Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
10/2012
10/04/2012US20120249911 Liquid crystal display device and method of manufacturing liquid crystal display device
10/04/2012US20120249909 Array substrate and liquid crystal display device
10/04/2012US20120249904 Display device and electronic unit
10/04/2012US20120249902 Liquid crystal display and manufacturing method thereof
10/04/2012US20120249497 Display Device
10/04/2012US20120249454 Display device and electronic unit
10/04/2012US20120249009 High speed light emitting semiconductor methods and devices
10/04/2012US20120248633 Thin-film device, method of manufacturing the same, and method of manufacturing image display apparatus
10/04/2012US20120248498 Curable epoxy resin composition
10/04/2012US20120248497 Optoelectronic devices and coatings therefore, and methods for making and using the same
10/04/2012US20120248496 Optoelectronic devices and coatings therefore, and methods for making and using the same
10/04/2012US20120248495 Light-reflective anisotropic conductive paste and light-emitting device
10/04/2012US20120248494 Optoelectronic Semiconductor Chip and Method for Fabricating an Optoelectronic Semiconductor Chip
10/04/2012US20120248493 Electrical and/or electronic device with elastic contact element
10/04/2012US20120248492 Optoelectronic Component
10/04/2012US20120248491 Semiconductor light-emitting element, method for manufacturing the semiconductor light-emitting element and lamp that uses the semiconductor light-emitting element
10/04/2012US20120248490 Nitride semiconductor light-emitting device and production method thereof
10/04/2012US20120248489 Light-Emitting Device and Manufacturing Method Thereof
10/04/2012US20120248488 Light-Emitting Diode Package and Manufacturing Method Thereof
10/04/2012US20120248487 Light emitting diode packaging structure
10/04/2012US20120248486 Led package and fabrication method of the same
10/04/2012US20120248485 Producing method of light emitting diode device and light emitting diode element
10/04/2012US20120248484 Light emitting diode device and producing method thereof
10/04/2012US20120248483 Light emitting device and method for manufacturing the same
10/04/2012US20120248482 Led package and method for manufacturing the same
10/04/2012US20120248481 Wafer level light emitting diode package and method of fabricating the same
10/04/2012US20120248480 Display device and method of manufacturing the same
10/04/2012US20120248479 LED Device Utilizing Quantum Dots
10/04/2012US20120248478 Pixel via and methods of forming the same
10/04/2012US20120248474 Light emitting element, illumination device, and display apparatus
10/04/2012US20120248473 Light emitting semiconductor structure
10/04/2012US20120248470 Display device and method for manufacturing the same
10/04/2012US20120248469 Light emitting apparatus
10/04/2012US20120248464 Semiconductor light emitting device and head mount display device
10/04/2012US20120248459 Substrate, template substrate, semiconductor light emitting element, semiconductor light emitting element producing method, illumination device using semiconductor light emitting element and electronic device
10/04/2012US20120248458 Vertically structured group iii nitride semiconductor led chip and method for manufacturing the same
10/04/2012US20120248457 Group iii nitride semiconductor multilayer structure and production method thereof
10/04/2012US20120248456 Nitride semiconductor multilayer structure, method for producing same, and nitride semiconductor light-emitting element
10/04/2012US20120248453 Electro-optical device and electronic device
10/04/2012US20120248447 Electronic panel
10/04/2012US20120248445 Amorphous multicomponent dielectric based on the mixture of high band gap and high k materials, respective devices and manufacture
10/04/2012US20120248444 Thin film transistor array panel and manufacturing method of the same
10/04/2012US20120248435 Light-emitting device
10/04/2012US20120248411 Nitride semiconductor light emitting device and fabrication method thereof
10/04/2012US20120248410 Thin Film Forming Method and Quantum Dot Device
10/04/2012US20120248409 Simultaneous Modulation of Quantum Dot Photoluminescence using Orthogonal Fluorescence Resonance Energy Transfer (FRET) and Charge Transfer Quenching (CTQ)
10/04/2012US20120248408 Light-emitting device and method of manufacturing the same
10/04/2012US20120248407 Group iii nitride semiconductor light-emitting device
10/04/2012US20120248406 Group iii nitride semiconductor light-emitting device
10/04/2012US20120248405 Semiconductor light-emitting structure
10/04/2012US20120248404 Gallium-nitride light emitting diode and manufacturing method thereof
10/04/2012US20120248403 Layer assembly
