Patents for B23H 5 - Combined machining (1,281) |
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11/27/2003 | US20030220053 Apparatus for electrochemical processing |
11/27/2003 | US20030220052 Electrochemical planarization of metal feature surfaces |
11/27/2003 | US20030217932 Device providing electrical contact to the surface of a semiconductor workpiece during processing |
11/27/2003 | US20030217927 Long-life workpiece surface influencing device structure and manufacturing method |
11/26/2003 | CN1458671A Conductive polishing article for electrochemical mechanical polishing |
11/25/2003 | US6653226 Method for electrochemical planarization of metal surfaces |
11/20/2003 | US20030216045 Hydrogen bubble reduction on the cathode using double-cell designs |
11/20/2003 | US20030213703 Method and apparatus for substrate polishing |
11/13/2003 | WO2003092945A1 Electrolytic polishing liquid, electrolytic polishing method and method for fabricating semiconductor device |
11/13/2003 | WO2003092944A1 Polishing method and polishing system, and method for fabricating semiconductor device |
11/13/2003 | US20030209448 Forming grooves; fluid flow; polishing surfaces |
11/13/2003 | US20030209445 Forming electrical contactors; uniform electrodeposition; integrated circuits |
11/13/2003 | US20030209425 Device providing electrical contact to the surface of a semiconductor workpiece during processing |
11/12/2003 | EP1361023A2 Polishing articles for electrochemical mechanical polishing of substrates |
11/06/2003 | WO2003090965A1 Polishing method, polishing device, and method of manufacturing semiconductor equipment |
11/06/2003 | WO2003090964A1 Polishing system and polishing method |
11/06/2003 | WO2003090963A1 A method, an apparatus, a control system and a computer program to perform an automatic removal of cathode depositions during a bipolar electrochemical machining |
11/06/2003 | WO2003090962A1 A method, an apparatus,a control system and a computer program to perform an automatic removal of cathode depositions during a bi polar electrochemical machining |
10/23/2003 | WO2003088352A1 Electrochemical planarization of metal feature surfaces |
10/16/2003 | WO2003060962A3 Electrolyte composition and treatment for electrolytic chemical mechanical polishing |
10/02/2003 | US20030183530 Alternately electrodepositing and electro- mechanically polishing to selectively fill a semiconductor feature with metal including a) providing an anode assembly and a semiconductor wafer disposed in spaced apart relation |
09/25/2003 | WO2002029859A3 Method and apparatus for electrochemical planarization of a workpiece |
09/25/2003 | US20030178320 Comprises acid (phosphoric, sulfuric, perchloric, and/or acetic) based electrolytes, chelate agent (ethylenediamine), and corrosion inhibitor (benzotriazole) |
09/25/2003 | US20030178319 For removing conductors of the top conductive surfaces of workpieces (copper) by applying etching solution in presence of current, forming easily removable intermediate (copper chloride) |
09/18/2003 | WO2003076134A1 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
09/18/2003 | US20030173230 Conductive polishing pad and electrode having membrane disposed therebetween; membrane orientated relative to conductive pad in manner that facilitates removal of entrained gas from electrolyte flowing towards conductive pad |
09/16/2003 | US6620336 Polishing pad, polishing apparatus and polishing method |
09/11/2003 | US20030168351 Method and apparatus for planar material removal technique using multi-phase process environment |
09/10/2003 | CN1441714A Contact-discharge truing/dressing method and device therefor |
09/04/2003 | WO2003072672A1 Method and composition for polishing a substrate |
09/03/2003 | CN2569961Y Ultra-hard material electric spark machinery composite processed grinding wheel |
08/12/2003 | US6605539 Patterned surface then is processed into a useful feature such as a bottom electrode for a DRAM capacitor. |
08/07/2003 | WO2003065432A1 Electrolytic processing apparatus and substrate processing apparatus and method |
08/06/2003 | CN1434882A Pad designs and structures for universal material working equipment |
07/31/2003 | WO2003061905A1 Process control in electro-chemical mechanical polishing |
07/24/2003 | WO2003060962A2 Electrolyte composition and treatment for electrolytic chemical mechanical polishing |
07/24/2003 | WO2003017330A3 Forming a semiconductor structure using a combination of planarizing methods and electropolishing |
07/24/2003 | US20030136684 Positioning a substrate with a pad partially submersed in the electrolyte, monitoring an electrical signal by a computer |
07/24/2003 | US20030136668 Electrolytic processing device and substrate processing apparatus |
07/22/2003 | US6596152 Processing nonconductive materials; bubbles are created by electrolysis to form insulating bubble layers; applying high voltage across the electrodes causes air molecules ionic breakdown in the bubble layers, generating arc discharge |
07/17/2003 | WO2003057948A1 Electrolytic processing apparatus and method |
07/17/2003 | US20030132120 Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface |
07/17/2003 | US20030132103 Electrolytic processing device and substrate processing apparatus |
