Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
10/2012
10/17/2012CN102738315A Nitride light emitting diode structure
10/17/2012CN102738314A Device for light emitting diode substrate separation
10/17/2012CN102738313A Chip cutting method for increasing LED chip light extraction
10/17/2012CN102738193A Double substrate multi-junction light emitting diode array structure
10/17/2012CN102738137A Light emitting diode (LED) lamp panel packaging structure and method thereof
10/17/2012CN102738136A Distributed high-voltage light emitting diode (LED) module
10/17/2012CN102737980A Wafer grinding method
10/17/2012CN102737962A Epitaxial structure and preparation method thereof
10/17/2012CN102737555A Light emitting diode (LED) display screen and manufacturing method thereof
10/17/2012CN102734678A High-power LED (Light-Emitting Diode) light source
10/17/2012CN102734658A LED (Light-Emitting Diode) luminous body and LED lamp with same
10/17/2012CN102734647A White light illumination system
10/17/2012CN102732158A Solid crystal glue and LED packaging method
10/17/2012CN102732040A Silicone resin composition and optical semiconductor device using the composition
10/17/2012CN102731743A Preparation of white thermosetting resin used for LED light having encapsulating film
10/17/2012CN102730980A High-reliability and high-efficiency fluorescent glass for packaging LED (light emitting diode) and preparation method thereof
10/17/2012CN102730974A Slurry for preparation of glass fluorescent layer used for LED encapsulation
10/17/2012CN102728507A Fluorescent powder applying device and method capable of detecting instantly color temperature of white light in manufacturing process
10/17/2012CN102214738B Method for preparing TiO2 (titanium dioxide) nano-pillar array on surface of LED (light-emitting diode) epitaxial wafer
10/17/2012CN102214587B Method for manufacturing multi-layer array type light emitting diode
10/17/2012CN102157657B GaN-based light emitting diode and preparation method thereof
10/17/2012CN101971344B Radiation-emitting semiconductor chip having protection against electrostatic discharges and corresponding production method
10/17/2012CN101919076B Group III nitride semiconductor device, epitaxial substrate, and method for manufacturing group iii nitride semiconductor device
10/17/2012CN101851432B Resin composition and sheet containing phosphor, and light emitting element using such composition and sheet
10/17/2012CN101826587B Preparation method of polystyrene semispheres used as microlenses for improving LED light outlet efficiency
10/17/2012CN101747860B Single component organic silicon packaging glue cured by ultraviolet for high-power LED
10/17/2012CN101740692B Method for improving brightness of LED chip
10/17/2012CN101621094B Method for manufacturing semiconductor component and structure thereof
10/17/2012CN101584055B Light emitting device package and manufacturing method thereof
10/17/2012CN101464186B Photometry apparatus of luminophor
10/17/2012CN101291973B 热固性树脂组合物和光半导体密封材料 The thermosetting resin composition and an optical semiconductor sealing material
10/17/2012CN101180420B Method for growth of GaN single crystal, method for preparation of GaN substrate, process for producing GaN-based element, and GaN-based element
10/17/2012CN101071226B Backlight source for liquid crystal display device and liquid crystal display device using same
10/16/2012US8288943 Illumination device with LED and a transmissive support comprising a luminescent material
10/16/2012US8288942 High efficacy white LED
10/16/2012US8288937 White LED, and backlight and liquid crystal display device using the same
10/16/2012US8288935 Light emitting diode apparatus and manufacturing method thereof
10/16/2012US8288794 Nitride semiconductor layers on substrate having ridge portions with inflow prevention walls near engraved regions
10/16/2012US8288793 LED package having a lead frame
10/16/2012US8288792 Semiconductor chip assembly with post/base/post heat spreader
10/16/2012US8288791 Housing body and method for production thereof
10/16/2012US8288790 Light-emitting device
10/16/2012US8288788 Optical semiconductor device having uneven semiconductor layer with non-uniform carrier density
10/16/2012US8288787 Thin film light emitting diode
10/16/2012US8288786 Light emitting device and method for manufacturing the same
10/16/2012US8288785 Lead frame having light-reflecting layer, light emitting diode having the lead frame, and backlight unit having the light emitting diode
10/16/2012US8288784 Organic light emitting display device
