Patents for C23C 14 - Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material (67,378)
05/2008
05/29/2008US20080126129 Process for enhancing aesthetic or medical skin procedure
05/29/2008US20080124998 Sintered body and film forming method using the same
05/29/2008US20080124903 Techniques for low-temperature ion implantation
05/29/2008US20080124565 Current-driven device using NiMn alloy and method of manufacture
05/29/2008US20080124535 Surface-Structured Substrate And Production Thereof
05/29/2008US20080124490 Coating solution for forming wettability-varied pattern and method of producing pattern-formed body
05/29/2008US20080124489 device for making wafers of semiconductor, using photolithography techniques; prevent particles from being carried into a light exposure apparatus; computer readable storage medium that stores a control program for executing the coating film forming
05/29/2008US20080124460 Methods of obtaining photoactive coatings and/or anatase crystalline phase of titanium oxides and articles made thereby
05/29/2008US20080124453 In-situ detection of gas-phase particle formation in nitride film deposition
05/29/2008US20080121924 Apparatus for manufacturing group iii nitride compound semiconductor light-emitting device, method of manufacturing group iii nitride compound semiconductor light-emitting device, group iii nitride compound semiconductor light-emitting device, and lamp
05/29/2008US20080121620 Processing chamber
05/29/2008US20080121522 Ai-ni-la system ai-based alloy sputtering target and process for producing the same
05/29/2008US20080121521 Plasma sputtering target assembly and manufacturing method therefor
05/29/2008US20080121517 Detecting arc discharges by monitoring one or more characteristic values of the plasma process; comparing first and second vlaues with threshold values; triggering countermeasures; direct current sputtering systems
05/29/2008US20080121516 Method and apparatus for treating sputtering target to reduce burn-in time and sputtering targets made thereby
05/29/2008US20080121515 Magnetron sputtering utilizing halbach magnet arrays
05/29/2008US20080121514 Deposition system
05/29/2008US20080121513 Processing condition obtaining method and thin-film forming method
05/29/2008US20080121249 Method for Cleaning Film-Forming Apparatuses
05/29/2008US20080121183 supporting bars
05/29/2008DE202008004228U1 Vorrichtung zur Fixierung und den Weitertransport stoßempfindlicher Platten in Sputter-Beschichtungsanlagen Device for fixing and further transport shock-sensitive plates in sputter coating systems
05/29/2008DE10342398B4 Schutzschicht für einen Körper sowie Verfahren zur Herstellung und Verwendung von Schutzschichten Protective layer for a body and methods of making and use of protective layers
05/29/2008DE102006028856B4 Verfahren zum Aufbringen einer bioaktiven, gewebeverträglichen Schicht auf einen Formkörper, solche Formkörper sowie Verwendung solchermaßen beschichteter Formkörper A process for applying a bioactive, biocompatible layer on a shaped body, such molded articles as well as use of such compositions coated moldings
05/28/2008EP1925690A1 Method and apparatus for producing protective film
05/28/2008EP1925689A1 Protective film-forming method and protective film-forming apparatus
05/28/2008EP1925444A1 Base with film and glass for film formation
05/28/2008EP1925003A2 Siox:si composite material compositions and methods of making same
05/28/2008EP1924721A1 Method for vaporizing material at a uniform rate
05/28/2008EP1924720A2 Method for applying a porous glass layer
05/28/2008EP1924719A2 Siox:si composite articles and methods of making same
05/28/2008EP1924718A2 Production of fine grain micro-alloyed niobium sheet via ingot metallurgy
05/28/2008EP1782461A4 System and method of cleaning and etching a substrate
05/28/2008EP1711646A4 Physical vapor deposition target constructions
05/28/2008EP1711118A4 Electromagnetic energy distributions for electromagnetically induced mechanical cutting
05/28/2008EP1654567B1 Reflective hase-preventing article and method for the preparation thereof
05/28/2008CN101189359A Fabrication of metal oxide films
05/28/2008CN101189358A Sputtering target and process for producing the same
05/28/2008CN101189357A Deposition of uniform layer of desired material
05/28/2008CN101188207A Electrostatic sucking electrode, substrate processing apparatus and manufacturing method for electrostatic sucking electrode
05/28/2008CN101188149A A Ge adulterated AZO transparent conductive film and its making method
05/28/2008CN101187018A Method for preparing silver nano antibacterial material
05/28/2008CN101187010A Substrate holder assembly device
05/28/2008CN101187009A GCr15 bearing steel ball surface intensified ion injection technology
05/28/2008CN101187008A 淀积系统和处理系统 Deposition system and processing systems
05/28/2008CN101187007A Al-Ni-La system Al-based alloy sputtering target and process for producing the same
05/28/2008CN101187006A Double target co-sputtering method for preparing Zr doped ITO film
05/28/2008CN101187005A Plating method
05/28/2008CN101187004A Composite multi-mode plasma surface processing device
05/28/2008CN101186979A Method for manufacturing high-purity Ni-V alloy
05/28/2008CN101186128A High temperature resistant high photics reflexive conductive film and preparation method thereof
05/28/2008CN101186097A Molding method and molding apparatus of mold product having thin film at inner surface
05/28/2008CN101185773A Method for preparing bioactivity gradient hard tissue alternate material
05/28/2008CN100391034C Lithium battery electrode material Li2S/Co nanometer compound film and its preparation method
05/28/2008CN100390938C Method for removal of material by polarized radiation and back side application of radiation
05/28/2008CN100390922C Evaluation of chamber components having textured coatings
05/28/2008CN100390304C Laser strengthening and toughening method for interface between ground-mass and coating
05/28/2008CN100389918C Multicomponent composite coated cutting tool and its preparation method
05/27/2008US7378670 Shielding assembly for a semiconductor manufacturing apparatus and method of using the same
05/27/2008US7378356 Couples pulsed DC at a particular frequency to the target through a filter which filters effects of a bias power applied to the substrate, protecting the pulsed DC power supply.
