Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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10/11/2012 | US20120256208 Light-Emitting Device, Electronic Appliance, and Lighting Device |
10/11/2012 | US20120256206 Led module with cooling passage |
10/11/2012 | US20120256205 Led lighting module with uniform light output |
10/11/2012 | US20120256204 Light-Emitting Device and a Method of Manufacturing Light-Emitting Device |
10/11/2012 | US20120256202 Organic light emitting diode display and manufacturing method thereof |
10/11/2012 | US20120256201 Organic light emitting diode display and manufacturing method thereof |
10/11/2012 | US20120256200 High efficiency leds |
10/11/2012 | US20120256199 Display device and a method of manufacturing the same |
10/11/2012 | US20120256198 Led package structure for increasing the light uniforming effect |
10/11/2012 | US20120256197 Organic electroluminescence element |
10/11/2012 | US20120256191 Epitaxial growth method and devices |
10/11/2012 | US20120256187 Double substrate multi-junction light emitting diode array structure |
10/11/2012 | US20120256186 Organic light-emitting display device and method of manufacturing the same |
10/11/2012 | US20120256185 Semiconductor device and process for production thereof, and display device |
10/11/2012 | US20120256176 Thin film transistor, organic luminescence display including the same, and method of manufacturing the organic luminescence display |
10/11/2012 | US20120256164 Optoelectronic device and the manufacturing method thereof |
10/11/2012 | US20120256163 Light emitting unit and display device including the same |
10/11/2012 | US20120256162 Light emitting diode and manufacturing method thereof |
10/11/2012 | US20120256161 Light Diode |
10/11/2012 | US20120256159 LED Device Architecture Employing Novel Optical Coating and Method of Manufacture |
10/11/2012 | US20120256158 Al(x)Ga(1-x)N-CLADDING-FREE NONPOLAR III-NITRIDE BASED LASER DIODES AND LIGHT EMITTING DIODES |
10/11/2012 | DE102011016567A1 Verfahren zum Herstellen eines optoelektronischen Bauelements und derart hergestelltes Bauelement A method for producing an optoelectronic component and such component produced |
10/11/2012 | DE102011016302A1 Optoelektronischer Halbleiterchip The optoelectronic semiconductor chip |
10/11/2012 | DE102011001928A1 Farbkonversionselement sowie Lampe Color conversion element and lamp |
10/10/2012 | EP2509122A2 Encapsulating sheet, light emitting diode device, and a method for producing the same |
10/10/2012 | EP2509121A1 Semiconductor Light Emitting Device |
10/10/2012 | EP2509120A1 Semiconductor device and method |
10/10/2012 | EP2509119A1 Light emitting element and method for manufacturing same |
10/10/2012 | EP2508789A1 Illumination device, and display device |
10/10/2012 | EP2508788A1 Light emitting module, planar light source, liquid crystal display device, and illumination device |
10/10/2012 | EP2508545A1 Thermosetting resin composition and photosemiconductor encapsulation material |
10/10/2012 | EP2508255A1 Uv-irradiation apparatus |
10/10/2012 | EP2507820A2 Semiconductor material doping |
10/10/2012 | EP2507818A2 Method of manufacturing nitride semiconductor device |
10/10/2012 | CN202488876U Metal-based circuit board with radiating structure for LED (Light Emitting Diode) packaging |
10/10/2012 | CN202488866U Printed circuit board applying metal substrate to penetrate heat path |
10/10/2012 | CN202487666U Packaging structure for high-power LEDs |
10/10/2012 | CN202487665U Lead frame for producing light-emitting diode |
10/10/2012 | CN202487664U Lateral reflection-type light-emitting diode (LED) integrated packaging structure |
10/10/2012 | CN202487663U Free-form surface lens |
10/10/2012 | CN202487662U Light-emitting diode (LED) package structure capable of improving light extraction efficiency |
10/10/2012 | CN202487661U Light-emitting diode (LED) package |
10/10/2012 | CN202487660U Wafer-level light emitting diode packaging structure |
10/10/2012 | CN202487659U LED made from composite fluorescent conversion body |
10/10/2012 | CN202487658U Mixed light light-emitting diode |
10/10/2012 | CN202487657U Composite type light-emitting diode (LED) package substrate |
10/10/2012 | CN202487656U All-dimensional lighting LED packaging structure |
10/10/2012 | CN202487655U LED (light-emitting diode) package |
10/10/2012 | CN202487654U High-power ceramic LED (light-emitting diode) wireless packaging structure |
