Patents for B23H 5 - Combined machining (1,281)
11/2003
11/27/2003US20030220053 Apparatus for electrochemical processing
11/27/2003US20030220052 Electrochemical planarization of metal feature surfaces
11/27/2003US20030217932 Device providing electrical contact to the surface of a semiconductor workpiece during processing
11/27/2003US20030217927 Long-life workpiece surface influencing device structure and manufacturing method
11/26/2003CN1458671A Conductive polishing article for electrochemical mechanical polishing
11/25/2003US6653226 Method for electrochemical planarization of metal surfaces
11/20/2003US20030216045 Hydrogen bubble reduction on the cathode using double-cell designs
11/20/2003US20030213703 Method and apparatus for substrate polishing
11/13/2003WO2003092945A1 Electrolytic polishing liquid, electrolytic polishing method and method for fabricating semiconductor device
11/13/2003WO2003092944A1 Polishing method and polishing system, and method for fabricating semiconductor device
11/13/2003US20030209448 Forming grooves; fluid flow; polishing surfaces
11/13/2003US20030209445 Forming electrical contactors; uniform electrodeposition; integrated circuits
11/13/2003US20030209425 Device providing electrical contact to the surface of a semiconductor workpiece during processing
11/12/2003EP1361023A2 Polishing articles for electrochemical mechanical polishing of substrates
11/06/2003WO2003090965A1 Polishing method, polishing device, and method of manufacturing semiconductor equipment
11/06/2003WO2003090964A1 Polishing system and polishing method
11/06/2003WO2003090963A1 A method, an apparatus, a control system and a computer program to perform an automatic removal of cathode depositions during a bipolar electrochemical machining
11/06/2003WO2003090962A1 A method, an apparatus,a control system and a computer program to perform an automatic removal of cathode depositions during a bi polar electrochemical machining
10/2003
10/23/2003WO2003088352A1 Electrochemical planarization of metal feature surfaces
10/16/2003WO2003060962A3 Electrolyte composition and treatment for electrolytic chemical mechanical polishing
10/02/2003US20030183530 Alternately electrodepositing and electro- mechanically polishing to selectively fill a semiconductor feature with metal including a) providing an anode assembly and a semiconductor wafer disposed in spaced apart relation
09/2003
09/25/2003WO2002029859A3 Method and apparatus for electrochemical planarization of a workpiece
09/25/2003US20030178320 Comprises acid (phosphoric, sulfuric, perchloric, and/or acetic) based electrolytes, chelate agent (ethylenediamine), and corrosion inhibitor (benzotriazole)
09/25/2003US20030178319 For removing conductors of the top conductive surfaces of workpieces (copper) by applying etching solution in presence of current, forming easily removable intermediate (copper chloride)
09/18/2003WO2003076134A1 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces
09/18/2003US20030173230 Conductive polishing pad and electrode having membrane disposed therebetween; membrane orientated relative to conductive pad in manner that facilitates removal of entrained gas from electrolyte flowing towards conductive pad
09/16/2003US6620336 Polishing pad, polishing apparatus and polishing method
09/11/2003US20030168351 Method and apparatus for planar material removal technique using multi-phase process environment
09/10/2003CN1441714A Contact-discharge truing/dressing method and device therefor
09/04/2003WO2003072672A1 Method and composition for polishing a substrate
09/03/2003CN2569961Y Ultra-hard material electric spark machinery composite processed grinding wheel
08/2003
08/12/2003US6605539 Patterned surface then is processed into a useful feature such as a bottom electrode for a DRAM capacitor.
