Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
06/2007
06/14/2007US20070135565 Composition for forming porous film, porous film and method for forming the same, interlevel insulator film, and semiconductor device
06/14/2007US20070135022 Apparatus for reduction of defects in wet procssed layers
06/14/2007DE102005059323A1 Preparing metal-plated, extruded plastic, useful as e.g. decorative particle, comprises melt blending and extrusion of plastic mixture and contacting mixture with acid, neutral or basic metal salt solution by electrolessly/glavanically
06/14/2007CA2633809A1 Production of nanosized materials
06/13/2007EP1796106A1 Electroconductive fine particle and anisotropically electroconductive material
06/13/2007EP1795284A1 Nickel coated copper powder and process for producing the same
06/13/2007EP1794763A2 Silver microribbon composition and method of production
06/13/2007EP1683207B1 Oxide superconducting film and method of preparing the same
06/13/2007EP1521862B1 Immersion plating of silver
06/13/2007CN2910967Y Apparatus for spraying antireflective coating of solar cell
06/13/2007CN1981348A Conductive microparticle, process for producing the same, and anisotropic conductive material
06/13/2007CN1981347A Conductive microparticle, process for producing the same and anisotropic conductive material
06/13/2007CN1981070A Apparatus for electroless deposition of metals onto semiconductor substrates
06/13/2007CN1978702A Pump body and cover coated by using non-dielectric zinc chromate and its process
06/12/2007US7230188 Printed wiring board and its manufacturing method
06/12/2007US7229748 Method for forming a micro pattern, micro pattern, method for fabricating a mold for forming the micro pattern through transcription, and mold for forming the micro pattern through transcription
06/12/2007US7229662 Forming, baking a first precursor layer without crystallizing it, forming and baking a second precursor layer to crystallize it without crystallizing the first layer; annealing both layers to form a crystallized thin film; layers of alternating crystal structures
06/07/2007WO2007063732A1 Resin composition for direct metal plating, molded article, and metal-plated molded article
06/07/2007WO2007063331A1 Electroformed component manufacture
06/07/2007US20070128458 Protection of metallic surfaces against thermally-inducted wrinkling (rumpling)
06/07/2007US20070128366 electroless plating with composition of cerium nitrate and silver nitrate; electronics
06/07/2007US20070128350 Method for manufacturing fine composite particles, apparatus for manufacturing fine composite particles, and fine composite particles
06/07/2007US20070125989 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
06/06/2007EP1793017A1 Plating apparatus and plating liquid removing method
06/06/2007EP1793013A2 Metallization of dielectrics
06/06/2007EP1792348A1 Method for application of a zinc sulphide buffer layer to a semiconductor substrate by means of chemical bath deposition in particular on the absorber layer of a chalcopyrite thin-film solar cell
06/06/2007CN1974841A Core-shell type composite conductive Fe-Ag filler and its prepn process
06/06/2007CN1974840A Composition for chemical Cu plating onto timber surface and the chemical Cu plating process
06/06/2007CN1320159C Powder coated with titania film and method for production thereof
06/06/2007CN1319711C Honeycomb structural body forming ferrule, and method of manufacturing ferrule
06/05/2007US7225538 Resilient contact structures formed and then attached to a substrate
05/2007
05/31/2007WO2007061282A1 Method to produce adhesiveless metallized polyimide film
05/31/2007WO2007060180A1 Method for producing a ceramic oxide based coating conformable with the geometry of a substrate having raised designs
05/31/2007WO2007059730A2 Method for the pre-treatment of titanium components for the subsequent coating thereof
05/31/2007WO2006035397A3 Non-galvanically applied nickel alloy
05/31/2007WO2005067469A3 Method for carburizing steel components
05/31/2007US20070122552 Coating device
05/31/2007US20070122549 forming a solar cell conductive feature using monodisperse silver or silver alloy fine particles coated with a ceramic or metal; silver particles made in an aerosol stream and coated by vapor deposition
05/31/2007US20070120099 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/31/2007US20070120098 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/31/2007US20070120097 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/31/2007US20070120096 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/31/2007CA2628623A1 Method for the pre-treatment of titanium components for the subsequent coating thereof
05/30/2007EP1789480A1 Method of plating mineral filled polyamide compositions and articles formed thereby
05/30/2007EP1062850B1 Method for producing printed conductor structures
05/30/2007CN2905823Y Laser induction chemical plating automatic control device based on optical fiber laser
