Patents for C23F 1 - Etching metallic material by chemical means (16,062)
01/2014
01/28/2014US8636915 Liquid processing apparatus and liquid processing method
01/28/2014US8636912 Package for an electronic device
01/28/2014US8636873 Plasma processing apparatus and structure therein
01/28/2014US8636872 Upper electrode and plasma processing apparatus
01/28/2014US8636871 Plasma processing apparatus, plasma processing method and storage medium
01/28/2014US8635972 Device for forming a film by deposition from a plasma
01/28/2014US8635971 Tunable uniformity in a plasma processing system
01/23/2014US20140024206 Etchant composition and method of forming metal wire and thin film transistor array panel using the same
01/23/2014US20140023827 Etching paste, method of preparing the same, and method of forming pattern using the same
01/23/2014US20140022839 Method and system for providing magnetic junctions having improved characteristics
01/23/2014US20140020835 Symmetrical inductively coupled plasma source with symmetrical flow chamber
01/23/2014US20140020708 Edge exclusion control with adjustable plasma exclusion zone ring
01/22/2014CN103534196A Method for achieving smooth side walls after bosch etch process
01/22/2014CN103526266A Method for processing micro-pit arrays on metal surface
01/22/2014CN103526211A Processing method for aluminum sheet valve in fuel channel of injector
01/22/2014CN103526206A Metal wire etchant and method for manufacturing metal wire using the same
01/22/2014CN103526205A Wet etching device
01/22/2014CN102730745B Process for removing nickel from high-purity plating-stage copper sulfate
01/22/2014CN102677062B Method for electrolyzing and regenerating alkaline etching liquid
01/21/2014US8632854 Substrate centering device and organic material deposition system
01/21/2014US8632691 Interface treatment method for germanium-based device
01/21/2014US8632637 Method and apparatus for plasma processing
01/21/2014US8632634 Coating apparatus and coating method
01/15/2014CN203399422U Circuit board etching apparatus
01/15/2014CN103510092A Corrosion agent for displaying intercrystalline cracks of continuous casting steel billet and its preparation method
01/15/2014CN103510091A Corrosive agent composition and U-shaped groove providing method
01/15/2014CN103510090A Pretreatment fluids and pretreatment method for improving corrosion resistance of aluminium alloy
01/15/2014CN103510089A Liquid composition for etching and preparing method of multilayer printed wiring board using same
01/15/2014CN103510088A Solid-state hole array and manufacturing method thereof
01/15/2014CN102650054B Method for removing burrs of copper-clad plate
01/15/2014CN102586780B Acidic etching solution, as well as preparation method and application thereof
01/14/2014US8628679 High-definition demetalization process
01/14/2014US8628640 Plasma processing unit and high-frequency electric power supplying unit
01/14/2014US8627783 Combined wafer area pressure control and plasma confinement assembly
01/09/2014WO2013154413A3 A method for decorating and stamping metal sheets using acids and coating inks
01/09/2014US20140011352 Metal wire etchant and method of forming metal wire using the same
01/09/2014US20140008327 Movable joint through insert
01/09/2014US20140007413 Plasma confinement structures in plasma processing systems and methods thereof
01/08/2014CN203382822U Air exhaust pipeline for controlling back side etching
01/08/2014CN203382821U Liquid medicine circulation device for etching cabins of high-density interconnection circuit board DES (developing, etching and stripping) line body
01/08/2014CN103500775A Process for conducting alkali treatment after felting on crystalline silicon plasma
01/08/2014CN103499480A Metallographic phase corrosion method displaying austenitic stainless steel grain boundary
01/08/2014CN102575360B Processing liquid for suppressing pattern collapse of fine metal structure and method for producing fine metal structure using same
01/08/2014CN102251254B Circular treatment equipment for recovery of copper from microetching liquid and special eddy flow electrolysis unit thereof
01/08/2014CN101395010B Methods for forming articles having apertures and articles having substantially reduced residual compressive stress
01/07/2014US8623471 Plasma treatment system
01/07/2014US8623228 Freely mounted wheel set made of micro-machinable material and method of fabricating the same
01/07/2014US8623222 MEMS-based micro and nano grippers with two axis force sensors
01/07/2014US8623172 Gas flow path structure and substrate processing apparatus
01/07/2014US8623142 Coating apparatus
