Patents
Patents for C08L 79 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups (12,755)
06/2005
06/02/2005US20050119381 Thermosetting resin composition and laminates and circuit board substrates made by using the same
06/02/2005US20050116202 Printing of organic conductive polymers containing additives
06/01/2005CN1622963A Oligomeric chain extenders for processing, post-processing and recycling of condensation polymers, synthesis, compositions and applications
06/01/2005CN1204176C Method and compositions
05/2005
05/31/2005US6900264 Liquid crystal polymer selected from a homo- or copolymers of polybenzothiazoles, polybenzimidazoles or polybenzoxazoles; in-situ polymerization in the presence of the carbon nanotubes; high strength fibers
05/26/2005WO2005047390A1 Coating/pretreatment composition and methods of using the same
05/26/2005US20050113559 Such as which provides stable interface for adhesive binding or coating of paint or plastics; replaces chromate-based surface treatment
05/26/2005US20050112362 Polyimide resin and cast-on-copper laminate
05/19/2005WO2005045475A2 Polyimides for use as high refractive index, thin film materials
05/19/2005US20050107542 Film adhesives containing maleimide compounds and methods for use thereof
05/19/2005US20050106409 Organic composition, organic ntc element, and process for producing the same
05/18/2005EP1123345B1 High performance plastic pallets
05/18/2005CN1617928A Polycationic water soluble copolymer and method for transferring polyanionic macromolecules across biological barriers
05/18/2005CN1616598A Aromatic liquid crystalline polyester film
05/18/2005CN1616547A Resin composition, prepreg and laminate using the composition
05/18/2005CN1202154C Glycidyl ether group-contg. partial alkoxysilane condensate, silane-modified resin, compsns. of these, and processes for producing these
05/17/2005US6894123 Wash primers in automotive and refinish coatings
05/12/2005US20050100738 Resin composition, prepreg and laminate using the composition
05/11/2005EP1529812A1 Polyimide based compositions useful as electronic substrates, derived in part from (micro-powder) fluoropolymer, and methods and compositions relating thereto
05/11/2005CN1615340A Nylon polymer blends and films made therefrom
05/11/2005CN1200976C Heat resistant compsns.
05/11/2005CN1200975C Moulding composition with excellent blow moulding property
05/05/2005US20050096429 Polyimide based compositions useful as electronic substrates, derived in part from (micro-powder) fluoropolymer, and methods and compositions relating thereto
05/04/2005EP1528077A1 Composite particle having carbodiimide resin layer and process for producing the same
05/04/2005EP1528076A1 Methods of synthesis of polysuccinimide, copolymers of polysuccinimide and derivatives thereof
05/04/2005EP1528075A1 Methods of synthesis of polysuccinimide copolymers of polysuccinimide and derivatives thereof
05/04/2005EP1527123A1 Method for the treatment of polyazole films
05/04/2005CN1200045C Conductive polymer-sulfonated polymeric elastomer composite conductive rubber and its preparation method
05/03/2005US6887971 Such as liquid carbon dioxide starting with an aminoacid such as L-aspartic acid
05/03/2005US6887967 Polyimide resin produced by reacting a prepolymer with an isocyanate group at the end obtained by reacting a polyisocyanate compound with a polyol compound having a linear hydrocarbon structure with an anhydride
05/03/2005US6887525 Insulation material for use in high-frequency electronic parts
04/2005
04/28/2005WO2005037926A1 Black composition, black coating composition, resin black matrix, color filter for liquid crystal display and liquid crystal display
04/28/2005WO2004050223A3 Polyimide blends for gas separation membranes
04/27/2005EP1526157A1 Aromatic polyimide composition and articles manufactured therefrom
04/27/2005EP1525258A2 Ultraviolet radiation stabilized polyolefins
04/26/2005US6884854 A thermally curable formulation containing an epoxy resin, a copolymer having glass transition temp. of -30 degree C. or lower and epoxy reactive group or reaction product with epoxy resin, a hardner, and a polyamide or polyimde or mixture
04/21/2005US20050085618 Excellent adhesion substrates such as copper foil or resin film; made by casting a solution containing a halo-substituted phenol such as p-chlorophenol, an aromatic liquid crystalline polyester, and a non-liquid crystalline polyarylate in given ratio, and desolventizing
04/21/2005US20050085616 Heating; elimination of carbon dioxidea diisocyanate
04/20/2005CN1197902C Polyimide material filled with nano zinc oxide
04/19/2005US6881768 A tile grout composition and method of using the tile grout composition to grout set tiles are provided. The tile grout composition is a water-based epoxy grout composition which has excellent stain and chemical resistant properties and is
04/19/2005US6881492 Primer composition for polyesters
04/19/2005CA2163551C Energy-curable cyanate/ethylenically unsaturated compositions
04/14/2005WO2005033181A2 Telechelic homopolyamino acids functionalized by hydrophobic groups and uses, particularly therapeutic, thereof
04/14/2005US20050080183 Dielectrics accuracy; heat dissipation ; glass transition temperature; heat resistance; copper cladding laminate ; high speed signal transfer
04/14/2005DE10345799A1 Melaminharz enthaltende Haftklebstoffe Melamine resin-containing pressure-sensitive adhesives
04/14/2005CA2540357A1 Telechelic homopolyamino acids functionalized by hydrophobic groups and uses, particularly therapeutic, thereof
