Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
10/2012
10/24/2012CN202503034U Light-emitting device and illuminating apparatus
10/24/2012CN202503033U LED (light-emitting diode) light source with large light-emitting angle and low light-emitting focus
10/24/2012CN202503032U LED (Light Emitting Diode) light source unlikely to form facular points
10/24/2012CN202503031U LED support
10/24/2012CN202503030U LED packaging structure
10/24/2012CN202503029U High-power and high-brightness LED light source packaging structure
10/24/2012CN202503028U Membrane electroluminescent device
10/24/2012CN202503027U Matrix type sapphire substrate
10/24/2012CN202503026U Light emitting diode (LED) mounting device
10/24/2012CN202503025U Multiple LED integrated packaging eutectic fixture
10/24/2012CN102754229A Light emitting device and method for manufacturing light emitting device
10/24/2012CN102754228A Led device, manufacturing method thereof, and light-emitting device
10/24/2012CN102754227A Silicon light emitting device and method of fabricating same
10/24/2012CN102754226A Nitride-type semiconductor element and process for production thereof
10/24/2012CN102754225A Semiconductor substrate, semiconductor device, and manufacturing methods thereof
10/24/2012CN102754191A Heating apparatus and annealing apparatus
10/24/2012CN102753737A Internal reforming substrate for epitaxial growth, internal reforming substrate with multilayer film, semiconductor device, bulk semiconductor substrate, and production methods therefor
10/24/2012CN102753650A Li-containing alpha-sialon fluorescent particles, method for producing same, illumination device, and image display device
10/24/2012CN102751432A Light emitting device package including UV light emitting diode
10/24/2012CN102751431A Led芯片及其制备方法 Led chip and its preparation method
10/24/2012CN102751430A Optical semiconductor device and the making process thereof
10/24/2012CN102751429A Light-emitting device
10/24/2012CN102751428A Optical transformational structure, manufacture method of optical transformational structure, and light-emitting diode apparatus comprising optical transformational structure
10/24/2012CN102751427A Use of phosphor composite member
10/24/2012CN102751426A Packaging structure and light-emitting diode packaging structure
10/24/2012CN102751425A Light-emitting diode packaging structure and bearing piece thereof
10/24/2012CN102751424A Light emitting device module and method of manufacturing the same
10/24/2012CN102751423A Light emitting device package and method of manufacturing the same
10/24/2012CN102751422A Light emitting device package and lighting device with the same
10/24/2012CN102751421A Package structure of light emitting diode
10/24/2012CN102751420A Light-emitting diode packaging structure
10/24/2012CN102751419A Co-firing ceramic base plate with built-in heat radiating parts and light emitting diode with base plate
10/24/2012CN102751418A LED (light-emitting diode) tube core with ZnO-micron and nano composite structure and preparation method thereof
10/24/2012CN102751417A LED (light-emitting diode) tube core with ZnO (zinc oxide)-micron graphic array and preparation method thereof
10/24/2012CN102751416A Light-emitting diode for directly emitting linearly polarized light and manufacturing method of light-emitting diode
10/24/2012CN102751415A Light emitting device having vertical structure and method for manufacturing the same
10/24/2012CN102751414A Large-area light-emitting device and method for fabricating the same
10/24/2012CN102751413A Semiconductor light emitting device
10/24/2012CN102751412A Chip used for forming nitride semiconductor element and manufacturing method thereof, nitride semiconductor element and manufacturing method thereof
10/24/2012CN102751411A Vertical light-emitting diode and manufacturing method thereof
10/24/2012CN102751410A LED (Light Emitting Diode) chip provided with stepped current blocking structure and fabricating method thereof
10/24/2012CN102751409A Vertical gallium nitride light-emitting diode and manufacturing method thereof
10/24/2012CN102751408A Light emitting diode by taking graphene film as current carrier injection layer
10/24/2012CN102751407A Vertical-structure light emitting diode by taking graphene film as current carrier injection layer
10/24/2012CN102751406A Light-emitting device with low forward voltage and method for fabricating the same
10/24/2012CN102751405A Semiconductor light emitting device
10/24/2012CN102751404A Red light-emitting diode and preparation method
10/24/2012CN102751403A Epitaxial structure of light emitting diode
10/24/2012CN102751402A Semiconductor light emitting element and manufacturing method of light emitting element