10/04/2012US20120248402 Photon emitter embedded in metallic nanoslit array
10/04/2012DE102012205178A1 Keramische Leiterplatte mit Al-Kühler Ceramic PCB with Al-cooler
10/04/2012DE102012006613A1 Method for manufacturing optical component e.g. gallium-nitride based LED used in optoelectronic device, involves setting miscut angle of substrate to predetermined value from m-direction of c-plane
10/04/2012DE102011015821A1 Optoelektronischer Halbleiterchip The optoelectronic semiconductor chip
10/04/2012DE102011015726A1 Halbleiterchip, Display mit einer Mehrzahl von Halbleiterchips und Verfahren zu deren Herstellung Semiconductor chip, display with a plurality of semiconductor chips and processes for their preparation
10/04/2012DE102011015725A1 Verfahren zum Vereinzeln eines Bauelementverbunds Method for separating a composite component
10/04/2012DE102011006688A1 LED chip for use in LED illumination device of e.g. projector, has inwardly reflective layer formed on radiation exit side using wafer process, where aperture is formed at edge section of reflective layer for exit of radiation
10/04/2012DE102011001680A1 Verfahren zum Herstellen eines Beleuchtungskörpers auf LED-Basis A method for producing a LED-based lighting fixture
10/04/2012DE102007052821B4 Verfahren zur Herstellung eines Subträgers und eines optoelektronischen Bauelements A process for the preparation of a subcarrier and an optoelectronic component
10/04/2012DE10151092B4 Verfahren zur Herstellung von planaren und rißfreien Gruppe-III-Nitrid-basierten Lichtemitterstrukturen auf Silizium Substrat A process for preparing crack-free planar and group III nitride-based light emitting structures on a silicon substrate
10/03/2012EP2506322A2 Production method of light emitting diode device and light emitting diode element
10/03/2012EP2506321A1 Light-emitting diode chip
10/03/2012EP2506320A1 Substrate for led mounting
10/03/2012EP2506319A2 Semiconductor light emitting device and head mount display device
10/03/2012EP2506318A2 Light emitting diode device and producing method thereof
10/03/2012EP2506317A1 Light-emitting device
10/03/2012EP2506316A1 Semiconductor element and method for manufacturing semiconductor element
10/03/2012EP2506315A2 Light-emitting device and method of manufacturing the same
10/03/2012EP2506301A2 Luminous-body flexible board and luminous device
10/03/2012EP2506292A1 Process for production of contact structure for organic semiconductor device, and contact structure for organic semiconductor device
10/03/2012EP2504895A1 Laser emission system, heterostructure and active zone having coupled quantum sub-wells, and use for 1.55 m laser emission
10/03/2012EP2504870A1 Wavelength converted semiconductor light emitting diode
10/03/2012EP2504869A1 Led with improved injection efficiency
10/03/2012EP2504868A1 Iii-v light emitting device with thin n-type region
10/03/2012EP2504861A1 Housing for an opto-electronic component and method for producing a housing
10/03/2012EP2504615A1 Led lamp having a pin socket for halogen lamps ('bi-pin')
10/03/2012CN202474043U Radiating fin for high-power light-emitting diode (LED)
10/03/2012CN202474042U High heat dissipation digital tube packaging structure
10/03/2012CN202474041U Novel LED heat radiation system
10/03/2012CN202474040U LED lamp with highly level chip bonding pad and external pin bonding area
10/03/2012CN202474039U Light-emitting diode (LED) chip non-welding connector
10/03/2012CN202474038U Light-emitting diode (LED) packaging structure and display screen
10/03/2012CN202474037U Novel integrated big power LED welding wire structure
10/03/2012CN202474036U Novel big power LED welding wire structure
10/03/2012CN202474035U LED chip vertical structure capable of increasing light extraction efficiency
10/03/2012CN202474034U Surface-mounted LED (light emitting diode) device adopting flexible rubbers to protect inner core
10/03/2012CN202474033U Led
10/03/2012CN202474032U Led packaging structure
10/03/2012CN202474031U High-power LED bracket
10/03/2012CN202474030U Light-emitting diode (LED) supporting frame with heat dissipation plate and metal base plate integrated
10/03/2012CN202474029U Quickly radiated high-power light-emitting diode (LED) chip
10/03/2012CN202474028U Wavelength conversion device and light-emitting device
10/03/2012CN202474027U Combined type LED (Light-Emitting Diode) substrate
10/03/2012CN202474026U Sheet type LED ceramic packaging base
10/03/2012CN202474025U High power LED (light-emitting diode) support structure
10/03/2012CN202474024U High-power LED packaging structure
10/03/2012CN202474023U Highly antistatic blue light emitting diode
10/03/2012CN202474022U LED support, LED, and LED lighting device
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