| Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
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| 02/24/1993 | EP0527926A1 Process for depositing thin film layers onto surfaces modified with organic functional groups and products formed thereby. |
| 02/23/1993 | US5188890 Metallized porous flourinated resin and process therefor |
| 02/23/1993 | US5188643 Method of applying metal coatings on cubic boron nitride and articles made therefrom |
| 02/18/1993 | WO1993003197A1 Improved method and solution for direct copper writing |
| 02/18/1993 | WO1993002981A1 Deposition of magnesium fluoride films |
| 02/18/1993 | CA2113992A1 Deposition of magnesium fluoride films |
| 02/16/1993 | US5187241 Reaction of hydrolyzed polyimide surface (polyamic acids) with an acyl chloride to produce polyisoimides |
| 02/16/1993 | US5186984 Contacting copper substrate with cyanide-free ammoniacal silver solution comprising chelant and soluble copper |
| 02/09/1993 | US5185185 Process of pretreatment of metal-plating resin molded articles |
| 02/04/1993 | WO1993002224A1 Coating substrates |
| 02/03/1993 | EP0526334A2 Electroless palladium plating composition |
| 02/03/1993 | EP0526160A1 Method for reducing flow assisted corrosion of carbon steel components and components so obtained |
| 02/03/1993 | EP0526158A1 Method of applying metal coatings on cubic boron nitride |
| 02/03/1993 | EP0525282A2 Controlled electroless plating |
| 02/02/1993 | WO1993002847A1 Process for metallizing substrates using starved-reaction metal-oxide reduction |
| 02/02/1993 | US5183692 Polyimide coating having electroless metal plate |
| 02/02/1993 | US5183684 Ceramification of an alkylaluminum amide to nitride with high temperature in presemce of ammonia |
| 02/02/1993 | US5183611 Dissolving polymer and metal salt in common solvent; forming; reducing |
| 02/02/1993 | US5183500 Electroless plating bath composition and method for production thereof |
| 01/28/1993 | DE4124699A1 Deposition of copper@-contg. layer on substrate - carried out by decomposition of new substd. cyclopentadienyl copper alkyl- or aryl-isonitrile cpd. |
| 01/27/1993 | EP0524748A1 Metal ion replenishment to plating bath |
| 01/27/1993 | EP0524630A2 Composition for use in a transparent and electrically conductive film and a method for making the film |
| 01/27/1993 | EP0524493A2 Electrolytic process for reducing the organic content of an aqueous composition and apparatus therefore |
| 01/27/1993 | EP0524422A2 Tin lead treatment |
| 01/27/1993 | CN1068291A Copper plating method on plastics surface for increasing its cohesion force with resins and metals |
| 01/26/1993 | US5182241 Regeneration of palladium-tin activator solution for use in metallization of plastics |
| 01/26/1993 | US5182135 Process for improving the adherency of metallic coatings deposited without current on plastic surfaces |
| 01/26/1993 | US5182131 Plating solution automatic control |
| 01/26/1993 | US5182006 Zincate solutions for treatment of aluminum and aluminum alloys |
| 01/21/1993 | WO1993001330A1 Viscous electroless plating solutions |
| 01/21/1993 | WO1993000879A1 Sol gel composition for producing glassy coatings |
| 01/21/1993 | WO1993000878A1 Sol gel composition for producing glassy coatings |
| 01/20/1993 | EP0523791A2 Method of providing a copper pattern on a dielectric substrate |
| 01/20/1993 | EP0523368A1 Plated polyamide resin articles |
| 01/19/1993 | US5180639 Nitration, Ammonolysis |
| 01/14/1993 | DE4202842C1 Stable aq. copper complex for non-electrolytic deposition of copper@ - comprises copper(II) salt, 3-(bis(carboxy methyl)amino) propanoic acid as complexing agent, buffer and reducing agent |
| 01/13/1993 | EP0522927A1 Process for making a foam-type support for an electrode of a secondary battery |
| 01/12/1993 | US5178956 Pretreatment process for electroless plating of polyimides |
| 01/12/1993 | US5178918 Electroless plating process |
| 01/12/1993 | US5178914 Electroless metal deposition |
| 01/12/1993 | US5178909 Reduction of silver compounds in the presence of a chelate compound |
| 01/07/1993 | WO1993000456A1 Mildly basic accelerating solutions for direct electroplating |
| 01/07/1993 | WO1993000393A1 Method of treating the surface of mouled polyoxymethylene articles, and the articles thus obtained |
| 01/07/1993 | WO1993000392A1 Method of treating the surface of moulded polyamide articles, and the articles thus obtained |
| 01/07/1993 | EP0521738A2 Bath and method for the electroless plating of tin and tin-lead alloy |
| 01/07/1993 | EP0521483A2 Printed circuit board and semiconductor chip carrier sheet |
| 01/07/1993 | DE4210400C1 Local copper@ deposition from organo:metallic film on substrate - by forming film from mixt. of copper acetate and copper formate in specified ratio and depositing film by laser irradiation |
| 01/07/1993 | CA2109706A1 Surface treatment of polyoxymethylene moldings and moldings obtained thereby |
| 01/05/1993 | US5176744 Crystallization inhibition |
| 01/05/1993 | US5176743 Organopalladium compounds, solvents, polyurethane elastomers |
