Patents
Patents for C08L 79 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups (12,755)
06/2003
06/26/2003WO2003051961A1 Conductive polyaniline composition, film thereof, and processes for producing these
06/26/2003US20030119968 Intermediate transfer member and image forming apparatus having the same
06/26/2003US20030119954 Crosslinkable composition
06/26/2003CA2468443A1 Nylon polymer blends and films made therefrom
06/25/2003CN1425660A Di (trialkylbenzotri acid anhydride) devivative for optic communication
06/24/2003US6583256 Weatherable block copolyestercarbonate compositions
06/24/2003US6583201 Polymeric resin, a conductive filler, a curing agent, an optional (reactive) diluent, and as corrosion inhibitor, one of 6-hydroxyquinoline, 2-hydroxyquinoline or piperidene to improve contact resistance in harsh conditions
06/18/2003EP1319688A1 Crosslinkable composition
06/18/2003EP0588906B2 Processible forms of electrically conductive polyaniline and conductive products formed therefrom
06/18/2003CN1425033A Modified polyphenylene ether resin
06/18/2003CN1424359A Crosslinking composition
06/18/2003CN1111874C Multilayer insulated wire and transformer using same
06/18/2003CN1111561C Compositions for the stabilization of synthetic polymers and its application
06/17/2003US6579846 Thickeners for cosmetics
06/12/2003WO2003048251A1 Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s)
06/12/2003US20030109607 Thermally stabilized polyvinyl chloride compositions
06/12/2003US20030108686 Comprises cured polyamide film over transistor; improved electrical properties (voltage holding ratio, pre-tilt angles, residual direct current voltage, adherence to substrates, and printability)
06/11/2003EP1318174A1 Method of manufacture of polyester molding compositions and articles produced therefrom
06/11/2003CN1423169A Photosensitive resin composition, dry type film and processing component using same
06/11/2003CN1422911A Coating composition containing ion exchange resin
06/11/2003CN1422902A Polymer high-temperature unlubricated bearing material
06/11/2003CN1111182C Polyamid acid and polyimide micrograin and method for preparing same
06/10/2003US6575859 A belt tension adjusting device comprising a stationary fulcrum shaft, an arm pivotally supported on said fulcrum shaft through a slide bearing formed of a synthetic resin, a tension pulley mounted on said arm at one end thereof for
06/05/2003WO2003046185A1 Polycationic water soluble copolymer and method for transferring polyanionic macromolecules across biological barriers
06/05/2003WO2003046105A1 Sealing composition and seals made by using the same
06/05/2003US20030105270 Polyimides having an unusually low and tunable electrical resistivity useful for electrical and optical applications
06/05/2003US20030104218 Nylon polymer blends and films made therefrom
06/05/2003US20030104216 Coated film
06/05/2003CA2468548A1 Polycationic water soluble copolymer and method for transferring polyanionic macromolecules across biological barriers
06/04/2003EP1316591A2 Aqueous coating composition containing ion exchange resins
06/04/2003CN1422316A Impact-resistant epoxy resin compositions
06/04/2003CN1421490A Prepn process of polyimide film
06/04/2003CN1110832C Solution for forming electroconductive film method for producing the same film and use
05/2003
05/28/2003EP1314748A2 Curable resin compositions
05/28/2003EP1313611A1 Single coat non-stick coating system and articles coated with same
05/27/2003CA2310960C Phosphate-binding polymers for oral administration
05/22/2003WO2003043116A1 Proton-conducting electrolyte membrane, method for production and use thereof in a fuel cell
05/22/2003US20030097003 To produce flexible thin films made from polyimide materials having an adjustable number of electron-transport and/or hole-transport groups;electrical and optical applications
05/22/2003US20030096946 Salt of a melamine condensation product and a phosphorous-containing acid
05/21/2003EP1312631A2 Liquid crystalline polyesters having a surprisingly good combination of a low melting point, a high heat distortion temperature, a low melt viscosity, and a high tensile elongation
05/21/2003EP1311616A2 Polyarylether-polyetherimide compositions
05/21/2003EP1311614A1 Polymeric compositions for dewatering sewage sludges
05/21/2003EP1311588A1 Polyamide-imide resin solution and the use thereof for producing wire enamels
05/21/2003CN1419587A Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepreg made with these, and metal
05/21/2003CN1109076C Injection moldable polyimide resin composition and method of producing its molded articles
05/20/2003US6566437 Polycarbodiimide, aqueous emulsion polymer reactive with the carbodiimide groups and an alkoxysilane, and the alkoxysilane has a group reactive with the emulsion polymer; traffic marking compositions
05/15/2003US20030091845 Thin films deposited on a support or self-supported thin films
05/14/2003CN1108332C Water-soluble polymers and compositions thereof
05/08/2003WO2003038103A1 Method for gene transfection using synergistic combinations of cationic lipids and cationic polymers
05/08/2003WO2003037983A2 Thermoplastic polymer material for audio and/or optical data recording media
05/08/2003US20030088108 Monocarboxylic acid salt of the reaction product of an imidazole with a glycidyloxyalkyl-substituted alkoxysilane
05/08/2003US20030088030 Prepared by reacting an isocyanate-terminated polycarbodiimide with a hydroxy carboxylic acid or salt
05/06/2003US6559270 Block copolyestercarbonates may be prepared by first conducting a reaction between at least one of resorcinol or an alkyl- or haloresorcinol and at least one aromatic dicarboxylic acid dichloride, preferably isophthaloyl
05/01/2003US20030083421 Liquid crystal polymer selected from a homo- or copolymers of polybenzothiazoles, polybenzimidazoles or polybenzoxazoles; in-situ polymerization in the presence of the carbon nanotubes; high strength fibers
05/01/2003US20030079847 Fibrous sheet enhancement
04/2003
04/30/2003CN1414037A Self-lubricating nano composite material and its preparation method
04/24/2003US20030078331 For producing IC(integrated circuit) TRAY; it does not deflect due to contraction, linear expansion coefficient and heat, dimensional stability; quality, injection molding
04/24/2003US20030078323 Water resistant, strength
04/23/2003EP1304352A2 Polymer composition
04/23/2003EP0744075B1 Use of an electrically conducting polymer composition.
