Patents
More topics under "H01L - Semiconductor devices; Electric solid state devices not otherwise provided for" (1,780,774)
H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
H01L 23 - Details of semiconductor or other solid state devices (226,155)
H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
H01L 27 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate (229,248)
H01L 29 - Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. pn-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof (218,143)
H01L 31 - Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (138,256)
H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
H01L 35 - Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting seebeck or peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (11,417)
H01L 37 - Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using nernst-ettinghausen effect; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (2,013)
H01L 39 - Devices using superconductivity or hyperconductivity; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (12,014)
H01L 41 - Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (34,459)
H01L 43 - Devices using galvano-magnetic or similar magnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (12,001)
H01L 45 - Solid state devices specially adapted for rectifying, amplifying, oscillating, or switching without a potential-jump barrier or surface barrier, e.g. dielectric triodes; Ovshinsky-effect devices; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (8,424)
H01L 47 - Bulk negative resistance effect devices, e.g. gunn-effect devices; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (2,062)
H01L 49 - Solid state devices not provided for in groups and and not provided for in any other subclass; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (3,461)
H01L 51 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof (83,948)
Patents for H01L - Semiconductor devices; Electric solid state devices not otherwise provided for (4,363)
11/2002
11/14/2002US20020169225 Forming a nanoporous aerogel using a supercritical drying process, adding a reinforcing material and volatile compound to form an amalgamated layer; treating to increase strength; films; durability; integrated circuits
11/14/2002DE10121556A1 Verfahren zum Rückseitenschleifen von Wafern Process for back-surface grinding of wafers
11/07/2002WO2002089176A2 Method for separating electronic components from a composite
11/07/2002WO2002054447A3 System and method for prototyping and fabricating complex microwave circuits
11/06/2002EP1255290A2 A method to form a low parasitic capacitance CMOS device
10/2002
10/31/2002WO2001056063A9 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners
10/31/2002US20020158295 Electrochemical device
10/24/2002WO2002084708A2 Method of forming semiconductor compound film for fabrication of electronic device and film produced by same
10/24/2002WO2002084707A2 Method of etching shaped cavities and associated on-chip devices and micro-machined structures
10/24/2002DE10117880A1 Method of isolating electronic components from composite structure e.g. for removing chips from wafer, involves selectively deactivating adhesive in corresponding region prior to removing component
10/17/2002US20020148998 Potassium hypochlorite, hydrofluoric acid and deionized water
10/17/2002US20020148807 Method of etching a deep trench in a substrate and method of fabricating on-chip devices and micro-machined structures using the same
10/03/2002WO2002078100A1 A transpinnor-based switch and applications
10/03/2002WO2002078057A2 A transpinnor-based sample-and-hold circuit and applications
09/2002
09/26/2002WO2002049077A3 Barrier layer for electrical connectors and methods of applying the layer
09/19/2002WO2002073659A2 Method for optimizing software distribution in large communication networks
09/19/2002WO2002073658A2 Yield and speed enhancement of semiconductor integrated circuits using post-fabrication transistor mismatch compensation circuitry
09/12/2002WO2002071447A2 Ruthenium silicide wet etch
09/10/2002US6446316 Method for producing an encapsulation for a SAW component operating with surface acoustic waves
09/05/2002US20020123235 Ruthenium silicide wet etch
08/2002
08/27/2002US6441297 Solar cell arrangement
08/22/2002WO2002065507A2 Dynamic memory based on single electron storage
08/22/2002WO2002021573A3 Ccd image sensor and method of manufacturing same
08/22/2002US20020115239 Esd protection network used for soi technology
08/15/2002WO2002019389A3 Epitaxial template and barrier for the integration of functional thin film heterostructures on silicon
08/15/2002US20020110974 Dynamic memory based on single electron storage
08/15/2002US20020110942 System and method for prototyping and fabricating complex microwave circuits
08/15/2002US20020109158 Dynamic memory based on single electron storage
08/08/2002WO2002061800A2 A method and system for electrostatic bonding
08/01/2002WO2002059937A2 Process for etching buried cavities within silicon wafers
07/2002
07/25/2002WO2002058107A2 Method for producing an optical semiconductor box and optical semiconductor box
07/18/2002WO2002056344A2 Transportable container including an internal environment monitor
07/18/2002WO2002056343A2 Methods for improved planarization post cmp processing
07/18/2002WO2002031864A9 Monolithic lead-salt infrared detectors
07/11/2002WO2002054447A2 System and method for prototyping and fabricating complex microwave circuits
07/11/2002WO2002054446A2 Barbed vias for electrical and mechanical connection between conductive layers in semiconductor devices
07/04/2002US20020086551 Process for producing macroscopic cavities beneath the surface of a silicon wafer