| 12/30/1992 | EP0520776A2 Method of applying metal coatings on diamond |
| 12/30/1992 | EP0520437A1 Method of printing an image on a substrate particularly useful for producing printed circuit boards |
| 12/30/1992 | EP0520421A2 Immersion tin/lead alloy plating bath |
| 12/30/1992 | EP0520318A1 surface roughening of resin molded articles for metallizing |
| 12/30/1992 | EP0520195A2 Electroplating process and composition |
| 12/29/1992 | US5174975 Low temperature pyrolysis |
| 12/24/1992 | DE4120724A1 Verfahren zur oberflaechenbehandlung von polyoxymethylenformkoerpern und danach erhaltene formkoerper A method for the surface finishing of polyoxymethylenformkoerpern and then obtained formkoerper |
| 12/24/1992 | DE4120723A1 Verfahren zur oberflaechenbehandlung von polyamid-formkoerpern und danach erhaltene formkoerper A method for the surface finishing of polyamide-formkoerpern and then obtained formkoerper |
| 12/22/1992 | US5173109 High speed plating, circuit boards |
| 12/20/1992 | CA2071154A1 Surface roughening of resin molded articles for metallizing |
| 12/16/1992 | EP0518422A2 Method of selectively metallizing a pattern of a material other than glass on a glass substrate by electroless metallization |
| 12/16/1992 | EP0518317A1 Surface roughening of resin molded articles for metallizing |
| 12/15/1992 | CA2071153A1 Surface roughening of resin molded articles for metallizing |
| 12/10/1992 | WO1992014505A3 Piston-based ventilator design and operation |
| 12/09/1992 | EP0517475A2 Process for coating a substrate with a silica precursor |
| 12/09/1992 | CN1066863A Precious metal composition |
| 12/08/1992 | WO1992021790A1 Fabricating metal articles from printed images |
| 12/08/1992 | US5169692 Displacement plating; adding complexing agent |
| 12/08/1992 | CA2102405A1 Fabricating metal articles from printed images |
| 12/08/1992 | CA1311164C Europium, barium, copper oxide film superconductors |
| 12/08/1992 | CA1311163C Ytterbium, barium, copper oxide film superconductors |
| 12/08/1992 | CA1311162C Formation of film superconductors by metallo-organic deposition |
| 12/06/1992 | CA2069521A1 Process for coating a substrate with a silica precursor |
| 12/01/1992 | US5167992 Selective electroless plating process for metal conductors |
| 11/26/1992 | WO1992013981A3 Selective process for printed circuit board manufacturing |
| 11/25/1992 | EP0515186A2 Process for preparing densified porous billets |
| 11/24/1992 | US5166003 A molded article with a coating |
| 11/24/1992 | US5165971 Activating composition for plating of electrically insulative substrates and method for plating of such substrates using said composition |
| 11/24/1992 | US5165960 Spray pyrolysis or vapor deposition |
| 11/19/1992 | EP0514073A2 Precious metal composition |
| 11/19/1992 | EP0513971A2 Ink jet print head and method of fabricating the same |
| 11/19/1992 | EP0513821A2 Method of producing metallic thin film |
| 11/19/1992 | EP0513478A2 Method for controlling crystal orientation of ferroelectric thin film |
| 11/17/1992 | US5164152 Coating with a platinum group metal |
| 11/12/1992 | WO1992020204A1 Means for the selective formation of a thin oxidising layer |
| 11/12/1992 | WO1992019391A1 Method of forming metal oxide coatings |
| 11/11/1992 | EP0288491B1 Selective metallization process, additive method for manufacturing printed circuit boards, and composition for use therein |
| 11/10/1992 | US5162144 Process for metallizing substrates using starved-reaction metal-oxide reduction |
| 11/10/1992 | US5161297 Gold ink coating of thermocouple sheaths |
| 11/04/1992 | CN1065907A Scroll-type compressor, scroll member and method and apparatus for macerating-plating thereof |
| 11/03/1992 | US5160600 Copper, nickel, paladium |
| 11/03/1992 | US5160452 Reduced nickel or cobalt compounds, reducing catalysts |
| 11/03/1992 | US5160422 On copper for electronic circuits, thiourea, sulfonates, aluminum chloride |
| 11/03/1992 | US5160373 Titanium(III) compound reducing agent |
| 10/29/1992 | DE4113525A1 Metallising organic and inorganic fibrous bodies - using metallo-organic cpd. in soln. which is decomposed by UV to deposit metal |
| 10/29/1992 | DE4113263A1 Copper@-coating of ceramic parts by electroless plating - used for metallisation of dielectric or coaxial resonators |
| 10/29/1992 | DE4113262A1 Electroless application of copper@ base coat to aluminium oxide ceramic substrate - by copper@ plating, selective varnishing, stripping and galvanic deposition of nickel@ and/or gold@, for prodn. of conducting strips |
| 10/29/1992 | DE4113261A1 Electroless application of copper@ base coat to reinforced teflon substrate - by removing copper@ lining on substrates with caustic ammonia etching bath, purifying substrate, catalysing substrate, chemical copper@ plating, drying and annealing |
| 10/28/1992 | EP0510711A2 Processes and compositions for electroless metallization |
| 10/28/1992 | EP0510065A1 Catalytic, water-soluble polymeric films for metal coatings |