Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
06/1994
06/14/1994US5320667 Combination of aqueous baths for electroless gold deposition
06/09/1994WO1994012686A1 Electroless gold plating bath
06/09/1994WO1994012685A1 Sulfate-free electroless copper plating baths
06/09/1994WO1994012684A1 Electroless nickel plating baths
06/09/1994WO1994012683A1 Apparatus and methods for treating electroless plating baths
06/09/1994WO1994012439A1 Methods and apparatus for treating electroless plating baths
06/09/1994DE4341537A1 Verbundwerkstoff-Draht und Verfahren zu seiner Herstellung Composite wire and process for its preparation
06/08/1994EP0600787A1 Process for metallising the surface of composite materials having an organic matrix and electronic components thus obtained
06/08/1994CA2102999A1 Composite metallizing wire and method of using
06/07/1994US5318803 Conditioning of a substrate for electroless plating thereon
06/07/1994US5318800 Method of forming high temperature thermally stable micron metal oxide coatings on substrates and improved metal oxide coated products
06/07/1994US5318621 Cyanide-free aqueous solutions containing sulfite, thiosulfate metal complexes and acyclic amino acids as accelerators which also maintain stability
06/01/1994EP0404891B1 Process for the manufacture of electrically conductive structures
05/1994
05/31/1994US5316867 Method for adhering metal coatings to thermoplastic addition polymers
05/31/1994US5316579 Using rotating turbibe blades
05/26/1994WO1994011546A1 Preparation of metal or oxide films
05/24/1994US5314725 Photo-plating process
05/24/1994CA1329788C Metal coated laminate products made from textured polyimide film
05/24/1994CA1329739C Multilayer ceramic coatings from silicate esters and metal oxides
05/24/1994CA1329737C Multilayer ceramics from hydrogen silsesquioxane
05/24/1994CA1329736C Multilayer ceramic coatings from metal oxides for protection of electronic devices
05/18/1994EP0597284A1 Insulating process for soft magnetic strips
05/18/1994EP0596936A1 Deposition of magnesium fluoride films.
05/18/1994CN1024570C Oxygen-generating electrode and its making method
05/18/1994CN1024569C Solution and its process for chemical plating of corrosion resisting amorphous phosphorus nickel alloy
05/17/1994US5312480 Gold(I) mercaptocarboxylic acid esters, method of their preparation and use
05/11/1994WO1994010704A1 Integrated circuit with layered superlattice material and method of fabricating same
05/11/1994WO1994010702A1 Process for fabricating layered superlattice materials and making electronic devices including same
05/11/1994WO1994010084A1 Precursors and processes for making metal oxides
05/11/1994DE4243747C1 Bis-penta:fluoro-tri:tin(II)-hexa:fluorosilicate - is useful, e.g., in galvanic tinning of e.g. metal surfaces or thermal tinning of glass materials and in disinfectants
05/11/1994DE4238765A1 Electroless tin@ plating of circuit board with conditioned bath - conditioned by heating and adding copper salt or in contact with circuit board, giving stable planar surface suitable for repeated soldering
05/11/1994CA2145879A1 Process for fabricating layered superlattice materials and making electronic devices including same
05/11/1994CA2145878A1 Precursors and processes for making metal oxides
05/10/1994US5311218 Ink jet print head and method of fabricating the same
05/10/1994US5310580 Electroless metal adhesion to organic dielectric material with phase separated morphology
05/04/1994EP0594932A1 Method for forming patterned transparent conducting film
05/03/1994US5308796 Using silicide as catalyst for selective plating
05/03/1994US5308660 Adhesion prevention
05/03/1994US5308387 Pre-etch treatment of a plastic substrate
04/1994
04/28/1994WO1994009181A1 Electroless deposition of metal employing thermally stable carrier polymer
04/28/1994WO1994009180A1 Composite mirrors
04/26/1994US5306389 Method of protecting aluminum nitride circuit substrates during electroless plating using a surface oxidation treatment
04/26/1994US5306336 Sulfate-free electroless copper plating baths
04/26/1994US5306335 Electroless bismuth plating bath
04/26/1994US5306334 A mixture consists of nickel salt, one or more organic acids from lactic acid, acetic acid, propionic acid, pyruvic acid, aspartic acid and glycolic acid, hypophosphites, thiourea and ammonia
04/20/1994EP0592946A1 Iron-plated aluminum alloy parts and method for plating same
04/20/1994EP0592471A1 Method of treating the surface of moulded polyamide articles, and the articles thus obtained.
