Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
11/2012
11/22/2012US20120295380 Etchant and method of manufacturing an array substrate using the same
11/22/2012US20120295378 Semiconductor light-emitting device and method for manufacturing the same
11/22/2012US20120295377 Method for manufacturing nitride semiconductor device
11/22/2012US20120295376 Method for manufacturing a led array device, and led array device manufactured thereby
11/22/2012US20120295375 Peeling method and method for manufacturing display device using the peeling method
11/22/2012US20120295374 Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die
11/22/2012US20120295373 Method of manufacturing nitride semiconductor light emitting element
11/22/2012US20120294326 Method for Producing a Laser Device
11/22/2012US20120294042 Led module, backlight unit including the led module, and method for manufacturing the led module
11/22/2012US20120294025 Light emitting device assembly and headlamp including the same
11/22/2012US20120293995 Led light assembly and method for construction thereof
11/22/2012US20120293985 Lighting device and display device
11/22/2012US20120293852 Display substrate, method of manufacturing the same and display panel having the same
11/22/2012US20120293738 Blue phase liquid crystal display device and manufacturing method thereof
11/22/2012US20120292661 Fluorinated curable resin composition
11/22/2012US20120292660 Led device, method of manufacturing the same, and light-emitting apparatus
11/22/2012US20120292658 Semiconductor optoelectronic converting system and the fabricating method thereof
11/22/2012US20120292657 Semiconductor light-emitting structure
11/22/2012US20120292655 Light emitting diode carrier
11/22/2012US20120292654 Light emitting device
11/22/2012US20120292653 Semiconductor light emitting device
11/22/2012US20120292651 Light emitting device package and manufacturing method thereof
11/22/2012US20120292650 Semiconductor light emitting device
11/22/2012US20120292649 Semiconductor light emitting device, wafer, and method for manufacturing nitride semiconductor crystal layer
11/22/2012US20120292648 Nitride semiconductor device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer
11/22/2012US20120292647 Organic electroluminescent light source
11/22/2012US20120292646 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same
11/22/2012US20120292644 Led package and method of manufacturing the same
11/22/2012US20120292643 Led module and image sensor module
11/22/2012US20120292640 Solid State Device
11/22/2012US20120292634 Galium-nitride light emitting device of microarray type structure and manufacturing thereof
11/22/2012US20120292633 Light emitting diode array and method for manufacturing the same
11/22/2012US20120292632 Nitride semiconductor device, nitride semiconductor wafer and method for manufacturing nitride semiconductor layer
11/22/2012US20120292631 Semiconductor light emitting device
11/22/2012US20120292630 Led substrate and led
11/22/2012US20120292629 Light emitting diode and method of fabrication thereof
11/22/2012US20120292626 Optical and thermal energy cross-linkable insulating layer material for organic thin film transistor
11/22/2012US20120292625 Array substrate and manufacturing method thereof
11/22/2012US20120292624 Array substrate, method for fabricating the same and liquid crystal display device
11/22/2012US20120292620 Pixel structure and manufacturing method thereof
11/22/2012US20120292610 Oxide semiconductor devices, methods of manufacturing oxide semiconductor devices, display devices having oxide semiconductor devices, methods of manufacturing display devices having oxide semiconductor devices
11/22/2012US20120292595 Light emitting device including semiconductor nanocrystals
11/22/2012US20120292594 Device including quantum dots and method for making same
11/22/2012US20120292593 Nitride semiconductor device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer
11/22/2012US20120292592 Semiconductor light emitting device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer
11/22/2012US20120291862 High efficiency nanostructured photvoltaic device manufacturing
11/22/2012DE202012009416U1 Leuchtvorrichtung Lighting device
11/22/2012DE112010003715T5 Baugruppenbildung von elektronischen Bauelementen auf Waferebene Assemblies formation of electronic components at the wafer level
11/22/2012DE102012010204A1 Verfahren zur Herstellung von Leuchtdioden Process for the preparation of light emitting diodes
11/22/2012DE102012010203A1 Aushärtbare flüssige Leuchtdioden-Einkapselungsformulierung mit hohem Brechungsindex Curable liquid light-Einkapselungsformulierung high refractive index
