Patents for H05K 1 - Printed circuits (98,583)
05/2013
05/01/2013CN202918587U PCB structure of Doppler microwave module
05/01/2013CN202918586U Pull-button type structure for connecting pad and through hole
05/01/2013CN202918585U 焊盘 Pad
05/01/2013CN202918584U Magnetic suction type gold finger protective device
05/01/2013CN202918583U Laminated board
05/01/2013CN202918582U Rigid-flexible printed circuit board mixed pressing type laminated structure
05/01/2013CN202918581U Ceramic substrate based on DLC thin film coating
05/01/2013CN202918580U High-speed digital-analog hybrid circuit board
05/01/2013CN202918579U Binding structure of front touch control cover
05/01/2013CN202918166U Circuit board installation structure of Hall sensor for brushless motor
05/01/2013CN202917666U 电连接器 The electrical connector
05/01/2013CN103081578A Module substrate and method for manufacturing module substrate
05/01/2013CN103081577A A system for grounding in an electronic device
05/01/2013CN103081576A Wiring substrate and electronic device
05/01/2013CN103081575A Light source device on a printed circuit board and light source arrangement comprising a plurality of light source devices
05/01/2013CN103081574A Multi-part wired substrate, wired substrate, and electronic device
05/01/2013CN103081253A External contact plug connector
05/01/2013CN103081147A Optoelectronic semiconductor component and method for producing it
05/01/2013CN103081146A LED wiring board and light irradiation apparatus
05/01/2013CN103081145A Light emitting diode assembly and thermal control blanket and methods relating thereto
05/01/2013CN103081099A 半导体装置 Semiconductor device
05/01/2013CN103080225A Resin composition, prepreg, and laminate
05/01/2013CN103079354A Method for improving accuracy of resistance value of buried resistance printed circuit board
05/01/2013CN103079344A Power-terminal liquid-crystal screen bracket
05/01/2013CN103079343A Circuit component
05/01/2013CN103079342A Flexible circuit board and circuit connecting equipment
05/01/2013CN103079341A Structure preventing short circuit caused by soldering of PCB (Printed Circuit Board) board and PCB board with structure
05/01/2013CN103079340A Printed wiring board
05/01/2013CN103079339A Metal ceramic composite substrate and manufacturing method for same
05/01/2013CN103079338A PCB (printed circuit board) and electronic device
05/01/2013CN103079337A Grooved plate for improved solder bonding
05/01/2013CN103079336A Printed wiring board
05/01/2013CN103079335A Multilayer printed circuit board
05/01/2013CN103077936A Wiring substrate and manufacturing method of the same
05/01/2013CN103076717A Photosensitive resin composition, photosensitive component, forming method of corrosion-resistant pattern and manufacturing method of printed wiring board
05/01/2013CN103073849A Insulating layer composition for substrate, and prepeg and substrate using the same
05/01/2013CN103073844A Halogen-free flame-retardant epoxy resin composition and cover film produced by halogen-free flame-retardant epoxy resin composition
05/01/2013CN102271457B 显示装置 Display device
05/01/2013CN102271456B Heat-conduction ceramic-based printed circuit board (PCB) and manufacture method thereof
05/01/2013CN102215629B Printed circuit board, manufacturing method thereof as well as computer
05/01/2013CN102157671B Light-emitting diode arrangement for a high-power light-emitting diode, and method for producing a light-emitting diode arrangement
05/01/2013CN102036468B Printed board and method of manufacturing printed board
05/01/2013CN101892027B Low-halogen-content fire-retardant adhesive and flexible copper clad laminate prepared from same
05/01/2013CN101500373B Printed circuit board, backlight unit and liquid crystal display device
05/01/2013CA2757022A1 Light engines for luminaires
04/2013
04/30/2013US8432708 Motherboard assembly having serial advanced technology attachment dual in-line memory module
04/30/2013US8432707 Card design with fully buffered memory modules and the use of a chip between two consecutive modules
04/30/2013US8432706 Printed circuit board and electro application
04/30/2013US8432705 Expansion apparatus with serial advanced technology attachment dual in-line memory module
04/30/2013US8432703 Fixing apparatus for circuit board
04/30/2013US8431834 Method for assuring counterbore depth of vias on printed circuit boards and printed circuit boards made accordingly
04/30/2013US8431833 Printed wiring board and method for manufacturing the same
04/30/2013US8431832 Circuit board, mounting structure, and method for manufacturing circuit board
04/30/2013US8431831 Bond strength and interconnection in a via
04/30/2013US8431830 Interposer and electronic device
04/30/2013US8431829 Printed wiring board and method for manufacturing the same
