Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for
More topics under "H01L - Semiconductor devices; Electric solid state devices not otherwise provided for" (1,780,774)
H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
H01L 23 - Details of semiconductor or other solid state devices (226,155)
H01L 25 - Assemblies consisting of a plurality of individual semiconductor or other solid state devices (40,835)
H01L 27 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate (229,248)
H01L 29 - Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having at least one potential-jump barrier or surface barrier; Capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. pn-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof (218,143)
H01L 31 - Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (138,256)
H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
H01L 35 - Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting seebeck or peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (11,417)
H01L 37 - Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using nernst-ettinghausen effect; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (2,013)
H01L 39 - Devices using superconductivity or hyperconductivity; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (12,014)
H01L 41 - Piezo-electric devices in general; Electrostrictive devices in general; Magnetostrictive devices in general; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (34,459)
H01L 43 - Devices using galvano-magnetic or similar magnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (12,001)
H01L 45 - Solid state devices specially adapted for rectifying, amplifying, oscillating, or switching without a potential-jump barrier or surface barrier, e.g. dielectric triodes; Ovshinsky-effect devices; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (8,424)
H01L 47 - Bulk negative resistance effect devices, e.g. gunn-effect devices; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (2,062)
H01L 49 - Solid state devices not provided for in groups and and not provided for in any other subclass; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof (3,461)
H01L 51 - Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof (83,948)
Patents for H01L - Semiconductor devices; Electric solid state devices not otherwise provided for (4,363)
05/2005
05/31/2005US6900536 Method for producing an electrical circuit
05/26/2005WO2005048612A1 Configurable rfid system for multiple regulatory environments
05/26/2005WO2005048319A2 Large-area detector
05/26/2005WO2005048318A2 Nitride metal oxide semiconductor integrated transistor devices
05/26/2005WO2005048317A2 Self-processing integrated damage assessment sensor for structural health monitoring
05/26/2005WO2005048316A2 Teardrop shaped lead frames
05/26/2005WO2005048315A2 Light emitting devices and materials for use in the devices
05/26/2005WO2005048314A2 Tapered dielectric and conductor structures and applications thereof
05/26/2005WO2005048313A2 Methods and systems for handling workpieces in a vacuum-based semiconductor handling system
05/26/2005WO2005048312A2 Dense-reader rfid system
05/26/2005WO2005048311A2 Bump-on-lead flip chip interconnection
05/26/2005WO2005048310A2 System and method for enhanced thermophotovoltaic generation
05/26/2005WO2005048309A2 Delta-geometry timing prediction in integrated circuit fabrication
05/26/2005WO2005048308A2 Delta-information design closure in integrated circuit fabrication
05/26/2005WO2005048306A2 Wafer carrier door
05/26/2005WO2005048305A2 Substrate container
05/26/2005WO2005048303A2 Anti-tombstoning lead free alloys for surface mount reflow soldering
05/26/2005WO2005048302A2 Method for integrating pre-fabricated chip structures into functional electronic systems
05/26/2005WO2005048301A2 Methods and apparatus for optimizing a substrate in a plasma processing system
05/26/2005WO2005048297A2 Nanostructures including a metal
05/26/2005WO2005034197A3 Methods and apparatus for an led light
05/26/2005WO2005031803A9 Thermal processing system with cross flow injection system with rotatable injectors
05/26/2005WO2005031798A3 Light-emitting device and method for manufacturing the same
05/26/2005WO2005021142A3 Particle preparation using supercritical fluid and mixers
05/26/2005WO2004081992A3 Semiconductor wafer with non-rectangular shaped dice
05/26/2005WO2004068551A3 Patterning layers comprised of spin-on ceramic films
05/26/2005US20050114045 Self-processing integrated damage assessment sensor for structural health monitoring
05/26/2005US20050113976 Software controller for handling system
05/26/2005US20050113964 Sensor methods and systems for semiconductor handling
05/26/2005US20050112883 System and method for removal of photoresist in transistor fabrication for integrated circuit manufacturing
05/26/2005US20050112822 Method in the fabrication of a monolithically integrated high frequency circuit
05/26/2005US20050111956 Methods and systems for reducing the effect of vibration in a vacuum-based semiconductor handling system
05/26/2005US20050111775 Method and apparatus for a dynamically reconfigurable waveguide in an integrated circuit
05/26/2005US20050111157 Decoupling circuit for co-packaged semiconductor devices
05/26/2005US20050110384 Lighting elements and methods
05/26/2005US20050110164 Bump-on-lead flip chip interconnection
