| Patents for B23H 5 - Combined machining (1,281) |
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| 07/27/2005 | CN1212651C Electrolysis polishing method |
| 07/21/2005 | WO2004078411A3 Method and apparatus for local polishing control |
| 07/21/2005 | US20050155868 Electrolytic processing apparatus and electrolytic processing method |
| 07/14/2005 | US20050150776 Electrolytic etching method and apparatus |
| 07/07/2005 | WO2005061177A1 Pad assembly for electrochemical mechanical processing |
| 07/07/2005 | WO2004111314B1 Algorithm for real-time process control of electro-polishing |
| 07/07/2005 | US20050145507 Amines, amides, carboxylate, dicarboxylate or tri-carboxylate groups containing chelating agents, a substituted or unsubstituted benzotriazole or a polymeric corrosion resistance agent, sodium hydroxide or ammonium hydroxide as pH adjuster, a solvent |
| 07/07/2005 | US20050145489 Electroetching process and system |
| 06/30/2005 | WO2005059970A2 Controlling removal rate uniformity of an electropolishing process in integrated circuit fabrication |
| 06/30/2005 | WO2005058543A1 Method of electrochemical chemical mechanical planarization process |
| 06/23/2005 | US20050133380 Electroetching methods and systems using chemical and mechanical influence |
| 06/23/2005 | US20050133363 Conductive polishing article for electrochemical mechanical polishing |
| 06/23/2005 | US20050133277 Superhard mill cutters and related methods |
| 06/21/2005 | US6908860 Method for manufacturing semiconductor device and apparatus for manufacturing thereof |
| 06/09/2005 | WO2004111314A3 Algorithm for real-time process control of electro-polishing |
| 06/09/2005 | WO2004108358A3 Conductive polishing article for electrochemical mechanical polishing |
| 06/08/2005 | EP1536919A1 Method and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
| 06/02/2005 | US20050115838 Electrolytic processing apparatus and method |
| 05/31/2005 | US6899804 Electrolyte composition and treatment for electrolytic chemical mechanical polishing |
| 05/26/2005 | WO2005046872A1 Integrated circuit interconnect fabrication systems and methods |
| 05/17/2005 | US6893328 Conductive polishing pad with anode and cathode |
| 05/12/2005 | WO2005042810A2 Membrane -mediated electropolishing |
| 05/12/2005 | US20050101138 System and method for applying constant pressure during electroplating and electropolishing |
| 05/12/2005 | US20050098446 comprising backing layers secured to the polishing layers, having compressibility and hardness, used for chemical mechanical polishing |
| 05/05/2005 | US20050092621 Improved contact element with holes formed through the pad body, filled with a conductive material, exposing the electrode to the processing surface; remove copper material from printed circuits surface; electrical apparatus |
| 05/05/2005 | US20050092620 Incrementally introducing abrasive particles; accurate removal of conductive barrier material; reduced defects |
| 04/28/2005 | US20050087451 Abrasive electrolyte |
| 04/28/2005 | US20050087450 For thinning layer on semiconductor/integrated circuit substrate, without damaging underlying layer |
| 04/26/2005 | US6884153 Apparatus for electrochemical processing |
| 04/19/2005 | US6881664 Process for planarizing upper surface of damascene wiring structure for integrated circuit structures |
| 04/14/2005 | US20050077188 Establishing electrically conductive path through electrolyte between exposed layer of barrier material on substrate and electrode, electrochemically removing portion of exposed layer during first processing step in barrier processing station, detecting endpoint, processing exposed barrier layer |
| 04/06/2005 | EP1520281A2 Low-force electrochemical mechanical processing method and apparatus |
| 04/05/2005 | US6875322 Electrochemical assisted CMP |
| 03/31/2005 | WO2005002794A3 Cell, system and article for electrochemical mechanical processing (ecmp) |
| 03/24/2005 | US20050061674 Endpoint compensation in electroprocessing |
| 03/17/2005 | US20050059324 Methods and apparatus for removing conductive material from a microelectronic substrate |
| 03/17/2005 | US20050056550 Methods and apparatus for removing conductive material from a microelectronic substrate |
| 03/17/2005 | US20050056537 Planarization of substrates using electrochemical mechanical polishing |
| 03/16/2005 | CN1192857C Contact-discharge truing/dressing method and device therefor |
| 03/15/2005 | US6867448 Electro-mechanically polished structure |
| 03/15/2005 | US6867136 Method for electrochemically processing a workpiece |
| 03/10/2005 | US20050051432 Electrolytic processing apparatus and method |
| 03/08/2005 | US6863797 Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP |
| 03/08/2005 | US6863794 Method and apparatus for forming metal layers |
| 02/24/2005 | US20050040050 Polishing apparatus |
| 02/22/2005 | US6858531 Electro chemical mechanical polishing method |
| 02/22/2005 | US6857940 Electrodes configured to apply pressure to a fluid including dielectric abrasive particles on the workpiece and arrange the particles uniformly by a Coulomb force produced by applying an alternating current voltage; antiagglomerants |
| 02/17/2005 | US20050035000 Positioning microelecrtrons substrate between electrodes; polishing; removal electroconductive materials; detecting signals |
| 02/17/2005 | US20050034999 Methods and apparatus for electrically and/or chemically-mechanically removing conductive material from a microelectronic substrate |
| 02/16/2005 | EP1506572A1 Substrate processing apparatus and substrate processing method |
| 02/15/2005 | US6855634 Polishing method and polishing apparatus |
| 02/10/2005 | WO2002084714A3 Method and apparatus for electrochemically depositing a material onto a workpiece surface |