04/23/2003CN1413233A 滑动材料 Sliding material
04/23/2003CN1412249A Preparation method of polyimide molybdenum disulfide intercalation composite material
04/23/2003CN1106398C Block oligomers containing 1-hydrocarbyloxy-2,2,6,6-tetramethyl-4-piperidyl groups as stabilizers for organic materials
04/23/2003CN1106263C Double-axle oriented polyester film and making method thereof
04/22/2003US6552161 Fluorinated diamine; it's polyamic acid and polyimide with at least one tetracarboxylic dianhydride
04/22/2003US6552128 Ethylene-propylene-diene terpolymer and/or an ethylene-propylene copolymer, a peroxide vulcanizing agent, a resorcinol compound and a melamine resin; superior adhesion force without a coating of adhesive
04/22/2003US6552107 Melt or solution processable highly conducting polyaniline and process for preparation thereof, and blends thereof with PVC and EVA
04/22/2003CA2219483C Material comprising a polyamide, a polyether-polyamide block polymer and a functionalized polyolefin, film and object obtained from the said material
04/22/2003CA2144410C Reducing galvanic degradation of hybrid metal/composite structures
04/22/2003CA2134440C Surface dopants as blend compatibilizers in conjugated polymers
04/17/2003WO2003031191A2 Aqueous coating composition for wide format ink jet recording material
04/17/2003US20030073768 Polymer of epichlorhydrin and 2,2,4,4-tetramethyl-7-oxa-3,20-diaza-20-(2,3-epoxi-propyl)-dispiro -(5.1.11.2)-heneicosane-21-one and phenolic antioxidant
04/16/2003EP1302506A1 Use of sulphonic, phosphonic and phosphoric acids as dopants of polyaniline and of conductive composite materials based on polyaniline
04/16/2003CN1410486A Conductive polymer-sulfonated polymeric elastomer composite conductive rubber and its preparation method
04/15/2003US6548608 Polyetherimide and/or polysulphone, aromatic polyamine-modified epoxy resin and thermoplastic
04/10/2003WO2003029899A1 Positive photosensitive polyimide resin composition
04/09/2003EP1299501A2 High tracking index liquid crystalline polymers and related applications
04/09/2003EP1299488A2 Compositions for imparting desired properties to materials
04/09/2003EP1127087B1 Polycationic polymer salts, their production and use
04/09/2003CN1105149C Heat resistant polymer composition, alignment layer formed using same and liquid crystal display having alignment layer
04/08/2003US6545121 Polyimide film having denatured surface
04/08/2003US6545075 Resin component containing a poly(arylene sulfide) and a polyamide-imide; and a silane compound containing a functional group selected from the group consisting of amino, ureido, epoxy, isocyanate and mercapto groups.
04/08/2003US6544652 Cyanate ester-containing insulating composition, insulating film made therefrom and multilayer printed circuit board having the film
04/03/2003WO2003027203A2 Conducting polymer for pretreatment of metallic and non-metallic surfaces
04/02/2003EP1297539A2 Insulation material for use in high-frequency electronic parts
04/02/2003CN1104465C Primer composition and use of the same composition for coating metal surface with fluororesin
04/02/2003CN1104407C Reduction of surface tension by alkyl high-grade polyamine
04/01/2003US6542712 Method and apparatus for toner image fixing using a sheet-shaped pressing member
04/01/2003US6541178 An sulfonium(-) and iodonium(+)ion-type photoacid generator containing a naphthol structure, and photosensitive polyimide resin using photoacid generator
03/2003
03/27/2003WO2003025081A1 Die attached adhesives for semiconductor devices, an efficient process for producing such devices and the devices per se produced by the efficient processes
03/27/2003WO2003025080A1 Die attach adhesives for semiconductor applications, processes for producing semiconductor devices and semiconductor devices produced by such processes
03/27/2003US20030060391 Thixotropic dispersions of polysuccinimide and their use
03/27/2003US20030057538 Die attach adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes
03/26/2003EP0984958B1 Block oligomers containing 1-hydrocarbyloxy-2,2,6,6-tetramethyl-4-piperidyl groups as stabilizers for organic materials
03/25/2003US6538093 Polyimide silicone resin, process for its production, and polyimide silicone resin composition
03/25/2003US6537121 Two glass substrates are sealed together using epoxy or polyvinyl butyrate sealant allows for relatively low processing temperatures in order to cure the sealing material
03/20/2003WO2003022952A1 Adhesive for gas barrier laminates and laminated films
03/20/2003WO2003022929A1 Flame-retardant heat-resistant resin composition and adhesive film comprising the same
03/20/2003US20030054162 Adhesive for joining surface of semiconductor
03/19/2003CN1403732A Hose
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