10/10/2012 | CN202487653U TOP light-emitting diode (LED) component |
10/10/2012 | CN202487652U Novel aluminum substrate |
10/10/2012 | CN202487651U LED (light-emitting diode) and LED support |
10/10/2012 | CN202487650U Novel surface mounted light-emitting diode (LED) with radiating fins |
10/10/2012 | CN202487649U Light-emitting diode (LED) support |
10/10/2012 | CN202487648U LED (light-emitting diode) bearing seat |
10/10/2012 | CN202487647U Light-emitting diode (LED) light-emitting device with insulation protection device |
10/10/2012 | CN202487646U White light light-emitting diode (LED) with high color rendering |
10/10/2012 | CN202487645U LED light-emitting device |
10/10/2012 | CN202487644U LED chip capable of improving current transmission |
10/10/2012 | CN202487643U LED (light-emitting diode) chip structure with superimposed electrodes |
10/10/2012 | CN202487642U Packaging fixture assembly of SMD (surface mount device) light emitting diodes |
10/10/2012 | CN202487641U Solid crystal machine |
10/10/2012 | CN202487640U Led固晶机 Led Bonder |
10/10/2012 | CN202487574U Three-primary-color light-emitting diode for display screen |
10/10/2012 | CN202487573U Chromatic-aberration-free LED (light-emitting diode) module light source device |
10/10/2012 | CN202487572U Integrated LED (light-emitting diode) packaging structure |
10/10/2012 | CN202487571U LED (light-emitting diode) integration module |
10/10/2012 | CN202487570U Positive and negative pole reversal connection parallel LED packaging structure |
10/10/2012 | CN202487569U LED module group |
10/10/2012 | CN102725872A LED-packaging resin body, LED device, and method for manufacturing LED device |
10/10/2012 | CN102725871A Light-emitting diode, light-emitting diode lamp and lighting device |
10/10/2012 | CN102725870A Light-emitting diode, light-emitting diode lamp and lighting device |
10/10/2012 | CN102725685A Light emitting element drive device and mobile apparatus |
10/10/2012 | CN102725584A Led灯单元 Led lamp unit |
10/10/2012 | CN102725356A 可固化组合物 The curable composition |
10/10/2012 | CN102725334A Prepreg, laminate, metal-foil-clad laminate, circuit board, and circuit board for led mounting |
10/10/2012 | CN102724810A LED circuit board with circuits flexible to be detached and LED module |
10/10/2012 | CN102723430A Fin type heat radiator with high heat radiating performance |
10/10/2012 | CN102723429A Vertical-like type light-emitting diode and manufacturing method thereof |
10/10/2012 | CN102723428A Surface-mounted LED (Light-Emitting Diode) bracket and manufacturing method thereof |
10/10/2012 | CN102723427A Eutectic crystal welding process for LED wafers |
10/10/2012 | CN102723426A Light emitting diode (LED) image projection structure |
10/10/2012 | CN102723425A Integrated preparation method for LED fluorescent powder coating |
10/10/2012 | CN102723424A Method for preparing fluorescent wafer for LED (light-emitting diode) |
10/10/2012 | CN102723423A Gold-wire-free double-faced light-emergence packaging method and packaging structure for high-power white-light light emitting diode (LED) device |
10/10/2012 | CN102723422A Wavelength conversion apparatus and luminous apparatus |
10/10/2012 | CN102723421A Wavelength conversion apparatus and luminous apparatus |
10/10/2012 | CN102723420A Support and LED lamp |
10/10/2012 | CN102723419A Wide-angle LED packaging device |
10/10/2012 | CN102723418A Conformal coating white light LED chip structure possessing fluorescent characteristic passivation layer |
10/10/2012 | CN102723417A Light-emitting diode (LED) chip convenient to route and preparation method thereof |
10/10/2012 | CN102723416A LED epitaxial wafer and manufacturing method thereof |
10/10/2012 | CN102723415A Inversion high voltage alternating/direct current light-emitting diode and manufacture method thereof |
10/10/2012 | CN102723414A Preparation method for epitaxial structure body |
10/10/2012 | CN102723413A Substrate with microstructure and preparation method thereof |
10/10/2012 | CN102723412A White-light LED chip structure possessing embedded-type silver nanoparticle |
10/10/2012 | CN102723411A LED chip structure possessing nickel indium tin oxide spin electron injection layer |
10/10/2012 | CN102723410A Production method of light emitting diode device and light emitting diode element |
10/10/2012 | CN102723409A White-light LED epitaxial layer structure of dynamic anisotropy coating |
10/10/2012 | CN102723408A Method for preparing semiconductor epitaxial structure |