07/15/2003 | US6592742 The polishing electrolyte for polishing a metal layer comprises one or more surfactants selected from the group of benzopyrans, thioureas and aliphatic ethers; formation of metal layers used in integrated circuits |
07/10/2003 | US20030129927 Methods and apparatus for selectively removing conductive material from a microelectronic substrate |
07/10/2003 | US20030127320 Apparatus for electrochemically depositing a material onto a workpiece surface |
07/08/2003 | US6589402 Part fabricating apparatus |
07/03/2003 | WO2003054255A1 Electrolytic processing apparatus and method |
07/03/2003 | WO2003008138A3 Method for working nut screw for ball screw |
06/26/2003 | WO2002075804A3 Planarization of substrates using electrochemical mechanical polishing |
06/26/2003 | US20030119311 Planar metal electroprocessing |
06/26/2003 | US20030116446 Mixture containing ammonium hydrogen phosphates |
06/26/2003 | US20030116445 Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP |
06/25/2003 | CN1112272C Electrochemical mechanical brightening processing method for rolling bearing rolling groove |
06/19/2003 | US20030114087 Method and apparatus for face-up substrate polishing |
06/19/2003 | US20030114004 Methods of producing and polishing semiconductor device and polishing apparatus |
06/12/2003 | US20030109198 Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium |
06/10/2003 | US6576552 Method for polishing semiconductor device |
06/05/2003 | US20030104762 Polishing method and electropolishing apparatus |
06/04/2003 | EP1259661A4 Pad designs and structures for a versatile materials processing apparatus |
06/03/2003 | US6572755 Pressing workpiece against polishing surface while causing relative motion between workpiece and polishing surface, supplying an electrolyte solution to polishing surface, applying a voltage between both surfaces |
05/14/2003 | CN1418264A Device providing electrical contact to surface of semiconductor workpiece during metal plating |
05/02/2003 | EP1306164A1 Contact-discharge truing/dressing method and device therefor |
04/24/2003 | WO2002085570A3 Conductive polishing article for electrochemical mechanical polishing |
04/23/2003 | CN1411955A Polishing equipment |
04/22/2003 | US6551934 Process for fabricating semiconductor device and apparatus for fabricating semiconductor device |
04/17/2003 | US20030070930 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating and method of providing such contact |
04/16/2003 | CN1411039A Electrolysis polishing method |
04/10/2003 | WO2003029531A2 Electrolytic processing apparatus and method |
04/10/2003 | US20030068964 Polishing apparatus |
04/10/2003 | US20030066760 Controlling current density |
04/03/2003 | WO2003028048A2 Low-force electrochemical mechanical processing method and apparatus |
04/03/2003 | US20030064669 Low-force electrochemical mechanical processing method and apparatus |
04/02/2003 | CN1104299C Method and device for treating tool surface |
03/27/2003 | US20030057097 Method and apparatus for forming metal layers |
03/25/2003 | US6537138 Method of grinding an axially asymmetric aspherical mirror |
03/20/2003 | US20030054729 Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
03/12/2003 | EP1291131A1 Device for machining a workpiece alternately with a grinding wheel or an electroerosion eletrode |
03/11/2003 | US6531037 Removable electrode |
03/06/2003 | US20030045222 Metal-less bond grinding stone, and electrolytic dressing grinding method and apparatus using the grinding stone |
03/05/2003 | EP1287949A2 Metal-less bond grinding stone, and electrolytic dressing grinding method and apparatus using the grinding stone |
02/27/2003 | WO2003017330A2 Forming a semiconductor structure using a combination of planarizing methods and electropolishing |
02/27/2003 | CA2456225A1 Forming a semiconductor structure using a combination of planarizing methods and electropolishing |
02/12/2003 | CN1101291C Processing solution treatment device for electro-discharge machining device |
01/30/2003 | WO2003009361A2 Planar metal electroprocessing |
01/30/2003 | WO2003008138A2 Method for working nut screw for ball screw |
01/23/2003 | US20030017789 Working method for curved surface of a work and an apparatus thereof |
01/22/2003 | CN1099335C Electric spark wire-electrode cutting device with attached supersonic vibration |
01/16/2003 | US20030010648 Electrochemically assisted chemical polish |
01/07/2003 | US6503387 Method and device for electro-chemical discharge processing with self-acting bubble layer |
01/02/2003 | EP1268881A1 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
12/27/2002 | WO2002103771A1 Electrolytic processing device and substrate processing apparatus |
12/24/2002 | US6497800 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating |
12/03/2002 | US6489243 Method for polishing semiconductor device |
11/27/2002 | EP1259661A1 Pad designs and structures for a versatile materials processing apparatus |
11/21/2002 | US20020170829 Electrochemical discharge machining device and machining method |
11/12/2002 | US6478661 Apparatus and method for processing micro-V grooves |
10/31/2002 | WO2002085570A2 Conductive polishing article for electrochemical mechanical polishing |
10/24/2002 | WO2002084714A2 Method and apparatus for electrochemically depositing a material onto a workpiece surface |
10/24/2002 | US20020153246 Method and apparatus for electropolishing metal interconnections on semiconductor devices |