and method for processing the components of a neutron lens
02/2001
02/28/2001EP1078714A2 Method and apparatus for grinding curved surfaces
02/14/2001CN2418988Y High performance cutting machine
01/2001
01/23/2001US6176992 Method and apparatus for electro-chemical mechanical deposition
01/17/2001CN1060710C Composite discharging-mechanical grinding method for external circle of sheet workpiece
01/10/2001CN1060423C Repairing method for tools and dies and repairing machine
01/09/2001US6171467 Silicon wafers in electrolytic baths, applying voltage and planarizing
12/2000
12/05/2000US6156188 Using the main shaft of an electrodischarge machining machine to mount thereon a probe for effecting the drilling operation of a pcb board; upon completion of the drilling operation, the probe is severed and then fastened with the pcb board
12/05/2000US6156187 Positively charging and rotating a metallic tube about the axis thereof and supporting both ends of the tube, pressing more than one grindstone with a constant pressure against the external surface of the metallic tube from opposite directions
11/2000
11/09/2000DE19917963A1 Creating micro bores by spark discharge, using electrolyte flow to remove eroded material
10/2000
10/31/2000CA2088686C Orbital electrochemical machining
10/18/2000EP1044767A2 Electrolytic in-process dressing apparatus
10/14/2000CA2305832A1 Table-top elid processing apparatus
10/12/2000WO2000026443A3 Method and apparatus for electrochemical mechanical deposition
10/11/2000EP1043421A2 Austenitic stainless steel article having a passivated surface layer
09/2000
09/19/2000US6121152 Method and apparatus for planarization of metallized semiconductor wafers using a bipolar electrode assembly
08/2000
08/02/2000CN1261833A Method and device for treating tool surface
06/2000
06/13/2000US6074284 Combination electrolytic polishing and abrasive super-finishing method
05/2000
05/17/2000EP1000694A2 Electrolytic integrated polishing method for metal workpieces using special abrasive materials
05/11/2000WO2000026443A2 Method and apparatus for electrochemical mechanical deposition
05/09/2000CA2286990A1 Electrolytic integrated polishing method for metal workpieces using special abrasive materials
04/2000
04/19/2000EP0993905A2 Method for mirror process of external surface of long sized metal
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