07/04/2002US20020086523 Barbed vias for electrical and mechanical connection between conductive layers in semiconductor devices
07/04/2002US20020086517 Barbed vias for electrical and mechanical connection between conductive layers in semiconductor devices
06/2002
06/26/2002EP0925714B1 Circular stripline package incorporating a low noise amplifier
06/20/2002WO2002049077A2 Barrier layer for electrical connectors and methods of applying the layer
06/20/2002WO2002019390A3 Cleaning of semiconductor process equipment chamber parts using organic solvents
06/19/2002CN1354127A Sulphuric acid recovery device
06/18/2002US6406948 Method for forming an ESD protection network for SOI technology with the ESD device formed in an underlying silicon substrate
06/13/2002WO2002019391A3 Apparatus and method for floe of process gas in an ultra-clean environment
06/13/2002US20020072201 Method for electrostatic force bonding and a system thereof
06/11/2002US6403485 Method to form a low parasitic capacitance pseudo-SOI CMOS device
06/06/2002WO2002045143A1 Semiconductor wafer processing to increase the usable planar surface area
06/06/2002US20020066466 Immersing into an organic solvent, removing, inspecting for visible contaminants and testing for non-visible ones, repeating if necessary
06/06/2002CA2728973A1 A bifacial solar cell
06/06/2002CA2727641A1 A semiconductor wafer
06/04/2002US6399011 Method of biaxially aligning crystalline material
05/2002
05/30/2002WO2002043116A2 Etching of high aspect ratio features in a substrate
05/28/2002US6395636 Methods for improved planarization post CMP processing
05/23/2002WO2002041366A2 Nitrogen implantation using a shadow effect to control gate oxide thickness in sti dram semiconductors
05/23/2002WO2002041365A2 Single crystalline oxide on a semiconductor substrate
05/23/2002WO2001084629A3 Detector for computer tomographs
05/21/2002CA2109962C Process for making superconducting t1-pb-sr-ca-cu oxide films and devices
05/16/2002WO2001097255A3 Solar cell unit with removable top layer
05/16/2002WO2001078110B1 Low dielectric constant organic dielectrics based on cage-like structures
05/16/2002US20020058352 Monolithic lead-salt infrared radiation detectors and methods of formation
05/16/2002US20020056860 Image sensor and method of manufacturing same
05/02/2002US20020050611 Hybrid electrical device with biological components
05/01/2002CN1347570A Field effect transistor of SiC for high temp. application, use of such transistor and method for production thereof
04/2002
04/30/2002US6381516 Modular off-line micro device processing system
04/30/2002US6380597 Read-only memory and read-only memory device
04/30/2002US6380087 CMP process utilizing dummy plugs in damascene process
04/25/2002WO2002033706A2 Noise suppression for open bit line dram architectures
04/24/2002CN1345986A Silicon wafe with controlled defect distribution, its making method and caochralski pulling machine
04/23/2002US6375176 Workpiece chuck with guard layer having vacuum distribution pattern
04/18/2002WO2002031864A1 Monolithic lead-salt infrared detectors
04/11/2002US20020042241 Low gate current field emitter cell and array with vertical thin-film-edge emitter
04/09/2002US6368773 Photoresist cross-linker and photoresist composition comprising the same
04/02/2002US6365419 High density MRAM cell array
03/2002
03/28/2002US20020036077 Workpiece chuck
03/14/2002WO2002021573A2 Ccd image sensor and method of manufacturing same
03/14/2002US20020032117 Used as substrate glass both in display technology and in thin-film photovoltaics
03/13/2002EP1186053A2 A FIELD EFFECT TRANSISTOR OF SiC FOR HIGH TEMPERATURE APPLICATION, USE OF SUCH A TRANSISTOR AND A METHOD FOR PRODUCTION THEREOF
03/07/2002WO2002019391A2 Apparatus and method for floe of process gas in an ultra-clean environment
03/07/2002WO2002019390A2 Cleaning of semiconductor process equipment chamber parts using organic solvents
03/07/2002WO2002019389A2 Epitaxial template and barrier for the integration of functional thin film heterostructures on silicon
03/07/2002WO2002019386A2 High density mram cell array
03/07/2002WO2001088957A3 Waveguide based light source
03/07/2002WO2001078110A3 Low dielectric constant organic dielectrics based on cage-like structures
03/06/2002CN1339173A Lateral field effect transistor of sic, method for production thereof and a use of such a transistor
02/2002
02/21/2002US20020020801 Fabricating a hybrid imaging device
02/07/2002US20020016414 Low dielectric constant organic dielectrics based on cage-like structures
02/06/2002EP1010181B1 A read-only memory and read-only memory devices
02/06/2002EP1010180B1 A read-only memory and read-only memory device
02/06/2002CN1334593A Method for mfg. semioconductor structure having crystalline alkaline earth metal oxide interface with silicon
01/2002
01/15/2002CA2251345C Circular stripline package incorporating a low noise amplifier
01/10/2002WO1999053528A3 Surface treatment process and system
01/03/2002WO2001056063A3 Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners
12/2001
12/26/2001CN1328342A Process for preparing diode with ceramic substrate and crystal grain structure
12/20/2001WO2001097255A2 Solar cell unit with removable top layer
12/20/2001CA2412739A1 Solar cell unit with removable top layer
12/19/2001EP1163696A1 A LATERAL FIELD EFFECT TRANSISTOR OF SiC, A METHOD FOR PRODUCTION THEREOF AND A USE OF SUCH A TRANSISTOR
12/06/2001WO2001093340A1 Position sensitive photo detector
11/2001
11/28/2001EP1157431A1 A hybrid electrical device with biological components
11/22/2001WO2001088957A2 Waveguide based light source
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