Patents
Patents for C08L 79 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups (12,755)
12/2000
12/13/2000EP0824576B1 Multilayer second-order nonlinear optical films of head-to-head mainchain chromophoric polymers
12/13/2000EP0738297B1 New flame retardant polymeric compositions
12/13/2000CN1059450C Method for preparation of polyimide film with optical compensation on LCD
12/12/2000US6159654 Comprising a photosensitive heat cure accelerator; forming a polyimide film pattern
12/12/2000US6159611 Used in electronic circuitry and electronic components such as multilayer printed circuits, flexible circuits, semiconductor packaging and buried film capacitors
12/07/2000WO2000073853A1 Method for forming polyimide pattern using photosensitive polyimide and composition for use therein
12/06/2000EP1056797A1 Method for producing polymer mixtures comprised of amino nitriles and thermoplastic polymers
12/06/2000CN1276086A Electronically-conductive polymers
12/05/2000US6156831 Modified cyanate ester group curable resin composition and varnish, prepreg, metal clad laminated board, film, printed circuit board, and multilayered circuit board using the same
11/2000
11/30/2000WO2000025829A3 Radiodense compositions
11/30/2000DE19930947A1 Herstellung eines leitfähigen polymeren Nanoverbundstoffes Production of a conductive polymeric nanocomposite
11/29/2000EP1055708A1 Resin composition, molded article thereof, and process for producing resin composition
11/29/2000CN1274939A Process for manufacturing parts on sealed glass substrate
11/28/2000US6153726 Transparent conducting polymers
11/23/2000WO2000069960A1 Process for preparing starch and epoxy-based thermoplastic polymer compositions
11/23/2000CA2372226A1 Process for preparing starch and epoxy-based thermoplastic polymer compositions
11/22/2000EP1054428A1 Seal for flat panel displays
11/22/2000CN1273981A Process for removing active center on inner surface of metallic chromatographic column tube
11/22/2000CN1058782C Method for inhibiting hydrate formation
11/21/2000US6150475 Polyester resins having improved properties
11/21/2000US6150473 Polyetherimide resin/polyester resin blends having improved properties
11/21/2000US6150472 Block copolymers crosslinked to polysaccharide with cellulose derivatiiives, polyacrylic acid, polyethers and polyethylenimine,
11/21/2000US6150456 High dielectric constant flexible polyimide film and process of preparation
11/21/2000US6150032 Electroactive polymer coatings for corrosion control
11/21/2000US6149840 Blend of an undoped polymer(s) such as polyanilines which is electroconductive upon doping; specified dielectric polymer(s); and a thermally deblockable dopant such as triflates; heating to electroconductive, compatible blend
11/16/2000WO2000068318A1 Resin composition containing crystalline polyimide
11/16/2000CA2372573A1 Resin composition containing crystalline polyimide
11/14/2000US6147374 Resin-encapsulated semiconductor apparatus
11/14/2000US6146497 Adhesives and resins, and processes for their production
11/14/2000CA2164175C Fine-grained polymerizable compositions flowable under pressure or shear stress
11/09/2000WO2000067340A1 Electroactive polymers of high sulfur content for use in electrochemical cells
11/07/2000US6143467 Photosensitive polybenzoxazole precursor compositions
11/07/2000US6143363 Ink receiver layer for printing of various products poor in absorption of water-based ink,
11/02/2000WO2000064981A1 Compositions and methods for reduced food adhesion
11/02/2000WO2000064980A1 Filler for crosslinkable elastomer and crosslinkable elastomer composition containing the same
11/02/2000EP1048680A1 Modified polyimide resin and thermosetting resin composition containing the same
10/2000
10/31/2000US6140454 Comprising an epoxy resin, a phenolic resin and a polycarbodiimide resin; integrated circuit package resin composition
10/31/2000US6140429 Injection moldable polyimide resin composition and a method of producing its molded articles
10/31/2000US6140411 Extrudable halogen-free mixture comprising 95-5 weight-% polyetherimide polymer with elastic modulus greater than 2000 mpa and 5-95 weight-% flexible siloxane-polyetherimide polymer with elastic modulus of less than 2000 mpa; electrical cables
10/31/2000US6140410 Containing melt-fabricable functionalized fluoropolymer and high temperature resistant thermoplastic adhesion promoter, and having enhanced adhesion to metal at low concentrations of high temperature resistant thermoplastic
10/31/2000US6139926 Polyimide photo alignment film from 3,3,4,4-benzophenone tetracarboxylic dianhydride and ortho-substituted aromatic diamines for liquid crystal displays
10/31/2000US6139917 Polyimides
10/25/2000EP0637613B1 Resin composition
10/24/2000US6136909 Polyaniline layered inorganic nanocomposites.