| 02/10/2005 | US20050029122 purification of electrolytic polishing bath; loop feedback system; power source; controllers; for semiconductor wafer |
| 02/08/2005 | US6852630 Electroetching process and system |
| 02/03/2005 | WO2003028048A3 Low-force electrochemical mechanical processing method and apparatus |
| 02/03/2005 | US20050022938 Apparatus for bonding substrates and method for bonding substrates |
| 02/02/2005 | EP1501653A1 A method, an apparatus, a control system and a computer program to perform an automatic removal of cathode depositions during a bipolar electrochemical machining |
| 02/01/2005 | US6848975 Electrochemical planarization of metal feature surfaces |
| 02/01/2005 | US6848970 Process control in electrochemically assisted planarization |
| 01/27/2005 | WO2005008806A2 Photoelectrolysis of water using proton exchange membranes |
| 01/27/2005 | US20050020004 Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates |
| 01/27/2005 | US20050016869 Applying an alternating or bipolar pulsed electrical current between a metal containing substrate and an electrolyte; removal of platinum from semiconductor wafers |
| 01/27/2005 | US20050016868 Providing a wafer electrical connection by holding the conductive surface against the surface of the belt pad, applying a potential difference between the electrode and the wafer electrical connection and establishing a relative motion between the surface of the belt pad and the wafer |
| 01/27/2005 | US20050016681 Method and apparatus for the electrochemical deposition and planarization of a material on a workpiece surface |
| 01/26/2005 | EP1500466A1 Device for alternately machining a workpiece |
| 01/13/2005 | WO2005002794A2 Cell, system and article for electrochemical mechanical processing (ecmp) |
| 01/13/2005 | US20050005963 Photoelectrolysis of water using proton exchange membranes |
| 01/11/2005 | US6841057 Conductive polishing pad and electrode having membrane disposed therebetween; membrane orientated relative to conductive pad in manner that facilitates removal of entrained gas from electrolyte flowing towards conductive pad |
| 01/06/2005 | WO2005000525A1 Polishing pad for electrochemical-mechanical polishing |
| 01/06/2005 | WO2005000512A1 Rotation surface-reducing head, electrolytic surface-reducing device, and electrolytic surface-reducing method |
| 01/06/2005 | US20050000801 Method and apparatus for electrochemical mechanical processing |
| 01/05/2005 | CN1559733A High speed high quality electric spark processing liquid storage tank system |
| 01/04/2005 | US6837984 Methods and apparatus for electropolishing metal interconnections on semiconductor devices |
| 01/04/2005 | US6837983 Endpoint detection for electro chemical mechanical polishing and electropolishing processes |
| 12/30/2004 | US20040266327 Conductive polishing article for electrochemical mechanical polishing |
| 12/30/2004 | US20040266193 Means to improve center-to edge uniformity of electrochemical mechanical processing of workpiece surface |
| 12/28/2004 | US6835292 Electrochemical thin film polishing method and polishing apparatus |
| 12/23/2004 | WO2004111314A2 Algorithm for real-time process control of electro-polishing |
| 12/23/2004 | WO2004111146A1 Polishing composition and method for polishing a conductive material |
| 12/23/2004 | US20040259479 Polishing pad for electrochemical-mechanical polishing |
| 12/23/2004 | US20040259365 Polishing method polishing system and method for fabricating semiconductor device |
| 12/23/2004 | US20040256245 Moveable nozzle moves from a first to apply a stream of electrolyte to a first portion of the metal layer to a second position to apply the stream of electrolyte to a second portion when the wafer is rotated by the wafer chuck; shorter polishing time and uses less quantity of slurry |
| 12/23/2004 | US20040256237 Ion exchanger between a pair of electrodes and a section for supplying a liquid to the ion exchanger; can flatten or clean a workpiece, especially a semiconductor wafer, while eliminating or reducing a load upon a CMP treatment |
| 12/16/2004 | WO2004108358A2 Conductive polishing article for electrochemical mechanical polishing |
| 12/09/2004 | US20040248412 Method and composition for fine copper slurry for low dishing in ECMP |
| 12/08/2004 | CN1554113A Planar metal electroprocessing |
| 12/01/2004 | EP1480784A1 Methods and apparatus for electrochemical-mechanical processing of microelectronic workpieces |
| 11/24/2004 | EP1478708A1 Method and composition for polishing a substrate |
| 11/23/2004 | US6821409 Electroetching methods and systems using chemical and mechanical influence |
| 11/11/2004 | US20040224509 Method to remove copper without pattern density effect |
| 11/04/2004 | WO2004095571A1 Substrate processing method and substrate processing apparatus |
| 11/04/2004 | WO2004094107A1 Conductive polishing pad with anode and cathode |
| 11/04/2004 | US20040217013 Apparatus and method for electropolishing a metal wiring layer on a semiconductor device |
| 11/03/2004 | CN1543668A Forming a semiconductor structure using a combination of planarizing methods and electropolishing |
| 11/02/2004 | US6811680 Forming a passivation layer on a substrate surface; polishing substrate in an electrolyte solution; applying an anodic bias to substrate surface; removing material from portion of substrate surface |
| 10/28/2004 | US20040214510 Conductive polishing pad with anode and cathode |
| 10/28/2004 | US20040214431 Electropolishing endpoint detection method |
| 10/28/2004 | US20040211662 Method and apparatus for the electrochemical deposition and removal of a material on a workpiece surface |
| 10/27/2004 | EP1470576A1 Electrolytic processing apparatus and substrate processing apparatus and method |
| 10/26/2004 | US6809284 Wire cut electric discharge machine |