04/20/1994EP0490914B1 Methods for depositing finish coatings on substrates of anodisable metals and the products thereof
04/19/1994US5304403 Zinc/nickel/phosphorus coatings and elecroless coating method therefor
04/19/1994US5304297 Electrolytic cells
04/14/1994CA2107866A1 Iron-plated aluminum alloy parts and method for plating the same
04/13/1994EP0591496A1 Use of organo-metallic compounds for precipitating metals on substrates
04/13/1994EP0591278A1 Method of treating the surface of mouled polyoxymethylene articles, and the articles thus obtained.
04/13/1994EP0591126A1 Process for making noble metal coated metallic particles, and resulting conductive materials
04/13/1994CN1085265A Bellows used in expansion joint and flexible metal tubing
04/12/1994US5302467 Halogenated polyimide composition having improved adhesion characteristic and articles obtained therefrom
04/12/1994US5302415 Electroless plated aramid surfaces and a process for making such surfaces
04/12/1994US5302256 Immersion tin/lead alloy plating bath
04/12/1994US5301404 Method of producing printer head using piezoelectric member
04/06/1994EP0590875A1 Metal hydrides
04/06/1994EP0590635A1 A method for producing a multi-layered printed wiring board
04/06/1994EP0590046A1 Mildly basic accelerating solutions for direct electroplating
04/05/1994US5300330 Source of metal salt, electroless reducing agent, complexing agent, electroless plating stabilizer, and particulate matter stabilizer
04/05/1994US5300140 Hydroprimer for metallising substrate surfaces
04/05/1994CA1328323C Method of producing polymer article having metallized surface
03/1994
03/31/1994CA2103778A1 Metal hydrides
03/30/1994EP0589503A1 Hydrogen sulfide gas sensor and precursor compounds for manufacture of same
03/29/1994US5298058 Electroless copper plating bath
03/29/1994US5298037 Hydriding; batteries
03/24/1994DE4231052A1 Bath for pretreating light metals which are susceptible to oxide formation prior to electroless coating - made up of aqueous phosphoric acid
03/23/1994EP0588038A1 Process for depositing a protective oxide coating
03/22/1994US5296268 Pretreating with solution of acid pH adjustor to maintain constant during plating
03/22/1994US5296261 Impregnating polymer sponge with solution of metal nitrate or sulfate, heat treating to remove organic material and form metal sponge
03/22/1994US5296260 Method of manufacturing inorganic insulation
03/22/1994US5296020 Organic noble metal, fillers, organic solvent, aqueous dispersion of polyurethane
03/17/1994WO1994006161A1 A method for manufacturing rare earth-nickel-metallic hydride electrodes
03/09/1994EP0585602A2 Formation of inorganic conductive coatings on substrates
03/08/1994US5292558 Polyoxometalate coating
03/08/1994US5292557 With copper, treating substrate with stilbene-based fluorescent brightener
03/08/1994US5292553 Ultra thin zircon coating and membrane
03/08/1994US5292361 Electroless palladium plating composition
03/03/1994WO1994005139A1 Process for producing finely structured electroconductive layers
03/03/1994WO1994004718A1 Method and apparatus for photo-forming small shaped metal containing articles from porous precursors and articles fabricated according to the method
03/03/1994WO1993016204A3 Process and apparatus for extracting solutes from their aqueous solutions
03/03/1994DE4229061A1 Values and water recovery from aq. process liq. - by membrane distillation giving recyclable concentrate and distillate usuable instead of deionised water
03/02/1994CN1083129A Quick-activation process for mechanical zinc plating
03/01/1994US5290597 Partially curing, degreasing, treating with oxidizing agent, applying electroless copper or nickel, curing, applying secondary metal
03/01/1994US5290354 Coatings for microelectronic devices and substrates
02/1994
02/24/1994DE4227085A1 Verfahren zur Herstellung fein strukturierter elektrisch leitfähiger Schichten A process for producing finely structured electrically conductive layers
02/23/1994EP0583822A2 Method of manufacturing a black matrix of nickel on a passive plate of a liquid crystal display device in an electroless process
02/23/1994EP0368943B1 Process and composition for preparing printed circuit through-holes for metallization
02/23/1994CN1082770A Electronic devices having metallurgies containing copper-semiconductor compounds
02/22/1994US5288519 Insulation layer for mold; hydrolysis of polyamic acid, degreasing, curing, surface oxidation-reduction of formed polyimide
02/22/1994US5288313 Homogeneous solution comprising a mixture of two kind of particles coated with reduced silver and platinum family metal absorbed on carriers
02/17/1994WO1994003656A1 Electrodeposited composite coatings
02/15/1994US5286530 Method for providing adherent metal coatings on cyanate ester polymer surfaces
02/10/1994DE4326206A1 Electroless tin@-lead@ solder plating bath - contains trivalent titanium based reductant and complexing agent
02/09/1994EP0582425A2 Metal coating of polypyromellitimides
02/09/1994EP0582411A2 Electroless metal coatings
02/09/1994EP0582336A2 Improved electroless copper deposition