Patents for C23C 18 - Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating (16,252) |
---|
02/09/1994 | EP0581823A1 Means for the selective formation of a thin oxidising layer. |
02/08/1994 | US5284520 Electroless plating tank for holding solution, workpiece holder, draft pipe for blowing air into solution to produce bubbles, and shield plate having perforations of dimensions whereby bubbles cannot pass through |
02/05/1994 | CA2101881A1 Electroless copper deposition |
02/04/1994 | CA2101827A1 Adhesion of metal coatings to polypyromellitimides |
02/03/1994 | WO1994002660A1 Phosphorus-containing, crystalline, nickel-coated fabric |
02/03/1994 | DE4228442C1 Electroless nickel@ coating of metallised ceramic - using treatment to activate only the metallised areas and avoid unwanted coating of ceramic areas |
02/01/1994 | US5283083 Preparing metal-ligand compound; reacting with boron alkoxide and polyhydric compound in solvent; coating with metal borate precursor; heating |
01/27/1994 | DE4206680C1 Verfahren zur Metallisierung von Nichtleiteroberflächen und die Verwendung von Hydroxymethansulfinsäure im Verfahren A process for the metallization of non-conductive surfaces and the use of hydroxymethanesulfinic acid in the process |
01/26/1994 | EP0580019A1 Oriented polycrystalline thin films of transition metal chalcogenides |
01/25/1994 | US5281635 Precious metal composition |
01/25/1994 | US5281447 Applying oxalate of group 8 element on substrate which can be decomposed on exposure to energy, exposing in a pattern to obtain metal |
01/20/1994 | WO1994001599A1 Metallisation of plastics |
01/16/1994 | CA2079009A1 Ugs process for mechanical galvanizing |
01/12/1994 | EP0577724A1 Electroless plated aramid surfaces. |
01/11/1994 | US5277817 Purification |
01/06/1994 | WO1994000720A1 Fluid heating system |
01/05/1994 | DE4220621A1 Electroless chemical prodn. of metal layer on substrate - comprises forming palladium@ layer before metallising and producing tin oxide on substrate |
01/04/1994 | US5276290 Electroplating process and composition |
01/04/1994 | US5275861 Radiation shielding fabric |
01/04/1994 | CA1325791C Method and coating material for applying electrically conductive printed patterns to insulating substrates |
12/29/1993 | EP0576360A1 Process for electroless copper-plating of substrates and integrated circuits fabricated by this process |
12/28/1993 | US5273947 Solution or paste of resinate of a noble metal, chromium resinate, a sintering inhibitor, adhesive, rosin and a solvent |
12/28/1993 | US5273776 Method for forming thermistor thin film |
12/21/1993 | US5272417 Device for plasma process |
12/21/1993 | US5272111 Method for manufacturing semiconductor device contact |
12/21/1993 | US5271956 Method of forming ternary metal fluoride films by the decomposition of metallo-organic compounds in the presence of a fluorinating agent |
12/21/1993 | US5271955 Method for making a semiconductor device having an anhydrous ferroelectric thin film |
12/21/1993 | US5271797 Method for patterning metal oxide thin film |
12/21/1993 | US5271768 Coating for forming an oxide coating |
12/15/1993 | EP0573918A1 Composite plating coatings |
12/14/1993 | US5270659 Apparatus for measuring deposition speed of electroless plating |
12/14/1993 | US5269973 Polymeric substrate, copper sulfide, silver sulfide, and a third metal sulfide |
12/14/1993 | US5269838 Electroless plating solution and plating method with it |
12/14/1993 | US5269137 Gas turbine elements bearing coke inhibiting coatings of alumina |
12/08/1993 | EP0572445A1 Piston-based ventilator design and operation. |
12/08/1993 | CN1023026C Nickel chemical plating technology for surface of unstable chemical property metal workpiece |
12/07/1993 | US5268354 Heating in sealed container |
12/07/1993 | US5268024 Formation of inorganic conductive coatings on substrates |
12/01/1993 | EP0571832A2 Imides and their salts and their use as surface active agents |
11/30/1993 | US5266360 Inhibiting coke formation by coating gas turbine elements with silica |
11/30/1993 | US5266103 Bath and method for the electroless plating of tin and tin-lead alloy |
11/27/1993 | CA2096816A1 Imides and their salts, as well as their use |
11/25/1993 | WO1993023588A1 A method and an apparatus for precipitation coating of internal surfaces in tanks and pipe systems |
11/25/1993 | WO1993023348A1 Method of ceramic coating |
11/24/1993 | EP0570432A1 Selective process for printed circuit board manufacturing |
11/23/1993 | US5264288 Electroless process using silylated polyamine-noble metal complexes |
11/23/1993 | US5264248 Sulfuric acid catalysts and electrodeposition of coatings |
11/23/1993 | US5264244 Inhibiting coke formation by coating gas turbine elements with alumina |
11/23/1993 | US5264107 Pseudo-electroless, followed by electroless, metallization of nickel on metallic wires, as for semiconductor chip-to-chip interconnections |
11/18/1993 | EP0569585A1 Process for producing immersion member of molten metal bath |
11/11/1993 | WO1993022472A1 Use of organo-metallic compounds for precipitating metals on substrates |