08/07/2003WO2003065432A1 Electrolytic processing apparatus and substrate processing apparatus and method
08/06/2003CN1434882A Pad designs and structures for universal material working equipment
07/2003
07/31/2003WO2003061905A1 Process control in electro-chemical mechanical polishing
07/24/2003WO2003060962A2 Electrolyte composition and treatment for electrolytic chemical mechanical polishing
07/24/2003WO2003017330A3 Forming a semiconductor structure using a combination of planarizing methods and electropolishing
07/24/2003US20030136684 Positioning a substrate with a pad partially submersed in the electrolyte, monitoring an electrical signal by a computer
07/24/2003US20030136668 Electrolytic processing device and substrate processing apparatus
07/22/2003US6596152 Processing nonconductive materials; bubbles are created by electrolysis to form insulating bubble layers; applying high voltage across the electrodes causes air molecules ionic breakdown in the bubble layers, generating arc discharge
07/17/2003WO2003057948A1 Electrolytic processing apparatus and method
07/17/2003US20030132120 Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface
07/17/2003US20030132103 Electrolytic processing device and substrate processing apparatus
07/15/2003US6592742 The polishing electrolyte for polishing a metal layer comprises one or more surfactants selected from the group of benzopyrans, thioureas and aliphatic ethers; formation of metal layers used in integrated circuits
07/10/2003US20030129927 Methods and apparatus for selectively removing conductive material from a microelectronic substrate
07/10/2003US20030127320 Apparatus for electrochemically depositing a material onto a workpiece surface
07/08/2003US6589402 Part fabricating apparatus
07/03/2003WO2003054255A1 Electrolytic processing apparatus and method
07/03/2003WO2003008138A3 Method for working nut screw for ball screw
06/2003
06/26/2003WO2002075804A3 Planarization of substrates using electrochemical mechanical polishing
06/26/2003US20030119311 Planar metal electroprocessing
06/26/2003US20030116446 Mixture containing ammonium hydrogen phosphates
06/26/2003US20030116445 Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
06/25/2003CN1112272C Electrochemical mechanical brightening processing method for rolling bearing rolling groove
06/19/2003US20030114087 Method and apparatus for face-up substrate polishing
06/19/2003US20030114004 Methods of producing and polishing semiconductor device and polishing apparatus
06/12/2003US20030109198 Methods and apparatus for electrically detecting characteristics of a microelectronic substrate and/or polishing medium
06/10/2003US6576552 Method for polishing semiconductor device
06/05/2003US20030104762 Polishing method and electropolishing apparatus
06/04/2003EP1259661A4 Pad designs and structures for a versatile materials processing apparatus
06/03/2003US6572755 Pressing workpiece against polishing surface while causing relative motion between workpiece and polishing surface, supplying an electrolyte solution to polishing surface, applying a voltage between both surfaces
05/2003
05/14/2003CN1418264A Device providing electrical contact to surface of semiconductor workpiece during metal plating
05/02/2003EP1306164A1 Contact-discharge truing/dressing method and device therefor
04/2003
04/24/2003WO2002085570A3 Conductive polishing article for electrochemical mechanical polishing
04/23/2003CN1411955A Polishing equipment
04/22/2003US6551934 Process for fabricating semiconductor device and apparatus for fabricating semiconductor device
04/17/2003US20030070930 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating and method of providing such contact
04/16/2003CN1411039A Electrolysis polishing method
04/10/2003WO2003029531A2 Electrolytic processing apparatus and method
04/10/2003US20030068964 Polishing apparatus
04/10/2003US20030066760 Controlling current density
04/03/2003WO2003028048A2 Low-force electrochemical mechanical processing method and apparatus
04/03/2003US20030064669 Low-force electrochemical mechanical processing method and apparatus
04/02/2003CN1104299C Method and device for treating tool surface
03/2003
03/27/2003US20030057097 Method and apparatus for forming metal layers
03/25/2003US6537138 Method of grinding an axially asymmetric aspherical mirror
03/20/2003US20030054729 Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate
03/12/2003EP1291131A1 Device for machining a workpiece alternately with a grinding wheel or an electroerosion eletrode
03/11/2003US6531037 Removable electrode
03/06/2003US20030045222 Metal-less bond grinding stone, and electrolytic dressing grinding method and apparatus using the grinding stone
03/05/2003EP1287949A2 Metal-less bond grinding stone, and electrolytic dressing grinding method and apparatus using the grinding stone
02/2003
02/27/2003WO2003017330A2 Forming a semiconductor structure using a combination of planarizing methods and electropolishing
02/27/2003CA2456225A1 Forming a semiconductor structure using a combination of planarizing methods and electropolishing
02/12/2003CN1101291C Processing solution treatment device for electro-discharge machining device
01/2003
01/30/2003WO2003009361A2 Planar metal electroprocessing
01/30/2003WO2003008138A2 Method for working nut screw for ball screw
01/23/2003US20030017789 Working method for curved surface of a work and an apparatus thereof
01/22/2003CN1099335C Electric spark wire-electrode cutting device with attached supersonic vibration
01/16/2003US20030010648 Electrochemically assisted chemical polish
01/07/2003US6503387 Method and device for electro-chemical discharge processing with self-acting bubble layer
01/02/2003EP1268881A1 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating
12/2002
12/27/2002WO2002103771A1 Electrolytic processing device and substrate processing apparatus
12/24/2002US6497800 Device providing electrical contact to the surface of a semiconductor workpiece during metal plating
12/03/2002US6489243 Method for polishing semiconductor device
11/2002
11/27/2002EP1259661A1 Pad designs and structures for a versatile materials processing apparatus
11/21/2002US20020170829 Electrochemical discharge machining device and machining method
11/12/2002US6478661 Apparatus and method for processing micro-V grooves
10/2002
10/31/2002WO2002085570A2 Conductive polishing article for electrochemical mechanical polishing
10/24/2002WO2002084714A2 Method and apparatus for electrochemically depositing a material onto a workpiece surface
10/24/2002US20020153246 Method and apparatus for electropolishing metal interconnections on semiconductor devices
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