Patents
Sitemap › C23 - Coating metallic material; Coating material with metallic material; Chemical surface treatment; Diffusion treatment of metallic material; Coating by vacuum evaporation, by sputtering, by ion implantation or by chemical vapour deposition, in general; Inhibiting corrosion of metallic material or incrustation in general › C23F - Non-mechanical removal of metallic material from surfaces; Inhibiting corrosion of metallic material; Inhibiting incrustation in general; Multi-step processes for surface treatment of metallic material involving at least one process provided for in class and at least one process covered by subclass  or or class › C23F 1 - Etching metallic material by chemical means
Patents for C23F 1 - Etching metallic material by chemical means (16,062)
05/2014
05/22/2014WO2014078393A1 Capacitively coupled plasma equipment with uniform plasma density
05/22/2014WO2014076989A1 Method for manufacturing printed circuit board and surface treatment device for same
05/22/2014US20140140365 Sensor for differential calorimetric measurement, and method for manufacturing same
05/22/2014DE102012107526A1 Oberflächenstrukturierung von Presswerkzeugen Surface structuring of press tools
05/21/2014CN203602718U 一种酸性废蚀刻液的铜回收循环系统 An acidic waste etching liquid copper recovery circulatory system
05/21/2014CN203602717U 局部蚀刻设备 Partial etching equipment
05/21/2014CN103806107A 一种多晶硅片制绒方法及制绒液 One kind of polycrystalline silicon wafer texturing methods and Texturing liquid
05/21/2014CN103806062A 一种不锈钢表面电镀铬的方法 One kind of chrome plated stainless steel surface method
05/21/2014CN103806000A 刻蚀剂组合物、阵列基板以及制造阵列基板的方法 The etching agent composition and a method of manufacturing an array substrate, the array substrate
05/21/2014CN103805999A 电站锅炉用18-8型铬镍奥氏体不锈钢金相侵蚀液及侵蚀方法 Power boiler solution and erosion method 18-8 chromium-nickel austenitic stainless steel metallurgical erosion
05/21/2014CN103805998A 硅片湿法刻蚀设备及其刻蚀方法 Wafer wet etching and etching equipment
05/21/2014CN103805997A 湿式蚀刻方法与基板承载装置 Wet etching method and the substrate carrying device
05/21/2014CN103801152A 一种除渣系统 One kind of slag removal system
05/20/2014US8728338 Ultra high-speed wet etching apparatus
05/20/2014US8728334 Dynamic gas flow control of touchless reactor cells
05/20/2014US8728286 Method of manufacturing sample for atom probe analysis by FIB and focused ion beam apparatus implementing the same
05/15/2014WO2014074579A1 Systems and methods for vapor pressure leaching polycrystalline diamond cutter elements
05/15/2014US20140137059 Method and apparatus for plasma processing
05/15/2014US20140131615 Etching solution for copper or a compound comprised mainly of copper
05/15/2014US20140131305 Method for forming wires with narrow spacing
05/14/2014EP2729595A1 Method for providing organic resist adhesion to a copper or copper alloy surface
05/14/2014CN203593802U 一种电解铜箔表面处理设备 An electrolytic copper foil surface treatment apparatus
05/14/2014CN103794488A 一种衬底的刻蚀方法 A substrate etching method
05/14/2014CN103789779A 化学镀金板非沉铜孔内防金沉积工艺及其除钯处理液 Chemical gold plate non-PTH hole anti-gold deposition process and its treatment solution in addition to palladium
05/14/2014CN103789769A 一种将pcb酸碱性蚀刻废液资源回收及再生的方法 A method of pH pcb etching waste resource recovery and regeneration methods
05/14/2014CN103789768A 一种纳米级的铝刻蚀方法 A nano-grade aluminum etching method
05/14/2014CN102888608B 一种显示细晶粒奥氏体不锈钢晶界的腐蚀剂及其制备方法 A fine grain boundaries of austenitic stainless steel and its preparation method of displaying an etchant
05/14/2014CN102582009B 一种聚合物基定向超疏水材料的制备方法 Directed preparation of a polymer-based super-hydrophobic materials
05/13/2014US8721908 Bevel etcher with vacuum chuck
05/13/2014US8721907 Method and system for milling and imaging an object
05/13/2014US8721836 Plasma processing with preionized and predissociated tuning gases and associated systems and methods
05/13/2014US8721790 Film deposition apparatus
05/08/2014US20140124477 Etching method and devices produced using the etching method
05/08/2014US20140124138 Plasma monitoring probe assembly and processing chamber incorporating the same
05/08/2014DE10345962B4 Substrat und Verfahren zum Bilden eines Substrats für eine Fluidausstoßvorrichtung Substrate and method for forming a substrate for a fluid ejection device
05/07/2014CN1950538B 围绕真空反应室的中央轴排列的可分别控制的电磁线圈组成的阵列 An array of electromagnetic coils can be controlled around the central axis of the vacuum reaction chamber arrangement consisting of
05/07/2014CN103781941A 铜微蚀刻液及其补充液、以及配线基板的制造方法 Copper micro-etching solution and replenisher, and method of manufacturing a wiring board
05/07/2014CN103774205A 中高压阳极铝箔二次纯化学侵蚀扩孔方法 The high voltage anode foil secondary pure chemical attack reaming method
05/07/2014CN103774149A 一种高强纳米多孔镍膜的制备方法 Method for preparing high-strength nano-porous nickel film
05/07/2014CN103774148A 半导体工艺常温铝蚀刻制程 Semiconductor process aluminum etching process at room temperature
05/07/2014CN103774147A 一种喷头组在蚀刻区做往复运动的蚀刻方法及装置 A group of nozzles in a reciprocating motion an etching method and an etching apparatus region
05/07/2014CN103774146A 一种铝合金化学铣切前处理中的脱氧处理方法 An aluminum alloy chemical milling pretreatment deoxygenation treatment cut
05/07/2014CN103774145A 一种在覆铜板上覆盖金属箔的方法 A method of covering the metal foil on the CCL