05/30/2007CN1973340A Nickel compound containing solution, method for production thereof, and method for forming thin nickel metal film using the same
05/30/2007CN1319145C Apparatus and method of substrate surface treatment of integrated circuit
05/30/2007CN1319130C Apparatus for handling semiconductor substrate, method for handling semiconductor substrate
05/30/2007CN1318644C Stack structure of electronic apparatus and method for electroless plating of gold
05/30/2007CN1318634C Improvement in the production of a zinc-aluminum alloy coating by immersion into molten metal baths
05/30/2007CN1318299C Process for preparing silica or silica-based thickvitreous films according to the sol-gel technique and thick films thereby obtained
05/29/2007US7223690 Substrate processing method
05/29/2007US7223308 Apparatus to improve wafer temperature uniformity for face-up wet processing
05/24/2007WO2007058913A2 Hydrogen transport membrane fabrication method
05/24/2007WO2007058173A1 Metal nanoplate-fixed substrate and method for manufacture thereof
05/24/2007WO2007057166A2 Method for producing a ceramic-coated metal support substrate
05/24/2007WO2007020028A3 Production of silver layers
05/24/2007US20070117365 Plating method and apparatus
05/24/2007DE102006026510B3 Production of flame barrier insert by coiling flat metal strip and corrugated metal strip in spiral comprises providing coil with coating to fix contact zones between strips
05/24/2007CA2629442A1 Hydrogen transport membrane fabrication method
05/23/2007EP1788584A1 Conductive microparticle, process for producing the same and anisotropic conductive material
05/23/2007EP1786952A2 Silver-releasing articles and methods of manufacture
05/23/2007EP1786951A2 Selective nickel plating of aluminium, copper and tungsten structures
05/23/2007EP1786740A1 Nanostructured coatings and related methods
05/23/2007EP1786621A2 Process of metallizing polymeric foam to produce an anti-microbial and filtration material
05/23/2007CN1969064A Tin-based plating film and method for forming the same
05/23/2007CN1966765A Activation method for chemical plating of non-metallic material and chemical plating therefor
05/23/2007CN1966764A Flexible composite ferroelectric film and process for preparing same
05/23/2007CN1966763A Method for cladding titanium dioxide nano film on surface of zinc sulphide phosphor powder
05/23/2007CN1317814C Control power supply device for electroplating
05/23/2007CN1317424C Preparation process for coating gold by the aid of microwave
05/22/2007US7220296 Electroless plating baths for high aspect features
05/22/2007CA2405830C Process for the manufacture of printed circuit boards with plated resistors
05/22/2007CA2276475C Pickling/activation solution for the pretreatment of aluminium-steel composites prior to dip tinning
05/18/2007WO2007055955A2 Method of reducing porosity
05/18/2007WO2007055223A1 Method for forming metal film and method for forming metal pattern
05/18/2007WO2007054412A1 Process for the production of doped metal oxide particles
05/17/2007US20070110973 reduced precious metallic particles ( Ag, Au, Pt, Pd, Rh, Ir) dispersed in a polymeric(acrylonitrile-butadiene-styrene terpolymer) matrix; high transparency, wear resistance, radiation resistance, electroconductivity; liquid-crystal displays and printed circuit boards
05/16/2007EP1785507A2 Method for etching non-conductive substrate surfaces
05/16/2007EP1785395A1 Process for the preparation of doped metal oxide particles
05/16/2007EP1784853A1 Structure formation
05/16/2007CN1965105A Method and device for electroless deposition with temperature-controlled chuck
05/16/2007CN1962938A Process for chemical nickel plating on surface of aluminum alloy containing silicon, copper, and magnesium
05/16/2007CN1962937A Metal coating liquid and metal coating pen
05/16/2007CN1316060C Process for preparing corrosion resistant coating of oil pipe composite materials
05/15/2007US7217327 Method of producing metal member with enhanced corrosion resistance by salt bath nitriding
05/15/2007US7217318 Nacreous pigment and method for the manufacture thereof
05/12/2007CA2557617A1 Coating device
05/10/2007US20070104883 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/10/2007US20070104882 Low viscosity precursor compositions and methods for the deposition of conductive electronics features
05/10/2007US20070104881 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/10/2007US20070104880 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/10/2007US20070104879 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/10/2007US20070104876 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/10/2007US20070104875 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/10/2007US20070104870 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/10/2007US20070104869 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/10/2007US20070102685 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
05/10/2007US20070102684 Low viscosity precursor compositions and methods for the deposition of conductive electronic features
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