Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
05/2014
05/27/2014US8735189 Flip light emitting diode chip and method of fabricating the same
05/27/2014US8735188 Apparatus for atomic layer deposition with sloped purge injection nozzle structure
05/27/2014US8735185 Light emitting device and fabrication method thereof
05/27/2014CA2633368C Semiconductor module for light reception or light emission
05/22/2014WO2014078256A1 Side-viewing multi-colour led device
05/22/2014WO2014078070A1 (ai, in, b, ga) n based laser diodes with polished facets
05/22/2014WO2014077643A1 Light-emitting device and electronic apparatus including same
05/22/2014WO2014077631A1 Led lighting device
05/22/2014WO2014077603A1 Fluorescent ink composition, and preparation method therefor
05/22/2014WO2014077523A1 Method for manufacturing light-emitting diode element and light-emitting diode element
05/22/2014WO2014077260A1 Thermosetting compound, thermosetting composition, thermosetting composition for forming optical semiconductor element package, resin cured product, and optical semiconductor device
05/22/2014WO2014077240A1 Phosphor, light-emitting element and lighting device
05/22/2014WO2014077216A1 Thermosetting resin composition
05/22/2014WO2014077132A1 Phosphor, light-emitting element and lighting device
05/22/2014WO2014077078A1 Vehicle lamp device
05/22/2014WO2014076948A1 Lighting apparatus and light emitting apparatus
05/22/2014WO2014076610A1 Led-based lighting device and manufacture thereof
05/22/2014WO2014076411A1 Glass ceramic item with light display
05/22/2014WO2014076019A1 Optoelectronic semiconductor component
05/22/2014WO2014075737A1 Light-emitting device
05/22/2014WO2014075608A1 Flip-flop light emitting diode and method for manufacturing same
05/22/2014WO2014075178A1 Methods and apparatus for high speed short distance optical communications using micro light emitting diodes
05/22/2014WO2014046488A3 Color converting element and method for manufacturing same
05/22/2014WO2014046486A3 Glass sealant coating method and glass sealant coating device for light-emitting diode
05/22/2014WO2014039833A3 Integrated led based illumination device
05/22/2014US20140141555 Nanowire led structure and method for manufacturing the same
05/22/2014US20140141553 Method for manufacturing light emitting diode chip
05/22/2014US20140141552 Method of bonding a semiconductor device to a support substrate
05/22/2014US20140141550 Semiconductor device and production method therefor
05/22/2014US20140141548 Method of manufacturing a metal clad circuit board
05/22/2014US20140141540 Resin coating device, and resin coating method
05/22/2014US20140141538 Methods of characterizing semiconductor light-emitting devices based on product wafer characteristics
05/22/2014US20140139702 Electronic flash, electronic camera and light emitting head
05/22/2014US20140139101 Phosphor, method of producing the same, and light emitting apparatus
05/22/2014US20140138734 Module structure
05/22/2014US20140138733 Light-emitting device and electronic device
05/22/2014US20140138732 Light-emitting module
05/22/2014US20140138731 Semiconductor light emitting element
05/22/2014US20140138730 Method of Producing a Plurality of Optoelectronic Semiconductor Chips
05/22/2014US20140138729 High efficiency light emitting diode
05/22/2014US20140138728 Phosphor composition and light emitting device package having the same
05/22/2014US20140138727 Method and apparatus for processing a workpiece and an article formed thereby
05/22/2014US20140138726 Semiconductor light-emitting element and manufacturing method thereof
05/22/2014US20140138725 Semiconductor light-emitting device and producing method thereof
05/22/2014US20140138724 Substrate for mounting optical semiconductor element, method for manufacturing the substrate, and optical semiconductor device
05/22/2014US20140138722 Semiconductor light emitting device and method for manufacturing same
05/22/2014US20140138721 Light emitting diode heat-dissipation carrier structure
05/22/2014US20140138719 Organic Optoelectronic Device And Method For The Encapsulation Thereof
05/22/2014US20140138715 Light-emitting assemblies comprising an array of light-emitting diodes having an optimized lens configuration
05/22/2014US20140138714 Array substrate and manufacturing method thereof
05/22/2014US20140138713 Passivation layer for flexible display
05/22/2014US20140138712 Light emitting diode and method for manufacturing the same
05/22/2014US20140138711 Light-Emitting Device, Lighting Device, and Electronic Device
05/22/2014US20140138666 Diode for a Printable Composition
05/22/2014US20140138621 Gallium nitride based light emitting diode and fabrication method thereof