10/16/2012US8288782 Backlight module and light-emitting source package structure thereof
10/16/2012US8288781 Light emitting device and method of fabricating the same
10/16/2012US8288780 Organic light emitting display device
10/16/2012US8288776 Hybrid electric device using piezoelectric polymer substrate
10/16/2012US8288271 Method for reworking antireflective coating over semiconductor substrate
10/16/2012US8288186 Substrate for growing a III-V light emitting device
10/16/2012US8287769 Charge transport compositions and electronic devices made with such compositions
10/16/2012US8287325 Flexible display and manufacturing method of the same
10/11/2012WO2012138512A1 Methods of fabricating light emitting devices including multiple sequenced luminophoric layers, and devices so fabricated
10/11/2012WO2012137837A1 Polycarboxylic acid resin and composition thereof
10/11/2012WO2012137781A1 Semiconductor stacked body, method for manufacturing same, and semiconductor element
10/11/2012WO2012137769A1 Light-emitting diode, light-emitting diode lamp, and lighting device
10/11/2012WO2012137552A1 Light emitting device
10/11/2012WO2012137462A1 Nitride semiconductor element and method for producing same
10/11/2012WO2012137406A1 Semiconductor light-emitting device
10/11/2012WO2012136849A1 Color conversion element and lamp
10/11/2012WO2012136579A1 Ceramic printed circuit board comprising an al cooling body
10/11/2012WO2012136460A1 Optoelectronic semiconductor chip
10/11/2012WO2012136459A1 Method for producing an optoelectronic component and component produced in such manner
10/11/2012WO2012136011A1 Light emitting diode package structure
10/11/2012WO2012136009A1 Led structure and manufacturing method thereof
10/11/2012WO2012136007A1 Light emitting device with high conductive heat dissipation and manufacturing method thereof
10/11/2012WO2012135976A1 Led device having tilted peak emission and led display including such devices
10/11/2012WO2012109629A3 Light emitting device with dislocation bending structure
10/11/2012WO2012108636A3 Light emitting device having wavelength converting layer
10/11/2012WO2012108627A3 Light emitting diode having photonic crystal structure and method of fabricating the same
10/11/2012WO2012025888A3 Light source mount
10/11/2012US20120258559 Semiconductor substrate, semiconductor device, and manufacturing methods thereof
10/11/2012US20120258557 Group-iii nitride semiconductor laser device, method of fabricating group-iii nitride semiconductor laser device, and epitaxial substrate
10/11/2012US20120257901 Visible Light Communication Transmitter and Visible Light Communication System
10/11/2012US20120257170 Light-emitting device and projector
10/11/2012US20120257134 Transflective array substrate and transflective liquid displayer
10/11/2012US20120257133 Manufacturing method of liquid crystal display device and liquid crystal display device
10/11/2012US20120256973 Organic light emitting display device and method for manufacturing the same
10/11/2012US20120256896 Display module, and cellular phone and electronic device provided with display module
10/11/2012US20120256538 Light-emitting device, light bulb shaped lamp and lighting apparatus
10/11/2012US20120256228 Die-bonded led
10/11/2012US20120256226 Light emitting device, light emitting device package and lighting system including the same
10/11/2012US20120256225 Semiconductor device package including a paste member
10/11/2012US20120256224 Insulated substrate, process for production of insulated substrate, process for formation of wiring line, wiring substrate, and light-emitting element
10/11/2012US20120256223 Light emission device
10/11/2012US20120256222 Phosphor and light-emitting device
10/11/2012US20120256221 Life-improved semiconductor light emitting device
10/11/2012US20120256220 Encapsulating sheet, light emitting diode device, and a method for producing the same
10/11/2012US20120256219 Light emitting diode package and method of manufacturing the same
10/11/2012US20120256218 Organic light emitting diode display
10/11/2012US20120256217 Light-emitting diode package
10/11/2012US20120256215 Package having light-emitting element and fabrication method thereof
10/11/2012US20120256214 Led package structure
10/11/2012US20120256213 Led structure and manufacturing method thereof
10/11/2012US20120256212 Tunable phosphor for luminescent
10/11/2012US20120256211 Methods of fabricating light emitting devices including multiple sequenced luminophoric layers, and devices so fabricated
10/11/2012US20120256210 Light emitting device and light emitting device package having the same