11/22/2012DE102011102032A1 Optoelektronisches Halbleitermodul und Display mit einer Mehrzahl derartiger Module An optoelectronic semiconductor module and display with a plurality of such modules
11/22/2012DE102011101645A1 Mischlichtquelle Mixed light source
11/22/2012DE102011076128A1 Support system for light module e.g. LED module used in office, has light module that is mounted over support portion and contact with electric wires of support portion
11/22/2012DE102011050450A1 Optoelektronischer Halbleiterchip, optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements The optoelectronic semiconductor chip, optoelectronic semiconductor device and method for producing an optoelectronic semiconductor component,
11/21/2012EP2525420A2 Semiconductor light emitting device
11/21/2012EP2525419A2 Light emitting device package and manufacturing method thereof
11/21/2012EP2525418A2 Light emitting device assembly and headlamp including the same
11/21/2012EP2525417A2 Nitride semiconductor device, nitride semiconductor wafer and method for manufacturing nitride semiconductor layer
11/21/2012EP2525407A2 Nitride semiconductor device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer
11/21/2012EP2525392A1 Method for forming metal oxide thin film pattern using nanoimprint and manufacturing method of led element using same
11/21/2012EP2524401A1 Iii-v light emitting device including a light extracting structure
11/21/2012EP2524400A1 Method of forming a composite substrate and growing a iii-v light emitting device over the composite substrate
11/21/2012EP2524399A1 Semiconductor light emitting device with layer compensating for the thermal expansion of the substrate
11/21/2012EP2523918A1 Optoelectronic semiconductor part containing alkali-free and halogen-free metal phosphate
11/21/2012CN202549934U LED (light-emitting diode) encapsulation structure
11/21/2012CN202549933U Semiconductor diode lead rack improved structure
11/21/2012CN202549932U High luminous efficiency integrated LED component
11/21/2012CN202549931U Wavelength conversion device and light emitting device
11/21/2012CN202549930U LED (light emitting diode) module structure with fluorescence sheet
11/21/2012CN202549929U Multi chips on board (MCOB) packaging structure being efficient in heat dissipation
11/21/2012CN202549928U MCOB (multichip on board) encapsulation device provided with doped fluorescent powder
11/21/2012CN202549927U White light LED device
11/21/2012CN202549926U Light emitting device
11/21/2012CN202549925U Light-emitting diode package and used PCB (Printed Circuit Board) type heat radiating base board
11/21/2012CN202549924U Novel light-emitting diode (LED) device
11/21/2012CN202549923U Plaster type support with high lighting efficiency
11/21/2012CN202549922U Three-dimensional fluorescent powder packaging structure for light-emitting diode (LED) device
11/21/2012CN202549921U Light-emitting diode (LED) packaging device with silver colloid guide structure
11/21/2012CN202549920U Packaging structure of LED chip integration
11/21/2012CN202549919U Light emitting diode (LED) lamp, LED bracket and material belt structure for LED bracket
11/21/2012CN202549918U Fluorescent powder coating and packaging structure
11/21/2012CN202549917U High luminous efficiency spatial luminescence LED element
11/21/2012CN202549916U Light-emitting diode (LED) integration packaging module
11/21/2012CN202549915U Semiconductor light-emitting diode (LED) device
11/21/2012CN202549914U Luminous element
11/21/2012CN202549913U Growth substrate for composite gallium-nitride-based semiconductor
11/21/2012CN202549912U ZnO-base quantum well light emitting diode
11/21/2012CN202549911U LED (Light-Emitting Diode) chip carrier positioning adsorption device
11/21/2012CN202549910U Absorbing device for locating LED chip carrier
11/21/2012CN202549909U Novel die bonder with ejector pin structure
11/21/2012CN202549908U PCB (printed circuit board) fixture structure for die bonder
11/21/2012CN202549907U Automatic material receiving and feeding device of LED (Light-Emitting Diode) packaging equipment
11/21/2012CN202549840U Multi-wafer integration type white-light light emitting diode (LED) packaging structure
11/21/2012CN202549839U Novel LED (Light-Emitting Diode) light-emitting chip and LED lamp formed by assembling same
11/21/2012CN202549838U LED packaging structure containing silver heat exchange layer
11/21/2012CN202549837U White light LED (Light-Emitting Diode)
11/21/2012CN202549836U Light emitting diode
11/21/2012CN202549250U High-resolution LED indoor display screen dot matrix module
11/21/2012CN202542453U Planar material taking system of die bonder
11/21/2012CN202540126U Ultra-precision chemical-mechanical polishing machine
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