| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 08/18/1992 | US5139904 Method of producing high resolution and reproducible patterns |
| 08/18/1992 | US5139869 Thin dielectric layer on a substrate |
| 08/18/1992 | US5139852 Used for microelectronics such as semiconductor package; heat resistance, hermetic sealing, strees relieving, noncracking and high strength |
| 08/18/1992 | US5139851 Used for microelectronics such as semiconductor package; heat resistance, hermetic sealing, stree relieving, noncracking and high strength |
| 08/18/1992 | US5139633 Film-forming on substrate by sputtering |
| 08/18/1992 | US5139624 Method for making porous semiconductor membranes |
| 08/18/1992 | US5139610 Surrounding via-defining walls with recesses which act as barriers to retain vapor deposits and also protectively cover active regions |
| 08/18/1992 | US5139608 Method of planarizing a semiconductor device surface |
| 08/18/1992 | US5139606 Laser bilayer etching of GaAs surfaces |
| 08/18/1992 | US5139591 Laser deposition of crystalline boron nitride films |
| 08/18/1992 | US5139571 Fine abrasive particles in quaternary ammonium compound slurry |
| 08/18/1992 | US5139459 Clean transfer method and system therefor |
| 08/18/1992 | US5139383 Device for positioning objects within a sealed chamber |
| 08/18/1992 | CA1306551C Semiconductor device having tungsten plugs |
| 08/13/1992 | DE4203603A1 Recrystallisation of amorphous silicon films at low temp. - uses an anneal to reduce the hydrogen and fluorine content before recrystallisation under ion-implantation |
| 08/13/1992 | DE4203410A1 Lithography device for wafer structuring - has wafer support table, SXM base with reference structure, and jibs, each with STM sensor |
| 08/13/1992 | DE4200763A1 Semiconductor DRAM with read=out amplifier circuit - has driver assembly for energising first read=out amplifier sections, with MISFETs in driver assembly |
| 08/13/1992 | DE4103940A1 Finely-crystalline soldered joint for joining semiconductor chips to support - using solder foil, temp. of which is held just below the liquids after wetting support |
| 08/13/1992 | DE4103294A1 Electrically conductive vias through ceramic substrates - are made by drawing metal from tracks into holes by capillary action using filling of holes by suitable powder |
| 08/12/1992 | WO1992014261A1 Multichip module and integrated circuit substrates having planarized patterned surfaces |
| 08/12/1992 | EP0498752A1 Electrostatic chuck with diamond coating |
| 08/12/1992 | EP0498717A1 Buried localised oxidation process of a silicon substrate and corresponding integrated circuit |
| 08/12/1992 | EP0498713A2 Process of mounting miniature electronic components with solderable leads on a flexible substrate |
| 08/12/1992 | EP0498703A1 Process and device to place chips into receptacles provided in a substrate using an adhesive |
| 08/12/1992 | EP0498702A1 Process and apparatus for insertion of chips into receptacles of a substrate using an intermediate film |
| 08/12/1992 | EP0498663A2 Method for producing a semi conductor device using sputtering |
| 08/12/1992 | EP0498653A2 A method for measuring the diameter of single crystal ingot |
| 08/12/1992 | EP0498652A1 A single crystal pulling apparatus |
| 08/12/1992 | EP0498642A1 A semiconductor memory device |
| 08/12/1992 | EP0498622A2 Liquid vaporizer-feeder |
| 08/12/1992 | EP0498604A1 Semiconductor device having a teos based spin-on-glass and process for making the same |
| 08/12/1992 | EP0498580A1 Method for depositing a metal film containing aluminium by use of alkylaluminium halide |
| 08/12/1992 | EP0498567A1 Mixed CMOS/BiCMOS device |
| 08/12/1992 | EP0498550A1 Method of manufacturing via holes for multilayer interconnection of semiconductor devices |
| 08/12/1992 | EP0498521A1 Improved surface planarizing methods for integrated circuit devices |
| 08/12/1992 | EP0498499A1 Method of and device for repetitively imaging a mask pattern on a substrate |
| 08/12/1992 | EP0498496A1 Lithographic device with a suspended object table |
| 08/12/1992 | EP0498475A2 Method of manufacturing a semiconductor device |
| 08/12/1992 | EP0498449A2 Semiconductor integrated circuit device having dynamic burn-in circuit |
| 08/12/1992 | EP0498446A2 Multichip packaged semiconductor device and method for manufacturing the same |
| 08/12/1992 | EP0498336A1 Common-line connection for integrated memory array |
| 08/12/1992 | EP0498274A2 Electrolytic method for forming vias and through holes in copper-invar-copper core structures |
| 08/12/1992 | EP0498251A2 Word line driver circuit for dynamic random access memories |
| 08/12/1992 | EP0498250A1 Etching method for increased circuitized line width unitformity |
| 08/12/1992 | EP0498209A1 Dry etching method of a silicon based material, without use of a chlorofluorocarbon gas |
| 08/12/1992 | EP0498198A1 Hermetic device package for microelectronic frequency selection components |
| 08/12/1992 | EP0498148A2 TFT LCD display control system for displaying data upon detection of VRAM write access |