04/30/2013US8431828 Composite substrate
04/30/2013US8431827 Circuit modules and method of managing the same
04/30/2013US8431826 Capacitive power and ground plane structure utilizing fractal elements for the reduction of radiated emissions
04/30/2013US8429815 Manufacturing method of substrate, manufacturing method of wiring board, wiring board, electronic device, electron source, and image display apparatus
04/25/2013WO2013059801A1 Low-profile wireless connectors
04/25/2013WO2013059446A1 Power converters with integrated capacitors
04/25/2013WO2013058380A1 Adhesive composition, connection structure and method for producing same
04/25/2013WO2013058287A1 Method for manufacturing coupled printed circuit board and coupled printed circuit board
04/25/2013WO2013058039A1 Resin substrate having built-in component
04/25/2013WO2013057478A1 Radiofrequency circuit assembly
04/25/2013WO2013057025A1 System for fast and accurate filling of a two-phase cooling device, notably a heat pipe, adapted for use in an automated process
04/25/2013WO2013056561A1 Two-layered printed circuit board and mobile communication terminal
04/25/2013WO2013056426A1 Halogen-free low-dielectric resin composition, and prepreg and copper foil laminate made by using same
04/25/2013WO2013056419A1 Epoxy resin composition and high frequency electronic-circuit substrate manufactured by using the same
04/25/2013WO2013056411A1 Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same
04/25/2013WO2012166686A3 Electronic, optical and/or mechanical apparatus and systems and methods for fabricating same
04/25/2013WO2009061415A3 Board to board horizontal mounted connector
04/25/2013US20130101857 Thermosetting resin composition, cured product thereof, active ester resin, semiconductor encapsulating material, prepreg, circuit board, and build-up film
04/25/2013US20130101251 Optical Module and Multilayer Substrate
04/25/2013US20130100628 Printed Circuit Board and Electronic Device Using Printed Circuit Board
04/25/2013US20130100626 Wiring substrate and manufacturing method of the same
04/25/2013US20130100625 Wiring board, semiconductor device and method for manufacturing wiring board
04/25/2013US20130100624 Circuit board contact pads
04/25/2013US20130100618 Stretchable Form of Single Crystal Silicon for High Performance Electronics on Rubber Substrates
04/25/2013US20130100615 Tape substrate with chip on film structure for liquid crystal display panel
04/25/2013US20130099628 Electronic component and fabrication method of the same, and electronic device including the same
04/25/2013US20130099374 Package of electronic device including connecting bump, system including the same and method for fabricating the same
04/25/2013US20130099273 Wiring substrate, light emitting device, and method for manufacturing wiring substrate
04/25/2013US20130098671 Multiple layer printed circuit board
04/25/2013US20130098670 Wiring substrate and manufacturing method of the same
04/25/2013US20130098669 Wiring substrate and manufacturing method for wiring substrate
04/25/2013US20130098668 Conductive subtrate and method of manufacturing the same
04/25/2013US20130098667 Embedded printed circuit board and manufacturing method thereof
04/25/2013US20130098666 Resin composition for printed circuit board and printed circuit board including the same
04/25/2013US20130098665 Flexible printed circuit board and production method of same
04/25/2013US20130098664 Resolution-Adjustable Touch Panel and Manufacturing Method Thereof
04/25/2013US20130098663 Touch panel sensor
04/25/2013US20130098662 Method of manufacturing multi-layer circuit board, and multi-layer circuit board
04/25/2013US20130098661 Printed circuit board and layout method thereof
04/25/2013DE10334557B4 Verbinder für eine in einer elektronischen Vorrichtung enthaltene Knopfbatterie Connector for a button battery contained in an electronic device
04/25/2013DE102012019856A1 Electronic device e.g. notebook has power amplifier footprint having primary and secondary portions whose input/output (I/O) pads are coupled to multi-band power amplifier IC, when multi-band amplifier IC is mounted on circuit board
04/25/2013DE102012001883B3 Lötverfahren und entsprechende Löteinrichtung Brazing and soldering equipment appropriate
04/25/2013DE102011085172A1 Getriebesteuermodul mit Lötbrücken oder Kaltkontakten zwischen eingesetztem Schaltungsträger und umgebendem Schaltungsträger Transmission control module with solder bridges or cold contacts between the inserted circuit substrate and surrounding circuit carrier
04/25/2013DE102011085170A1 Control module for automatic transmission control of e.g. passenger car, has electronic package, circuit board and support plate mechanically connected with each other, where rigid portion of circuit board is glued with support plate