Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252)
02/1994
02/09/1994EP0581823A1 Means for the selective formation of a thin oxidising layer.
02/08/1994US5284520 Electroless plating tank for holding solution, workpiece holder, draft pipe for blowing air into solution to produce bubbles, and shield plate having perforations of dimensions whereby bubbles cannot pass through
02/05/1994CA2101881A1 Electroless copper deposition
02/04/1994CA2101827A1 Adhesion of metal coatings to polypyromellitimides
02/03/1994WO1994002660A1 Phosphorus-containing, crystalline, nickel-coated fabric
02/03/1994DE4228442C1 Electroless nickel@ coating of metallised ceramic - using treatment to activate only the metallised areas and avoid unwanted coating of ceramic areas
02/01/1994US5283083 Preparing metal-ligand compound; reacting with boron alkoxide and polyhydric compound in solvent; coating with metal borate precursor; heating
01/1994
01/27/1994DE4206680C1 Verfahren zur Metallisierung von Nichtleiteroberflächen und die Verwendung von Hydroxymethansulfinsäure im Verfahren A process for the metallization of non-conductive surfaces and the use of hydroxymethanesulfinic acid in the process
01/26/1994EP0580019A1 Oriented polycrystalline thin films of transition metal chalcogenides
01/25/1994US5281635 Precious metal composition
01/25/1994US5281447 Applying oxalate of group 8 element on substrate which can be decomposed on exposure to energy, exposing in a pattern to obtain metal
01/20/1994WO1994001599A1 Metallisation of plastics
01/16/1994CA2079009A1 Ugs process for mechanical galvanizing
01/12/1994EP0577724A1 Electroless plated aramid surfaces.
01/11/1994US5277817 Purification
01/06/1994WO1994000720A1 Fluid heating system
01/05/1994DE4220621A1 Electroless chemical prodn. of metal layer on substrate - comprises forming palladium@ layer before metallising and producing tin oxide on substrate
01/04/1994US5276290 Electroplating process and composition
01/04/1994US5275861 Radiation shielding fabric
01/04/1994CA1325791C Method and coating material for applying electrically conductive printed patterns to insulating substrates
12/1993
12/29/1993EP0576360A1 Process for electroless copper-plating of substrates and integrated circuits fabricated by this process
12/28/1993US5273947 Solution or paste of resinate of a noble metal, chromium resinate, a sintering inhibitor, adhesive, rosin and a solvent
12/28/1993US5273776 Method for forming thermistor thin film
12/21/1993US5272417 Device for plasma process
12/21/1993US5272111 Method for manufacturing semiconductor device contact
12/21/1993US5271956 Method of forming ternary metal fluoride films by the decomposition of metallo-organic compounds in the presence of a fluorinating agent
12/21/1993US5271955 Method for making a semiconductor device having an anhydrous ferroelectric thin film
12/21/1993US5271797 Method for patterning metal oxide thin film
12/21/1993US5271768 Coating for forming an oxide coating
12/15/1993EP0573918A1 Composite plating coatings
12/14/1993US5270659 Apparatus for measuring deposition speed of electroless plating
12/14/1993US5269973 Polymeric substrate, copper sulfide, silver sulfide, and a third metal sulfide
12/14/1993US5269838 Electroless plating solution and plating method with it
12/14/1993US5269137 Gas turbine elements bearing coke inhibiting coatings of alumina
12/08/1993EP0572445A1 Piston-based ventilator design and operation.
12/08/1993CN1023026C Nickel chemical plating technology for surface of unstable chemical property metal workpiece
12/07/1993US5268354 Heating in sealed container
12/07/1993US5268024 Formation of inorganic conductive coatings on substrates
12/01/1993EP0571832A2 Imides and their salts and their use as surface active agents
11/1993
11/30/1993US5266360 Inhibiting coke formation by coating gas turbine elements with silica
11/30/1993US5266103 Bath and method for the electroless plating of tin and tin-lead alloy
11/27/1993CA2096816A1 Imides and their salts, as well as their use
11/25/1993WO1993023588A1 A method and an apparatus for precipitation coating of internal surfaces in tanks and pipe systems
11/25/1993WO1993023348A1 Method of ceramic coating
11/24/1993EP0570432A1 Selective process for printed circuit board manufacturing
11/23/1993US5264288 Electroless process using silylated polyamine-noble metal complexes
11/23/1993US5264248 Sulfuric acid catalysts and electrodeposition of coatings
11/23/1993US5264244 Inhibiting coke formation by coating gas turbine elements with alumina
11/23/1993US5264107 Pseudo-electroless, followed by electroless, metallization of nickel on metallic wires, as for semiconductor chip-to-chip interconnections
11/18/1993EP0569585A1 Process for producing immersion member of molten metal bath
11/11/1993WO1993022472A1 Use of organo-metallic compounds for precipitating metals on substrates
11/11/1993DE4214905A1 Electroless metallisation of microporous plastics film in metal ion soln. - giving mechanical stability, strong adhesion, corrosion resistance and high conductivity, e.g. for capacitor or thin film battery