10/24/2012CN102751401A Method for improving yield in light-emitting diode (LED) chip production process
10/24/2012CN102751400A Cutting method of semiconductor component containing metal back plating
10/24/2012CN102751399A Facility for manufacturing vertical GaN-based LED chips by metal substrates
10/24/2012CN102751398A Manufacturing method for inverted triangle light emitting diode chip
10/24/2012CN102751397A Laser lift-off method of sapphire pattern substrate
10/24/2012CN102751396A Method for manufacturing LED (light emitting diode) packaging structures
10/24/2012CN102751395A Manufacture method for high-voltage alternating-current LED (light emitting diode) chip modules
10/24/2012CN102751394A LED (light emitting diode) pixel tube light distribution process and novel LED pixel tube
10/24/2012CN102751393A Light emitting diode structure
10/24/2012CN102751392A Chip process device and chip process method
10/24/2012CN102751391A Light-emitting diode (LED) packaging body and manufacturing method thereof as well as LED
10/24/2012CN102751390A LED substrate and manufacturing method thereof, and LED
10/24/2012CN102751275A Light-emitting diode display screen and manufacturing method thereof
10/24/2012CN102751274A Three-dimensionally wrapped packaged LED (Light Emitting Diode) chip
10/24/2012CN102751273A Structure of white LED (Light Emitting Diode) fluorescent lamp and production method of structure
10/24/2012CN102751272A Semiconductor light emitting module and method of manufacturing the same
10/24/2012CN102751271A Light emitting device array
10/24/2012CN102751270A Metal substrate structure with light-emitting diode (LED)
10/24/2012CN102751269A Light-emitting diode module encapsulation structure
10/24/2012CN102751180A GaN film structure, method of fabricating the same, and semiconductor device including the same
10/24/2012CN102751169A Chip taking and placing device
10/24/2012CN102748608A Solid state illumination device
10/24/2012CN102748605A Light-emitting diode (LED) lamp module capable of packaging LED chip on radiating supporting carrier circuit and method
10/24/2012CN102746814A Novel modified nanometer titanium dioxide doping alicyclic epoxy resin LED (light emitting diode) encapsulation glue
10/24/2012CN102746487A LED-packaging epoxy resin composition
10/24/2012CN102176503B Silicon-substrate-radiation-based light emitting diode (LED) package structure and manufacturing method
10/24/2012CN102157634B Method and mold for packaging high-power LED (light emitting diode) liquid silicon rubber
10/24/2012CN102097545B Method for packaging glass-silicon wafer-grade chiponboard (COB) of light emitting diode (LED)
10/24/2012CN102064088B Method for preparing sapphire-graph substrate by dry method and wet method
10/24/2012CN101996986B White light-emitting diode packages with tunable colour temperature
10/24/2012CN101935455B Organosilicon material for packaging LED and preparation method thereof
10/24/2012CN101814558B LED packaging structure
10/24/2012CN101809088B Thermosetting resin composition for light reflection, substrate made therefrom for photosemiconductor element mounting, process for producing the same, and photosemiconductor device
10/24/2012CN101387549B Selfluminous device
10/24/2012CN101276872B Method for forming electrode for group iii nitride compound semiconductor light-emitting device
10/23/2012USRE43759 Multiple wavelength light emitting device, electronic apparatus, and interference mirror
10/23/2012US8294386 Light emitting device with light emitting cells arrayed
10/23/2012US8294363 Light-emitting device with improved brightness control and narrow frame and electronic apparatus with the light-emitting device
10/23/2012US8294357 Wavelength conversion element and light emitting device
10/23/2012US8294356 Light-emitting element lamp and lighting equipment
10/23/2012US8294263 Light-emitting diode packaging structure and module and assembling method thereof
10/23/2012US8294179 Optical device structure using GaN substrates and growth structures for laser applications
10/23/2012US8294178 Light emitting device using compound semiconductor
10/23/2012US8294177 Light emitting device utilizing a LED chip
10/23/2012US8294176 Light emitting apparatus, and method for manufacturing the same, and lighting system
10/23/2012US8294175 Light-emitting device and display
10/23/2012US8294174 Light-emitting device
10/23/2012US8294173 Light emitting element
10/23/2012US8294172 Method of fabricating vertical devices using a metal support film
10/23/2012US8294171 Light emitting device having plurality of non-polar light emitting cells and method of fabricating the same
10/23/2012US8294170 Light emitting device and method of fabricating the same