05/26/2005US20050109669 Substrate container
05/26/2005US20050109668 Substrate carrier
05/26/2005US20050109665 Shipper with tooth design for improved loading
05/26/2005US20050109460 Adjustable gas distribution system
05/26/2005US20050109386 System and method for enhanced thermophotovoltaic generation
05/26/2005US20050109277 Method for controlled application of reactive vapors to produce thin films and coatings
05/24/2005US6898558 Method and apparatus for monitoring a material processing system
05/24/2005US6897498 Polycrystalline germanium-based waveguide detector integrated on a thin silicon-on-insulator (SOI) platform
05/19/2005WO2005045899A2 Low temperature deposition of silicone nitride
05/19/2005WO2005045897A2 Mask data preparation
05/19/2005WO2005045896A2 Lateral high-voltage junction device
05/19/2005WO2005045895A2 Cleaning solutions and etchants and methods for using same
05/19/2005WO2005045894A2 High volume microlamination production of devices
05/19/2005WO2005045893A2 Method of forming non-oxide thin films using negative sputter ion beam source
05/19/2005WO2005045891A2 Method and apparatus for measuring and monitoring coatings
05/19/2005WO2005045890A2 Method and apparatus for etch endpoint detection
05/19/2005WO2005045888A2 Electromagnetic noise shielding in semiconductor packages using caged interconnect structures
05/19/2005WO2005045885A2 Anti-stiction technique for thin film and wafer-bonded encapsulated microelectromechanical systems
05/19/2005WO2005045884A2 Optical amplification in semiconductors
05/19/2005WO2005027194A3 Method of making nonvolatile transistor pairs with shared control gate
05/19/2005WO2005024910A3 Apparatus and method for integrated circuit power management
05/19/2005WO2005017975A3 Anchors for microelectromechanical systems having an soi substrate, and method of fabricating same
05/19/2005WO2005010933A3 Micromirrors with mechanisms for enhancing coupling of the micromirrors with electrostatic fields
05/19/2005WO2004109762A3 Electrically conductive si-ti-c-n ceramics
05/19/2005US20050107261 Charge dissipative dielectric for cryogenic devices
05/19/2005US20050106893 Surface preparation prior to deposition on germanium
05/19/2005US20050106884 Silicon carbide components of semiconductor substrate processing apparatuses treated to remove free-carbon
05/19/2005US20050106817 Embedded eeprom cell and method of forming the same
05/19/2005US20050104193 Semiconductor device with magnetically permeable heat sink
05/19/2005US20050104179 Methods and apparatus for packaging integrated circuit devices
05/19/2005US20050104176 High temperature electronic devices
05/19/2005US20050104104 High temperature memory device
05/19/2005US20050104007 Ion source with electrode kept at potential(s) other than ground by zener diode(s), thyristor(s) and/or the like
05/18/2005CN1618076A Automotive code reader
05/17/2005US6893986 Method of reducing internal stress in materials
05/17/2005US6893684 Anti-reflective coating compositions for use with low k dielectric materials
05/12/2005WO2005043601A2 Apparatus and method for forming compound integrated circuits
05/12/2005WO2005043600A2 Azimuthal scanning of a structure formed on a semiconductor wafer
05/12/2005WO2005043598A2 Use of potting gels for fabricating microoptic arrays
05/12/2005WO2005043597A2 Method of optimizing glass strain
05/12/2005WO2005043596A2 Layered hard mask and dielectric materials and methods therefor
05/12/2005WO2005043595A2 Electric field proximity keyboards and detection systems
05/12/2005WO2005043594A2 Method for forming photo-defined micro electrical contacts
05/12/2005WO2005043593A2 System for processing a workpiece
05/12/2005WO2005043592A2 Balancing transformers for lamps driven in parallel
05/12/2005WO2005043591A2 HIGH PERFORMANCE STRESS-ENHANCED MOSFETs USING Si:C AND SiGe EPITAXIAL SOURCE/DRAIN AND METHOD OF MANUFACTURE
05/12/2005WO2005043590A2 Strained dislocation-free channels for cmos and method of manufacture
05/12/2005WO2005043589A2 Method and system for enhancing the endurance of memory cells
05/12/2005WO2005043586A2 Led array with photodetector
05/12/2005WO2005043549A1 Zener-zap memory
05/12/2005WO2005020285A3 Extrusion thermo-electric temperature control unit
05/12/2005WO2005020277A3 Electron beam enhanced large area deposition system
05/12/2005WO2005017955A3 Polarization maintaining dispersion controlled fiber laser source of ultrashort pulses
05/12/2005WO2005010943A3 High side power switch with charge pump and bootstrap capacitor
05/12/2005WO2005010940A3 High resolution, dynamic positioning mechanism for specimen inspection and processing
05/12/2005WO2005010931A3 Mutilayer piezoelectric transformer
05/12/2005WO2005006397A3 System and method for load sensing using piezoelectric effect
05/12/2005WO2004109760A3 Substrate patterning
05/12/2005WO2004079780A3 A method of patterning photoresist on a wafer using a reflective mask with a multi-layer arc
05/12/2005WO2004042780A3 Flexible semiconductor device and method of manufacturing the same
05/12/2005US20050102128 Bootstrap diode emulator with dynamic back-gate biasing
05/12/2005US20050102113 System and method for detecting motion of an electric actuator
05/12/2005US20050101126 Line edge roughness reduction for trench etch
05/12/2005US20050100474 Anti-tombstoning lead free alloys for surface mount reflow soldering
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