Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
11/2012
11/21/2012CN102792778A Led drive circuit
11/21/2012CN102792772A Light-emitting element, light-source apparatus and projection-type display apparatus
11/21/2012CN102792533A Nitride semiconductor light-emitting element
11/21/2012CN102792474A Miniature surface mount device with large pin pads
11/21/2012CN102792473A White light illumination device
11/21/2012CN102792471A Light-emitting diode element and light-emitting diode device
11/21/2012CN102792470A Nitrogen compound semiconductor light emitting element and manufacturing method thereof
11/21/2012CN102792469A Transparent LED wafer module and method for manufacturing same
11/21/2012CN102792468A Light-emitting element and image display device using said light-emitting element
11/21/2012CN102792467A Light emitting device, method for manufacturing light emitting device, illuminating device, and backlight
11/21/2012CN102792466A Semiconductor light-emitting element, and method for producing same
11/21/2012CN102792411A Electronic device and method for manufacturing same
11/21/2012CN102792091A Illumination apparatus
11/21/2012CN102791801A Phosphor-containing cured silicone, process for production of same, phosphor-containing silicone composition, precursor of the composition, sheet-shaped moldings, LED package, light-emitting device, and process for production of LED-mounted substrate
11/21/2012CN102791760A Curable resin composition and cured article thereof
11/21/2012CN102791475A Laminate, method for producing same, and functional element using same
11/21/2012CN102790165A Semiconductor light emitting device
11/21/2012CN102790164A Light-emitting device
11/21/2012CN102790163A White light LED based on purple light LED chip and illuminating device of white light LED
11/21/2012CN102790162A Light emitting device package and manufacturing method thereof
11/21/2012CN102790161A Light emitting diode carrier
11/21/2012CN102790160A Wire bonding structure
11/21/2012CN102790159A Semiconductor light-emitting element packaging structure and manufacturing method thereof
11/21/2012CN102790158A Manufacturing method for GaN-based LED (Light Emitting Diode) chip for increasing extraction efficiency
11/21/2012CN102790157A Luminous element
11/21/2012CN102790156A Semiconductor light-emitting structure
11/21/2012CN102790155A Nitride semiconductor device, nitride semiconductor wafer and method for manufacturing nitride semiconductor layer
11/21/2012CN102790154A Production method of gallium nitride (GaN)-based light emitting diode (LED) chip with indium tin oxide (ITO) surface roughness
11/21/2012CN102790153A Manufacturing method for GaN-based LED (Light Emitting Diode) chip for coarsening p-GaN layer nanometer bowl-shaped surface
11/21/2012CN102790152A Epitaxial base material and manufacturing method thereof
11/21/2012CN102790151A Substrate for LED (Light Emitting Diode) chip and preparation method thereof
11/21/2012CN102790150A Manufacturing method for nanometer bowl-shaped sapphire pattern substrate
11/21/2012CN102790149A Light emitting diode and method of fabrication thereof
11/21/2012CN102790148A Growth substrate and light emitting device
11/21/2012CN102790147A Nitride semiconductor device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer
11/21/2012CN102790146A Semiconductor light emitting element
11/21/2012CN102790145A Semiconductor light source module, production method and substrate structure thereof
11/21/2012CN102790144A Method for manufacturing AlGaInP-LED (Light Emitting Diode) integrated micro display component with single-side electrode structure
11/21/2012CN102790143A Taking mechanism for full-automatic die bonder
11/21/2012CN102790142A Clamping positioning mechanism for full-automatic die bonder
11/21/2012CN102790141A Method of making light emitting diodes
11/21/2012CN102790140A Package structure and manufacturing method thereof
11/21/2012CN102790139A Method for manufacturing film gallium nitride (GaN) chip based on sapphire stripping
11/21/2012CN102790138A Production method for GaN-based film chip
11/21/2012CN102790137A Manufacturing method for GaN-based film chip
11/21/2012CN102790136A Manufacturing method for light emitting diode crystalline grains
11/21/2012CN102790071A AlGaInP-LED (Light Emitting Diode) integrated micro-display device with single-face electrode structure
11/21/2012CN102790045A Light emitting diode array and manufacturing method thereof
11/21/2012CN102789976A Manufacturing method for GaN (gallium nitride) based LED (light emitting diode) chip