11/11/1993 | DE4214905A1 Electroless metallisation of microporous plastics film in metal ion soln. - giving mechanical stability, strong adhesion, corrosion resistance and high conductivity, e.g. for capacitor or thin film battery |
11/10/1993 | EP0569017A2 Molded metallized plastic microwave components and processes for manufacture |
11/09/1993 | US5260108 Selective seeding of Pd by excimer laser radiation through the liquid |
11/09/1993 | CA1324104C Overlay coating |
11/04/1993 | DE4313980A1 Integrated hybrid circuit avoiding electrical disturbances - comprises conductor frame electrically connected to electronic components by silver paste with electroless plated coating on frame |
11/04/1993 | DE4206156C1 Coating inorganic material with noble metal without redn. in hydrogen esp. for catalyst mfr. - by thermal decomposition of ammonium chloro-metallate of platinum Gp. metal under dry oxygen@-free conditions |
11/03/1993 | EP0568224A2 Method of metallizing halogenated polyimide substrates |
11/03/1993 | EP0568223A2 Metallized halogenated polyimide substrates |
11/03/1993 | EP0568222A2 Method of producing modified polyimide layer having improved adhesion to metal |
11/03/1993 | CN1077997A Light decoration material for mirror surface |
11/03/1993 | CN1077996A Electroless plated aramid surfaces |
11/02/1993 | US5258334 Process of preventing visual access to a semiconductor device by applying an opaque ceramic coating to integrated circuit devices |
11/02/1993 | US5258200 Copper complexes and reducing agents for depositing copper with germanium and silicates |
11/02/1993 | US5258062 Ceramic packages for semiconductor devices |
11/02/1993 | US5258061 Nickel salt and reducing agent with stabilizer |
10/28/1993 | WO1993021359A1 Method of and apparatus for detecting concentration of chemical processing liquid and automatic control apparatus for the same method and apparatus |
10/28/1993 | DE4213292A1 Verwendung von metallorganischen Verbindungen zur Abscheidung des Metalls auf Substraten Use of organometallic compounds for the deposition of the metal on substrates |
10/27/1993 | EP0566901A2 Electronic devices having metallurgies containing copper-semiconductor compounds |
10/27/1993 | CN1077756A Acidic displacing solution for electroplating of zinc |
10/26/1993 | US5256565 Electrochemical planarization |
10/26/1993 | US5256443 Method of producing metallic thin film sensors |
10/26/1993 | US5256441 Controlling concentration of iron or chromium sources |
10/21/1993 | DE4221948C1 Verfahren zur Metallisierung von Kunststoffen und Verwendung Process for the metallization of plastics and use |
10/19/1993 | US5254411 Formation of heat-resistant dielectric coatings |
10/19/1993 | US5254156 Aqueous solution for activation accelerating treatment |
10/13/1993 | EP0565280A2 Method of producing printer head using piezoelectric member |
10/13/1993 | EP0564866A2 Method for making a semiconductor device having an anhydrous ferroelectric thin film |
10/13/1993 | EP0564780A1 Methods and apparatus for maintaining electroless plating solutions |
10/13/1993 | EP0564673A1 Process for providing catalytically active metal layers of a metal selected from the platinum metals group |
10/13/1993 | EP0153369B1 Electroless nickel plating of aluminum |
10/12/1993 | US5252383 Metallized fluororesin with hydrophilic macromolecular film adhered |
10/12/1993 | US5252356 Method of producing transparent zinc oxide films |
10/06/1993 | EP0316452B1 Process for preparing thin film of base metal and application of the same |
10/05/1993 | US5250322 Water-repellent metal oxide film coated on glass substrate and method of forming same |
10/05/1993 | US5250105 Selective process for printing circuit board manufacturing |
09/29/1993 | EP0562393A1 Process for improving the adhesion of electrolessly deposited metal coatings |
09/28/1993 | US5248527 On copper, measuring concentration of copper ions |
09/21/1993 | US5246732 Applying a metal, etching, activation with lead salts and electroless plating copper |
09/21/1993 | US5246564 Method of manufacturing copper-polyimide substrate |
09/14/1993 | US5244742 Reduced leakage current properties; lead titanate, lead titanate zirconate, lanthanum-containing lead titanate zirconate |
09/14/1993 | US5244691 Corundum, silicon, platinum-coated silicon substrate; ceramic constituents dissolved in acetic acid; adding acetylacetone, hexamethylenetetramine; maturing or polymerizing obtained solution; depositing layer; drying; sintering |
09/07/1993 | US5242713 Metallizing polyimide film |
09/02/1993 | WO1993017153A1 Process for metallizing non-conducting surfaces, and the use of hydroxymethyl sulphinic acid in that process |
09/01/1993 | EP0557952A1 Plating method and cylindrical coil obtained thereby |
08/31/1993 | US5240879 Selectively etching active layer to remove from sidewall of hole before depositing electrocondutive material |
08/31/1993 | US5240497 Alkaline free electroless deposition |
08/26/1993 | DE4205190A1 Conditioning medium for substrate before metallisation - by using bath contg. specified amt. of an hetero:aromatic cpd., crosslinker, pH regulator and/or water miscible solvent |
08/25/1993 | EP0420850B1 Sensitizing activator for chemical plating |
08/19/1993 | WO1993016204A2 Process and apparatus for extracting solutes from their aqueous solutions |