10/19/2000WO2000061684A1 Varnish composition and liquid-crystal display element
10/18/2000EP1044198A1 Morpholino end-capped, hindered amine substituted aminotriazine and their use as light stabilizers
10/18/2000CN1270613A Aqueous compositions
10/17/2000US6133407 Low viscosity solution containing high concentration of salt of aromatic diamine and aromatic tetracarboxylic acid and/or its diester which undergoes imidation upon heating
10/17/2000US6132645 Electrical resistance, carbon black particles, polyaniline and bis(benzenesulfonic acid) ether
10/17/2000CA2192396C Bismaleimide compounds and methods for their preparation
10/12/2000WO2000060009A1 Poly(biphenyl ether sulfone) resins having improved uv yellowing resistance
10/11/2000EP1042701A1 Polyamic acid composition, liquid crystal aligning film, and liquid crystal display element
10/11/2000EP1042398A1 Adhesives and resins, and processes for their production
10/11/2000EP1000108A4 Aqueous polyimide process
10/10/2000US6129982 Aromatic polyimide film having improved adhesion
10/03/2000US6127322 Reaction product of i) esterified unsaturated polymer or oligomer; ii) an unsaturated acid or anhydride-modified polyalkylene; and iv) compound containing at least two primary or secondary amine groups; low haze, compatibility
10/03/2000US6127086 Photosensitive resin compositions
10/03/2000US6126860 Hydrolysis stabilizer for ester group-containing resin
10/03/2000US6126856 Composition containing liquid crystalline polymer
09/2000
09/28/2000WO2000056799A1 Reworkable thermosetting resin compositions
09/28/2000CA2331790A1 Reworkable thermosetting resin compositions
09/21/2000WO2000025819A9 Enhanced radiation therapy
09/20/2000EP1037112A1 Positive photosensitive resin precursor composition and process for producing the same
09/19/2000US6121406 Improved in reactivity and storage stability, and is thereby easy to handle as a crosslinking agent for hydrophilic resins
09/19/2000CA1341099C Structures exhibiting improved transmission of ultrahigh frequency electromagnetic radiation and structural materials which allow their construction
09/14/2000WO2000053677A1 Aqueous-based polyamide-amic acid compositions
09/13/2000EP0828779B1 Water-soluble polymers and compositions thereof
09/13/2000CN1266350A Compositions for use in personal care
09/06/2000EP1033388A1 Thermoplastic resin composition
09/06/2000EP1033382A2 Resin additive, curable resin composition, and cured resin
09/06/2000CN1265698A Adhesive composition for hot bonding and bonding method using same
09/06/2000CN1056165C Preparation of mixed polyaniline aqueous solution and dispersant liquid
09/05/2000US6114472 Thermoplastic resin composition containing amorphous polyimide
08/2000
08/31/2000WO2000027513A3 Polymer composition, membrane containing said composition, method for the production and use thereof
08/30/2000EP1031160A1 Conducting polymers for coatings and antielectrostatic applications
08/30/2000EP0897407B1 Sulphonated polyimides, membranes and fuel cell
08/29/2000US6111031 Filled polyetherimide resin compositions
08/23/2000EP1029957A1 Polybenzazole article and production method thereof
08/23/2000EP1029893A2 Resin composition
08/23/2000EP1029329A1 Conductive polymer compositions
08/23/2000EP1029000A1 Crystallization resistant amidoamine compositions
08/23/2000CN1263919A Wear-resistant coating
08/23/2000CN1263909A Polyetherimide modified epoxy resin
08/22/2000US6107448 Made from 2,2-bis(4-isocyanatophenyl)hexafluoropropane; excellent solubility and heat resistance and also has excellent adhesion, low-temperature workability and moisture resistance; films and adhesive sheets
08/22/2000US6106906 Forming electroconductive film of organometallic complex
08/17/2000WO2000047676A1 Novolak cyanate blends
08/16/2000EP1028354A1 Positive photosensitive resin composition, method of forming relief pattern, and electronic part
08/16/2000EP1028144A2 Curable compositions comprising cyanate resins and epoxy compounds
08/16/2000EP1027709A1 Electronically-conductive polymers
08/16/2000EP0980401A4 Aqueous dispersions of polyamides
08/16/2000EP0980400A4 Aqueous dispersions of polyamides
08/16/2000EP0939791B1 Method of producing injection moldable polyimide resin compositions and molded articles
08/16/2000EP0722470B1 Multifunctional organic polymers
08/15/2000US6103818 Resin composition and heat-resistant, returnable IC tray obtained by molding the same
08/15/2000US6103806 A polymer alloy; the molded articles having an excellent dimensional accuracy and flexural modulus at high temperture
08/15/2000US6103145 Crosslinked water-soluble electrically conducting polymers
08/15/2000CA2192394C Thermosetting resin forming compositions, resins therefrom and methods for their preparation
08/15/2000CA2064808C Liquid crystal polymer film
08/10/2000DE19905448A1 Cyanatharze und Epoxidverbindungen enthaltende härtbare Mischungen Cyanate resins and epoxy-containing curable mixtures
08/09/2000EP0815172B1 Immiscible polymer compatibiliser system
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