11/21/2012CN102787294A Preparation method and use of titanium-doped zinc-magnesium aluminate film
11/21/2012CN102786909A Organic silicon light-cured packaging glue used for LED packaging and application
11/21/2012CN102786901A Conductive silver adhesive for high-power LED (light-emitting diode) and preparation method and curing and using method thereof
11/21/2012CN102786803A High refractive index curable liquid light emitting diode encapsulant formulation
11/21/2012CN102785932A Material loading mechanism of full automatic die bonder
11/21/2012CN102784437A Health care apparatus based on linear package of lighting-emitting diodes (LEDs)
11/21/2012CN102167908B Organopolysiloxane composition, and curing method and application thereof
11/21/2012CN102163654B Die bonding method
11/21/2012CN102157640B Method for manufacturing gallium nitride (GaN)-based light-emitting diode (LED) chip with p-GaN layer subjected to surface roughening
11/21/2012CN102148324B LED (light-emitting diode) chip with substrate condensing reflectors and manufacturing method of LED chip
11/21/2012CN102103990B Preparation method of multiple quantum well structure for photoelectric device
11/21/2012CN102074630B Light emitting diode and manufacturing method thereof
11/21/2012CN102064270B Feedback control method for glue dispenser
11/21/2012CN102054930B Light-emitting diode encapsulation method and jig
11/21/2012CN102017202B Housing for high-power LEDs
11/21/2012CN101944560B Manufacturing method of semiconductor photonic device substrate
11/21/2012CN101911320B Optoelectronic device with light directing arrangement and method of forming the arrangement
11/21/2012CN101887938B LED chip and manufacturing method thereof
11/21/2012CN101867008B LED packaging module capable of releasing stress
11/21/2012CN101866880B Method for separating base plate and semiconductor layer
11/21/2012CN101807658B High power LED encapsulating method
11/21/2012CN101776254B Light emitting diode lamp and photo engine thereof
11/21/2012CN101771128B Feeding device of crystallizing machine
11/21/2012CN101740560B Light-emitting apparatus, backlight apparatus, and display apparatus
11/21/2012CN101679861B M-c-n-o fluorescent substance
11/21/2012CN101617388B Nitride semiconductor substrate
11/21/2012CN101613601B Sr-Al-O-N series phosphor powder used in white light LED
11/21/2012CN101506946B Method for manufacturing group III nitride compound semiconductor light-emitting device, group III nitride compound semiconductor light-emitting device, and lamp
11/21/2012CN101496186B LED source with hollow collection lens
11/21/2012CN101491978B Line head and an image forming apparatus
11/21/2012CN101445645B White heat-hardening resin composition
11/21/2012CN101410480B Ferrous-metal-alkaline-earth-metal silicate mixed crystal phosphor and light emitting device using the same
11/21/2012CN101399305B Encapsulation construction and manufacturing method for photoelectric element
11/21/2012CN101379164B Phosphor, method for producing same, phosphor-containing composition, light-emitting device, image display, and illuminating device
11/21/2012CN101348719B Warm white LED and halogenide fluorescent powder thereof
11/21/2012CN101330121B Method of producing nitride semiconductor light-emitting device
11/20/2012US8314757 Apparatus for driving light emitting elements and electronic appliance employing the apparatus
11/20/2012US8314442 Light emitting device
11/20/2012US8314441 Optoelectronic component
11/20/2012US8314440 Light emitting diode chip and method of fabricating the same
11/20/2012US8314439 Light emitting diode with nanostructures and method of making the same
11/20/2012US8314438 Semiconductor chip assembly with bump/base heat spreader and cavity in bump
11/20/2012US8314437 Semiconductor light emitting device and method for manufacturing the same
11/20/2012US8314436 Light emitting device and manufacturing method thereof
11/20/2012US8314434 Light emitting diode module and method of making the same
11/20/2012US8314431 LED semiconductor element having increased luminance
11/20/2012US8314430 Optoelectronic component and method for the manufacture of a plurality of optoelectronic components
11/20/2012US8314415 Radiation-emitting semiconductor body
11/20/2012US8314346 Wiring board for light-emitting element
11/20/2012US8313963 Light emitting device
11/20/2012US8313962 Method for attaching optical components onto silicon-based integrated circuits
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