05/27/2008US7378133 Fabrication system, light-emitting device and fabricating method of organic compound-containing layer
05/27/2008US7378126 Light-emitting device and method of manufacturing the same, and method of operating manufacturing apparatus
05/27/2008US7378003 Thin-film magnetic recording head manufacture using selective imaging
05/27/2008US7378002 Aluminum sputtering while biasing wafer
05/27/2008US7378001 Magnetron sputtering
05/27/2008US7377025 Method of forming an improved AP1 layer for a TMR device
05/22/2008WO2008060917A2 Methods for making sputtering targets
05/22/2008WO2008059950A1 Fuel cell separator and method for producing the same
05/22/2008WO2008059925A1 Gas barrier film laminate
05/22/2008WO2008059896A1 Abrasion-resistant film and tool provided with the same
05/22/2008WO2008059857A1 Thin-film photoelectric conversion device
05/22/2008WO2008059814A1 Magnetron sputter electrode, and sputtering device having the magnetron sputter electrode
05/22/2008WO2008059791A1 Chromium nitride coating film by ion plating, process for producing the same, and piston ring for internal combustion engine
05/22/2008WO2008059682A1 Surface-treated resin, method for producing the same, and use of the same
05/22/2008WO2008059581A1 Thin film for reflection film or semi-transparent reflection film, sputtering target, and optical recording medium
05/22/2008WO2008059580A1 Thin film for use as reflective film or semi-transmissive reflective film, sputtering target and optical recording medium
05/22/2008WO2008059579A1 Thin film for reflective film or semi-transmitting reflective film, sputtering target, and optical recording medium
05/22/2008WO2008058412A2 Coated threadlike object with improved electrical conductance and/or improved optical reflection and device for treating the surface of a threadlike object
05/22/2008US20080118844 Borides, carbides, nitrides, and/or oxides of silicon and metal such as cobalt or nickel; high-performance, high discharging capacity, high charging/discharging efficiency in the initial stage and during cyclic operation
05/22/2008US20080118770 Continuously coating an ultra-hydrophilic titanium compound thin film on both surfaces of a sheet-shaped metal substrate in a vacuum chamber using plasma, mechanically processing the thin film coated sheet into a target shape
05/22/2008US20080118767 Material for Vapor Sources of Alkali and Alkaline Earth Metals and a Method of its Production
05/22/2008US20080118631 Real-time system for monitoring and controlling film uniformity and method of applying the same
05/22/2008US20080118630 Apparatus and method for forming thin film
05/22/2008US20080116067 Physical vapor deposition chamber having an adjustable target
05/22/2008US20080116066 Sputtering Target, Sputtering Target-Backing Plate Assembly and Deposition System
05/22/2008US20080116058 Filtered cathodic arc deposition method and apparatus
05/22/2008CA2669526A1 Fuel cell separator and method for producing the same
05/21/2008EP1923902A1 Magnetron sputtering source, sputter coating system and method for coating a substrate
05/21/2008EP1923486A2 Coated inserts for milling of compacted graphite iron
05/21/2008EP1923482A1 Method and apparatus for automation of PTF measurement in sputter targets
05/21/2008EP1923481A2 Enhanced sputter target manufacturing method
05/21/2008EP1923480A2 Enhanced sputter target manufacturing method
05/21/2008EP1923479A1 AI-Ni-La system AI-based alloy sputtering target and process for producing the same
05/21/2008EP1923371A1 Ceramic target, film constituting zinc, gallium and boron oxide and method of manufacturing of the said film
05/21/2008EP1922434A2 Flow-formed chamber component having a textured surface
05/21/2008EP1922433A2 Method for making a thin film layer
05/21/2008EP1612292B1 Sputtering target and method for preparation thereof
05/21/2008EP1552033B1 Methods of treating non-sputtered regions of pvd target constructions to form particle traps, and pvd target constructions comprising projections along a non-sputtered region
05/21/2008EP1483782A4 Production method of sic monitor wafer
05/21/2008EP1356507A4 Capping layer for improved silicide formation in narrow semiconductor structures
05/21/2008EP1299903A4 Interface control for film deposition by gas-cluster ion-beam processing