05/22/2014US20140138620 Nanowire Sized Opto-Electronic Structure and Method for Modifying Selected Portions of Same
05/22/2014US20140138619 Nitride semiconductor structure and semiconductor light emitting device including the same
05/22/2014US20140138618 Nitride semiconductor structure and semiconductor light emitting device including the same
05/22/2014US20140138617 Nitride semiconductor structure and semiconductor light emitting device including the same
05/22/2014US20140138616 Nitride semiconductor structure and semiconductor light emitting device including the same
05/22/2014US20140138615 Light emitting diode
05/22/2014US20140138614 Semiconductor light emitting device
05/22/2014US20140138613 Light emitting diode having heterogeneous protrusion structures
05/22/2014DE112011105504T5 LED-Beleuchtungseinrichtung LED illumination device
05/22/2014DE102013112646A1 Verfahren für die spannungsreduzierte Herstellung von Halbleiterbauelementen A method for the voltage reduced manufacturing of semiconductor devices
05/22/2014DE102013108782A1 Light-emitting device, e.g., back light module for LCD, has carrier which is arranged to carry first light-emitting unit in which difference between first dominant wavelength and second dominant wavelength is five to thirty nanometers
05/22/2014DE102012221409A1 Solid body comprises a functionalized surface layer with locally laterally and vertically distributed components of at least one two- and multi-phase systems, which are varying on nanometer- and micrometer scales
05/22/2014DE102012221229A1 Optoelektronische Baugruppe und Verfahren zum Herstellen einer optoelektronischen Baugruppe The optoelectronic assembly and method of making an optoelectronic assembly
05/22/2014DE102012220980A1 Optoelektronisches halbleiterbauelement The optoelectronic semiconductor component
05/22/2014DE102012215788B4 Mehrlagige LED-Leiterplatte Multi-layer LED Circuit Board
05/22/2014DE102012111245A1 Verfahren zur Herstellung eines Anschlussbereichs eines optoelektronischen Halbleiterchips A method for producing a connection region of an optoelectronic semiconductor chip
05/22/2014DE102012111065A1 Optoelectronic component e.g. LED, has phosphor element provided to convert the blue light into red light of specific wavelength range, and phosphor-free element placed in optical path of semiconductor portion
05/22/2014DE102012021570A1 Eu-aktivierte Leuchtstoffe Eu-activated phosphors
05/22/2014DE102010050300B4 Operationsleuchte und ein Verfahren zur Ausleuchtung eines Operationstisches mittels einer Operationsleuchte Surgical lamp and a method for illumination of a surgical table by means of an operating lamp
05/22/2014DE102004061949B4 LED mit organischer Kleberschicht LED with organic adhesive layer
05/21/2014EP2733755A1 Circuit board for having semiconductor light emitting device mounted thereon, light emitting module, illuminating apparatus, and illuminating system
05/21/2014EP2733754A2 Light-emitting module
05/21/2014EP2733753A1 Light emitting module
05/21/2014EP2733752A1 Light emitting element and method for manufacturing same
05/21/2014EP2733751A1 Light Emitting Device
05/21/2014EP2733750A1 Semiconductor light emitting element
05/21/2014EP2733744A1 Light emitting element comprising a plurality of vertical-type LEDs connected in series on the same carrier substrate
05/21/2014EP2733178A1 Sealing agent for optical semiconductor devices, and optical semiconductor device
05/21/2014EP2732478A1 Method of bonding a semiconductor device to a support substrate
05/21/2014CN203607458U Led灯珠 Led lamp beads
05/21/2014CN203607457U 一种新型cob基板 A new cob board
05/21/2014CN203607456U 一种led荧光粉的封装模具 One kind of led phosphor packaging mold
05/21/2014CN203607455U 双面贴合式360度发光的led器件 360 double-sided conformable glowing led device
05/21/2014CN203607454U 一种高抗衰减白光led封装结构 A highly anti-decay white led package
05/21/2014CN203607453U 贴片式led封装结构 SMD led package structure
05/21/2014CN203607452U 一种白光数码管 One kind of white digital
05/21/2014CN203607451U 高光透玻璃基板led照明装置 High light through the glass substrate led lighting device
05/21/2014CN203607450U Led照明灯 Led lights
05/21/2014CN203607449U Led光电组件 Led optoelectronic components
05/21/2014CN203607448U 新型贴片式发光二极管 The new SMD LED
05/21/2014CN203607447U Led芯片 Led chip
05/21/2014CN203607446U 一种发光二极管晶粒 A light emitting diode die
05/21/2014CN203607445U 一种新型出光结构的GaN基发光二极管 A novel structure of GaN-based light-emitting diode
05/21/2014CN203607444U 一种应力释放的GaN基发光二极管结构 GaN-based light emitting diode structure of a stress release
05/21/2014CN203607409U 3d集成式led光源模块 3d integrated led light module
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