| 08/12/1992 | EP0498129A2 Latch and data out driver for memory arrays |
| 08/12/1992 | EP0498109A1 Method for manufacturing semiconductor device having a via hole |
| 08/12/1992 | EP0498101A1 Monolithic microwave IC oscillator |
| 08/12/1992 | EP0498055A1 Thermal annealing of semiconductor devices |
| 08/12/1992 | EP0498007A1 Method and apparatus for contactless testing |
| 08/12/1992 | EP0498006A1 Superheterodyning technique in the spatial frequency domain and structure for pattern registration measurement |
| 08/12/1992 | EP0497982A1 Semiconductor device and its manufacturing method |
| 08/12/1992 | EP0497963A1 Mounting of electronic devices |
| 08/12/1992 | EP0497948A1 Method and device for hermetic encapsulation of electronic components. |
| 08/12/1992 | EP0497909A1 Cryogenic probe station |
| 08/12/1992 | EP0497896A1 Non-photographic method for patterning organic polymer films. |
| 08/12/1992 | EP0493411A4 Method and apparatus for aligning mating form tools |
| 08/12/1992 | EP0417239A4 Method of forming contact bumps in contact pads |
| 08/12/1992 | EP0205571B1 Establishing and/or evaluating alignment by means of alignment marks |
| 08/12/1992 | EP0177544B1 Method of producing an isfet and same isfet |
| 08/12/1992 | CA2101426A1 Multichip module and integrated circuit substrates having planarized patterned surfaces |
| 08/11/1992 | USRE34025 Semiconductor device with isolation between MOSFET and control circuit |
| 08/11/1992 | US5138573 Non-volatile storage cell |
| 08/11/1992 | US5138520 Methods and apparatus for material deposition |
| 08/11/1992 | US5138518 Method for manufacturing a selective call receiver |
| 08/11/1992 | US5138439 Semiconductor device |
| 08/11/1992 | US5138432 Metal/disilicide interface free of oxygen and/or fluorine contamination achieved by depositing metal on C49 titanium disilicide phase then annealing to C54 phase |
| 08/11/1992 | US5138430 High performance versatile thermally enhanced IC chip mounting |
| 08/11/1992 | US5138429 Precisely aligned lead frame using registration traces and pads |
| 08/11/1992 | US5138427 Semiconductor device having a particular structure allowing for voltage stress test application |
| 08/11/1992 | US5138424 Positive working polyamic acid/imide photoresist compositions and their use as dielectrics |
| 08/11/1992 | US5138422 Semiconductor device which includes multiple isolated semiconductor segments on one chip |
| 08/11/1992 | US5138421 Buffer layer having getter and layer distortion buffering ability; reduction of crystallization defects such as dislocation and oxidation-induced stacking fault |
| 08/11/1992 | US5138419 Wafer scale integration device with dummy chips and relay pads |
| 08/11/1992 | US5138418 Transistor structure for testing emitter-base junction |
| 08/11/1992 | US5138417 High-frequency semiconductor device |
| 08/11/1992 | US5138413 Piso electrostatic discharge protection device |
| 08/11/1992 | US5138412 Dynamic ram, having an improved large capacitance |
| 08/11/1992 | US5138410 Nonvolatile semiconductor memory device having tunnel insulating film structure |
| 08/11/1992 | US5138409 High voltage semiconductor device having silicon-on-insulator structure with reduced on-resistance |
| 08/11/1992 | US5138407 Transistor made of 3-5 group semiconductor materials on a silicon substrate |
| 08/11/1992 | US5138406 Ion implantation masking method and devices |
| 08/11/1992 | US5138405 Quasi one-dimensional electron gas field effect transistor |
| 08/11/1992 | US5138403 High temperature Schottky barrier bypass diodes |
| 08/11/1992 | US5138256 Method and apparatus for determining the thickness of an interfacial polysilicon/silicon oxide film |
| 08/11/1992 | US5138190 Charge pump circuit |
| 08/11/1992 | US5138180 Wire bonding inspecting apparatus utilizing a controlling means for shifting from one inspected area to another |
| 08/11/1992 | US5138176 Projection optical apparatus using plural wavelengths of light |
| 08/11/1992 | US5138115 Carrierles surface mounted integrated circuit die |
| 08/11/1992 | US5138114 Hybrid/microwave enclosures and method of making same |
| 08/11/1992 | US5138105 Gas separation membrane |
| 08/11/1992 | US5137847 Method of producing GaAs single crystal substrate using three stage annealing and interstage etching |
| 08/11/1992 | US5137846 Applying a mixture of inorganic powder and cyanate ester; curing; protective coating; integrated circuit dies |
| 08/11/1992 | US5137845 Method of forming metal contact pads and terminals on semiconductor chips |
| 08/11/1992 | US5137843 Isolation method for semiconductor device |
| 08/11/1992 | US5137842 Stacked H-cell capacitor and process to fabricate same |
| 08/11/1992 | US5137840 Vertical bipolar transistor with recessed epitaxially grown intrinsic base region |
| 08/11/1992 | US5137839 Method of manufacturing a bipolar transistor having polysilicon layer which serves as an emitter electrode and passivating dangling bonds |