01/07/2014US8623141 Piping system and control for semiconductor processing
01/07/2014US8622021 High lifetime consumable silicon nitride-silicon dioxide plasma processing components
01/03/2014WO2014000320A1 Etchant solution for copper conductor of tft array substrate
01/02/2014US20140004374 Multi-Layer Encapsulated Structures
01/02/2014US20140001155 Manufacturing method of magnetic disk substrate
01/02/2014US20140001154 Plasma processing apparatus and plasma processing method
01/02/2014US20140001146 Methods and systems for using actuated surface-attached posts for biofluid rheology
01/02/2014DE102012211242A1 Verfahren zum Bearbeiten der Oberfläche eines Bauteils A method for modifying the surface of a component
01/01/2014CN1969060B Gas distribution system having fast gas switching capabilities
01/01/2014CN103492609A Edge bending jig for mesh-type electrode substrate, edge bending method for mesh-type electrode substrate, hanging jig for mesh-type electrode substrate and hanging method for mesh-type electrode substrate
01/01/2014CN103484864A Tungsten layer removal solution
01/01/2014CN103484863A Metallographic corrosive, corrosion method for metallographic sample and display method for metallographic structure
01/01/2014CN103484862A Environment-friendly metal deplating liquid for steel substrate
01/01/2014CN103484861A Brightening metal-stripping solution
01/01/2014CN103484860A Wet etching equipment and supply device thereof
01/01/2014CN103484859A Method for manufacturing metal plate and metal heating element
01/01/2014CN103481583A Treated copper foil with porous structure on surface and preparation method thereof
01/01/2014CN102703902B Etching liquid for TFT (thin film transistor)array substrate copper conductor
12/2013
12/31/2013US8617409 Magnetically levitated gas cell for touchless site-isolated wet processing
12/31/2013US8617407 Systems and methods for electrical contacts to arrays of vertically aligned nanorods
12/31/2013US8617406 Device for the actively-controlled and localized deposition of at least one biological solution
12/31/2013US8617352 Electrode assembly for the removal of surface oxides by electron attachment
12/31/2013US8617351 Plasma reactor with minimal D.C. coils for cusp, solenoid and mirror fields for plasma uniformity and device damage reduction
12/31/2013US8617348 Modulating etch selectivity and etch rate of silicon nitride thin films
12/31/2013US8617347 Vacuum processing chambers incorporating a moveable flow equalizer
12/25/2013EP2677064A1 Method for refreshing an acid bath solution
12/25/2013EP2176447B1 A microporous layer for lowering friction in metal-forming processes
12/25/2013CN203360629U Liquid supply system for photovoltaic module production processes
12/25/2013CN103476198A Copper foil for printed wiring board, process for preparing the same, and printed wiring board using the copper foil
12/25/2013CN103471900A Corrosive for displaying billet rimholes and preparation method thereof
12/25/2013CN103469216A Preparation method of porous Cu surface for heat exchange
12/25/2013CN103469215A Copper based super-hydrophobic surface with low friction coefficient and preparation method thereof
12/25/2013CN103469209A Pretreatment technique for lithium aluminum alloying and milling
12/25/2013CN103469208A Novel aluminum washing machine for aluminum-plated film
12/24/2013US8613863 Methods for selective etching of a multi-layer substrate
12/24/2013US8613860 Group III-nitride layers with patterned surfaces
12/24/2013US8613827 Plasma treatment system
12/24/2013DE102013100035A1 Ätzverfahren für III-V Halbleitermaterialien Etching of III-V semiconductor materials
12/19/2013WO2013187537A1 Microetching agent for copper, supplementary liquid for same, and manufacturing method for circuit board
12/19/2013US20130335383 Removal of molybdenum
12/19/2013US20130334173 Methods and Compositions for Acid Treatment of a Metal Surface
12/18/2013EP2675004A1 Current collector
12/18/2013CN203346478U Etching and film-removal production line system provided with cleaning and drying devices
12/18/2013CN203346477U Novel liquid crystal display back panel photo-etching part
12/18/2013CN103459672A Etching liquid
12/18/2013CN103459650A Separating device and method for producing a crucible for said separating device
12/18/2013CN103451716A Plating layer stripping corrosion solution
12/18/2013CN103451676A System and method for treating printing plate etching waste liquid
12/18/2013CN103451675A System and method for treating printing plate etching waste liquid
12/18/2013CN103451665A Processing technology of touch screen leading wire
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