05/07/2014CN102921037B 一种钛种植体表面制备多级微米结构的方法 A multi-stage implant surface preparation method for titanium micron structures
05/07/2014CN102257180B 铜或铜合金用的蚀刻液、蚀刻方法及蚀刻液的再生管理方法 Etchant copper or copper alloy, the etching method and an etching solution regeneration management
05/06/2014US8715520 Substrate processing method and storage medium
05/06/2014US8715518 Gas barrier with vent ring for protecting a surface region from liquid
05/06/2014US8715514 Micro-electromechanical systems (MEMS) microphone and method of manufacturing the same
05/01/2014WO2014064050A1 Treatment of preforms containing copper with a mixture containing chlorine-free and carboxyl-free acids and oxidants
05/01/2014US20140120734 Novel Etching Composition
05/01/2014US20140118292 Touch screen panel and method of manufacturing the same
04/2014
04/30/2014CN103764874A Etchant liquid composition for a metal layer, including copper and titanium
04/30/2014CN103757664A Electrolytic tank, etching liquid regeneration equipment using same and regeneration method
04/30/2014CN103757635A Electrolytic bath, acid etching liquid regenerating equipment and method using electrolytic bath
04/30/2014CN103757634A Rinsing water circulating system and rinsing water circulating method
04/30/2014CN103757633A Magnesium alloy nickel coating stripping method
04/30/2014CN102265710B Rolled copper foil or electrolytic copper foil for electronic circuit, and method for forming electronic circuit using rolled copper foil or electrolytic copper foil
04/29/2014US8709954 Wafer recycling method
04/29/2014US8709703 Methods for forming patterned structures
04/29/2014US8709264 Planar cavity MEMS and related structures, methods of manufacture and design structures
04/29/2014US8709159 Vertical heat treatment apparatus
04/29/2014US8707899 Plasma processing apparatus
04/24/2014WO2014062886A1 Plasma etching endpoint detection using multivariate analysis
04/24/2014WO2014061522A1 Etching method
04/24/2014US20140110373 Method of etching copper layer and mask
04/24/2014US20140110057 Segmented focus ring assembly
04/23/2014EP2722417A1 Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells
04/23/2014CN103748260A Methods of dechucking and system thereof
04/23/2014CN103741143A Circulating treatment system and method for etching solution
04/23/2014CN103741142A Method for recycling tin from waste tin-stripping solution based on tin-stripping solution of hydrochloric acid-tin salt system
04/23/2014CN102140639B Deposited metal stripping agent and preparation method thereof
04/22/2014US8703617 Method for planarizing interlayer dielectric layer
04/22/2014US8703003 Selective etching of semiconductor substrate(s) that preserves underlying dielectric layers
04/22/2014US8702997 Balancing a microelectromechanical system
04/22/2014US8702903 Thermally conductive sheet and substrate mounting device including same
04/22/2014US8702902 Device for generating a plasma discharge for patterning the surface of a substrate
04/22/2014US8702867 Gas distribution plate and substrate treating apparatus including the same
04/22/2014US8701268 Composite showerhead electrode assembly for a plasma processing apparatus
04/16/2014CN203546157U Alkaline etching solution copper recycling and regenerating system
04/16/2014CN103732806A Processing unit having condenser, and fully automatic gravure platemaking processing system using same
04/16/2014CN103732798A Conductive base for forming wiring pattern of collector sheet for solar cells, and method for producing collector sheet for solar cells
04/15/2014US8697226 Door skin, a method of etching a plate for forming a wood grain pattern in the door skin, and an etched plate formed therefrom
04/15/2014US8696922 Methods of plasma etching platinum-comprising materials, methods of processing semiconductor substrates in the fabrication of integrated circuitry, and methods of forming a plurality of memory cells
04/15/2014US8696862 Substrate mounting table, substrate processing apparatus and substrate temperature control method
04/15/2014US8696814 Film deposition apparatus and film deposition method
04/10/2014US20140099478 Block copolymer assembly
04/10/2014US20140097153 Method of plasma etching
04/09/2014CN203530442U Micro-etching solution recovery treatment system
04/09/2014CN103717787A Etchant for copper/molybdenum-based multilayer thin film
04/09/2014CN103717772A Stainless steel for fuel cell separator
04/09/2014CN103717769A Stainless steel for fuel cell separator
04/09/2014CN103710706A Purification and regeneration method of iron trichloride etching waste liquid
04/09/2014CN103710705A Additive for acidic texturing liquid of polycrystalline silicon wafers and application thereof
04/09/2014CN103710704A Iodine-based etching solution and etching method
04/09/2014CN102766869B Double-phase stainless steel microstructure and sigma mesophase chromatic corrosive and corrosion method
04/09/2014CN102534517B Making method for target assembly
04/09/2014CN101661922B Copper interconnection line with silicon through hole having high depth-to-width ratio and preparation method thereof
04/08/2014US8692166 Substrate heating device and substrate heating method
04/08/2014US8691104 Nanotextured surfaces and related methods, systems, and uses
04/08/2014US8691103 Surface profile adjustment using gas cluster ion beam processing
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