11/10/1993EP0569017A2 Molded metallized plastic microwave components and processes for manufacture
11/09/1993US5260108 Selective seeding of Pd by excimer laser radiation through the liquid
11/09/1993CA1324104C Overlay coating
11/04/1993DE4313980A1 Integrated hybrid circuit avoiding electrical disturbances - comprises conductor frame electrically connected to electronic components by silver paste with electroless plated coating on frame
11/04/1993DE4206156C1 Coating inorganic material with noble metal without redn. in hydrogen esp. for catalyst mfr. - by thermal decomposition of ammonium chloro-metallate of platinum Gp. metal under dry oxygen@-free conditions
11/03/1993EP0568224A2 Method of metallizing halogenated polyimide substrates
11/03/1993EP0568223A2 Metallized halogenated polyimide substrates
11/03/1993EP0568222A2 Method of producing modified polyimide layer having improved adhesion to metal
11/03/1993CN1077997A Light decoration material for mirror surface
11/03/1993CN1077996A Electroless plated aramid surfaces
11/02/1993US5258334 Process of preventing visual access to a semiconductor device by applying an opaque ceramic coating to integrated circuit devices
11/02/1993US5258200 Copper complexes and reducing agents for depositing copper with germanium and silicates
11/02/1993US5258062 Ceramic packages for semiconductor devices
11/02/1993US5258061 Nickel salt and reducing agent with stabilizer
10/1993
10/28/1993WO1993021359A1 Method of and apparatus for detecting concentration of chemical processing liquid and automatic control apparatus for the same method and apparatus
10/28/1993DE4213292A1 Verwendung von metallorganischen Verbindungen zur Abscheidung des Metalls auf Substraten Use of organometallic compounds for the deposition of the metal on substrates
10/27/1993EP0566901A2 Electronic devices having metallurgies containing copper-semiconductor compounds
10/27/1993CN1077756A Acidic displacing solution for electroplating of zinc
10/26/1993US5256565 Electrochemical planarization
10/26/1993US5256443 Method of producing metallic thin film sensors
10/26/1993US5256441 Controlling concentration of iron or chromium sources
10/21/1993DE4221948C1 Verfahren zur Metallisierung von Kunststoffen und Verwendung Process for the metallization of plastics and use
10/19/1993US5254411 Formation of heat-resistant dielectric coatings
10/19/1993US5254156 Aqueous solution for activation accelerating treatment
10/13/1993EP0565280A2 Method of producing printer head using piezoelectric member
10/13/1993EP0564866A2 Method for making a semiconductor device having an anhydrous ferroelectric thin film
10/13/1993EP0564780A1 Methods and apparatus for maintaining electroless plating solutions
10/13/1993EP0564673A1 Process for providing catalytically active metal layers of a metal selected from the platinum metals group
10/13/1993EP0153369B1 Electroless nickel plating of aluminum
10/12/1993US5252383 Metallized fluororesin with hydrophilic macromolecular film adhered
10/12/1993US5252356 Method of producing transparent zinc oxide films
10/06/1993EP0316452B1 Process for preparing thin film of base metal and application of the same
10/05/1993US5250322 Water-repellent metal oxide film coated on glass substrate and method of forming same
10/05/1993US5250105 Selective process for printing circuit board manufacturing
09/1993
09/29/1993EP0562393A1 Process for improving the adhesion of electrolessly deposited metal coatings
09/28/1993US5248527 On copper, measuring concentration of copper ions
09/21/1993US5246732 Applying a metal, etching, activation with lead salts and electroless plating copper
09/21/1993US5246564 Method of manufacturing copper-polyimide substrate
09/14/1993US5244742 Reduced leakage current properties; lead titanate, lead titanate zirconate, lanthanum-containing lead titanate zirconate
09/14/1993US5244691 Corundum, silicon, platinum-coated silicon substrate; ceramic constituents dissolved in acetic acid; adding acetylacetone, hexamethylenetetramine; maturing or polymerizing obtained solution; depositing layer; drying; sintering
09/07/1993US5242713 Metallizing polyimide film
09/02/1993WO1993017153A1 Process for metallizing non-conducting surfaces, and the use of hydroxymethyl sulphinic acid in that process
09/01/1993EP0557952A1 Plating method and cylindrical coil obtained thereby
08/1993
08/31/1993US5240879 Selectively etching active layer to remove from sidewall of hole before depositing electrocondutive material
08/31/1993US5240497 Alkaline free electroless deposition
08/26/1993DE4205190A1 Conditioning medium for substrate before metallisation - by using bath contg. specified amt. of an hetero:aromatic cpd., crosslinker, pH regulator and/or water miscible solvent
08/25/1993EP0420850B1 Sensitizing activator for chemical plating
08/19/1993WO1993016204A2 Process and apparatus for extracting solutes from their aqueous solutions