04/13/2005EP1521812A2 Two component coating compositions and coatings produced therefrom
04/13/2005EP0931816B1 Norbornene polymer composition
04/07/2005WO2005030253A2 Photocleavable dna transfer agent
04/07/2005US20050075438 Composite adhesive
04/07/2005US20050074592 Easily slidable polyimide film and substrate employing it
04/07/2005DE10340642A1 Toluene solutions of polyaniline for producing thin layers, e.g. for use in electronics, contain an aliphatic hydrocarbon to increase the conductivity of the layer
04/06/2005EP1520898A2 Pressure-sensitive adhesives comprising melamin resin
04/06/2005CN1604940A Crosslinkable elastomer composition and formed product comprising the same
04/06/2005CN1603357A A stabilizer against hydrolysis for an ester-group- containing resin and a thermoplastic resin composition
04/05/2005US6875554 Positive photosensitive polyimide resin composition
03/2005
03/31/2005US20050070639 Pressure sensitive adhesives comprising melamine resin
03/31/2005US20050070637 Crosslinkable elastomer composition and formed product comprising the same
03/30/2005EP1518901A2 Mouldings based on Polyetheramines
03/30/2005EP1518893A1 Preparation of a composite of elastomer and exfoliated clay platelets, rubber compositions comprised of said composite and articles of manufacture, including tires
03/30/2005EP1518883A2 Polyethersulphone articles
03/30/2005CN1602342A Improved polyamide-imide molding resins and methods for their preparation
03/30/2005CN1601398A Clad pipe
03/30/2005CN1195017C Method of polyester imide modified dimaleimide
03/29/2005US6872457 Atomic oxygen-resistant film
03/29/2005CA2103512C Conducting plastics material and a method for its preparation
03/24/2005US20050065296 Adhesive composition and adhesive film
03/24/2005US20050065278 Polyimides for use as high refractive index, thin film materials
03/24/2005US20050065266 Comprises cis-1,4-polybutadiene and butadiene/styrene copolymer elastomer; emulsion polymerization; precipitation; for aircraft
03/24/2005US20050065241 Sealing epoxy resin; reducing sdielectrics: toughness
03/24/2005US20050064200 Polycarbodiimides; for electronic parts and lamination treatments; improved storage stability, adhesive strength, and high elastic modulus at high temperatures; for adhesion of copper foil onto glass fiber reinforced epoxy resin substrate
03/24/2005US20050062020 Conductive polyaniline composition, film thereof and processes for producing these
03/23/2005EP1516891A1 A binder composition for lamination and an adhesive film using the same
03/23/2005EP1516031A1 Heat curable adhesive composition, article, semiconductor apparatus and method
03/23/2005CN1597781A Nano composite of polypyrrole / carbon black and preparation process thereof
03/23/2005CN1194428C High resistance polyaniline useful in high efficiency pixellated polymer electronic displays
03/22/2005US6869715 Ion conductive membrane for electrochemical application
03/17/2005WO2005023933A1 Thermosetting resin composition for high speed transmission circuit board
03/17/2005WO2005023713A1 Filmy graphite and process for producing the same
03/17/2005WO2005023543A2 Water resistant ink jet printable sheet
03/17/2005US20050059774 Water-borne resin composition and electrocoating composition
03/17/2005CA2531021A1 Water resistant ink jet printable sheet
03/16/2005EP1514897A1 A stabilizer against hydrolysis for an ester-group- containing resin and a thermoplastic resin composition
03/16/2005CN1193273C 定影装置与图像形成装置 The fixing device of the image forming apparatus
03/16/2005CN1193176C Overlay material and use and composite laminated material
03/16/2005CN1193067C Liquid crystalline polymer compositions containing small article size fillers
03/16/2005CN1193031C Salt of melamine condensation product and phosphorus-containing salt
03/10/2005US20050054810 Controlling the biodegradability of a biodegradable polyester or polyester blend with a polyamine or polyamide by reacting twith a cross linking agent, e.g,. dicyclohexylcarbodiimide, capable of reacting with an active hydrogen ; storage stability; impact strength; durability; household appliances
03/10/2005US20050054776 superior thermal-stress-reducing effects; adhesive for printed circuit manufacture; cured film obtained from a modified polyamideimide resin, a thermosetting resin and an organic phosphorus-based compound
03/10/2005US20050054755 Stabilizer against hydrolysis for an ester-group-containing resin and a thermoplastic resin composition
03/10/2005US20050054753 Comprising a crosslinkable fluoroelastomer, a crosslinking agent, and a polyimide resin powder as a reinforcing material; seals free from metals and sulfur, suitable for the production unit for semiconductor devices
03/09/2005CN1592540A Polyimide metal laminate
03/09/2005CN1590439A A carbodiimide composition with suppressed yellowing, a stabilizer against hydrolysis and a thermoplastic resin composition
03/09/2005CN1191972C Method and composition for improving gas barrier properties of polymeric containers and films
03/08/2005US6863994 Copper, aluminum alloy; heating, hardening thermosetting resin
03/08/2005US6863974 Multilayer non-stick coating
03/05/2005CA2480380A1 A stabilizer against hydrolysis for an ester-group-containing resin and a thermoplastic resin composition
03/03/2005US20050049363 Compatible blends of thermoplastic molding compositions
03/03/2005US20050048297 Polyimide metal laminate
03/03/2005US20050046047 Resin-encapsulated semiconductor apparatus and process for its fabrication
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