| Patents for C08L 79 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups (12,755) |
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| 03/02/2005 | EP1509930A2 Sulfonated conducting polymer-grafted carbon material for fuel cell applications |
| 03/02/2005 | CN1587319A Process for preparing rare-earth modified carbon fiber/polyimide composite material |
| 03/01/2005 | US6861497 Flexible thin films |
| 03/01/2005 | US6861463 Liquid crystalline polymer compositions containing small particle size fillers |
| 03/01/2005 | US6861398 Thixotropic dispersions of polysuccinimide and their use |
| 02/24/2005 | US20050043502 The polyimide contains 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane and the addition-condensation polyamide contains carboxylated polybutadiene with an optional acrylonitrile block; low elasticity, excellent flexibility and heat resistance |
| 02/24/2005 | US20050043484 Melting mixing and polymerization then vulcanization a rubber mixture to improve mechanical properties of polymers |
| 02/24/2005 | CA2535676A1 Flame retardant fiber reinforced composition with improved flow |
| 02/23/2005 | CN1585803A Resin composition for optical parts and optical parts |
| 02/23/2005 | CN1583874A Method for improving antigen oxygen peeling of aircraft by adding nanometer partical material |
| 02/22/2005 | US6858671 Method of manufacture of polyester molding compositions and articles produced therefrom |
| 02/22/2005 | US6858203 Treating of hyperphosphatemia by ingesting a ion exchanging resin comprising an allyl addition polymer having an amine salt or quaternary amine functional group; side effect reduction |
| 02/17/2005 | US20050038172 Probe (thermistor) received within conducting tube forming thermowell, having annular fins; gas pipelines |
| 02/17/2005 | US20050037401 Photocleavable DNA transfer agent |
| 02/16/2005 | EP1138719B1 Polyimide/polyarylate resin compositions and moldings thereof |
| 02/16/2005 | CN1582318A Flame-retardant heat-resistant resin composition and adhesive film comprising the same |
| 02/16/2005 | CN1189914C Process for manufacturing parts on sealed glass substrate and plasma pand made therefrom |
| 02/15/2005 | US6855758 Hydrolysis-resistant, transparent, biaxially oriented film made from a crystallizable thermoplastic, and process for its production |
| 02/10/2005 | WO2005012950A2 High refractive index layers |
| 02/10/2005 | WO2005012423A1 Water-based polymer composition and articles made therefrom |
| 02/10/2005 | US20050033014 High resistance polyaniline blend for use in high efficiency pixellated polymer electroluminescent devices |
| 02/10/2005 | US20050032947 Carbodiimide composition with suppressed yellowing, a stabilizer against hydrolysis and a thermoplastic resin composition |
| 02/09/2005 | EP1505110A1 A carbodiimide composition with suppressed yellowing, a stabilizer against hydrolysis and a thermoplastic resin composition |
| 02/09/2005 | EP1111995B1 Topical dermal antimicrobial compositions |
| 02/09/2005 | CN1576318A 树脂组合物 Resin composition |
| 02/09/2005 | CN1576317A Molding composition based on polyetheramides |
| 02/09/2005 | CN1576295A Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition containing the same, film-forming material and adhesive for electronic parts made thereof |
| 02/07/2005 | CA2476732A1 A carbodiimide composition with suppressed yellowing, a stabilizer against hydrolysis and a thermoplastic resin composition |
| 02/03/2005 | US20050025976 High refractive index layers |
| 02/03/2005 | US20050025944 Heat resistance; low temperature fusion; forming apertures in dielectric substrate |
| 02/03/2005 | DE10333005A1 Formmasse auf Basis von Polyetheramiden Shape composition based on polyetheramides |
| 02/03/2005 | DE10330461A1 Production of polymer membrane, used in membrane electrode unit for fuel cell, uses phosphorus and/or sulfur oxy-acid in liquid for hydrolyzing membrane made by heating mixture of polyphosphoric acid and polyazole or precursors |
| 02/02/2005 | EP1502928A1 Molded polyester for housing |
| 02/02/2005 | CN1575092A Thermophilic polyimide resin and cast-on-copper laminate |
| 02/02/2005 | CN1573553A Composition for forming wiring protective film and uses thereof |
| 02/02/2005 | CN1573093A 压缩机 Compressor |
| 02/02/2005 | CN1572837A High temperature polymeric materials containing corona resistant composite filler, and preparing methods thereof |
| 02/02/2005 | CN1187185C Polyamide composite material with double or multiple layers |
| 02/01/2005 | US6849385 Polyamide or polyamideimide from an aromatic diamine having a carboxy photosensitive group, e.g., 2-methacryloyloxyethyl 3,5-diaminobenzoate; unsaturated silane coupler; monomer having at least 5 unsaturated bonds |
| 01/27/2005 | US20050019554 Adhesives film for multilayer printed circuit polyamide heat resistant resin and copolymers with ether, imide and benzimidazole and polybutadiene layer |
| 01/26/2005 | CN1569932A Schiff base chemical modified tribological material |
| 01/25/2005 | US6847125 Resin-encapsulated semiconductor apparatus and process for its fabrication |
| 01/25/2005 | US6846864 Composition and article for reduced food adhesion |
| 01/25/2005 | CA2189918C Dispersant additives |
| 01/20/2005 | WO2005006826A1 Thermosetting resin composition for multilayer printed wiring board, thermosetting adhesive film and multilayer printed board made by using them |
| 01/20/2005 | WO2005005541A1 Phenol resin composition |
| 01/20/2005 | WO2004106411A3 Biodegradable poly(beta-amino esters) and uses thereof |
| 01/20/2005 | WO2004081103A3 Method for lowering the melt viscosity of an aromatic sulfone polymer composition, and method for manufacturing an aircraft component |
| 01/20/2005 | US20050014925 Polyamic acid oligomer, polyimide oligomer, solution composition, and fiber-reinforced composite material |
| 01/20/2005 | US20050014908 Adhesive for gas barrier laminates and laminated films |
| 01/20/2005 | US20050014842 Heat and hydrolysis resistant extruded pipes and blow moldings; long lasting flexibility, low temperature impact strength; plasticizer free |
| 01/20/2005 | US20050013962 Polymer containing methyl methacrylate compound; melt blending mixture |
| 01/19/2005 | EP1498105A2 Composition containing at least one conductive polymer and non-film forming rigid particles, corresponding process and use |
| 01/19/2005 | EP1497374A1 Filler reinforced polyether imide resin composition and molded article thereof |
| 01/19/2005 | EP1497348A1 Cationically modified, anionic polyurethane dispersions |
| 01/19/2005 | EP1021478B1 PHTHALONITRILE THERMOSET POLYMERS AND COMPOSITES CURED WITH HALOGEN-CONTAINING AROMATIC AMINE CURING AGENTS and process for producing them |
| 01/18/2005 | CA2474992A1 Molding composition based on polyetheramides |
| 01/13/2005 | US20050009971 Mixture of polybiguanides microbiocide with basic acrylic ester copolymer which provides sustained effect after use |
| 01/13/2005 | US20050008868 Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg |
| 01/13/2005 | US20050008832 Connecting microelectronic circuit |
| 01/12/2005 | EP1496094A2 An adhesive sheet based on a siloxane-modified polyamideimide resin composition, and a CSP board and a semiconductor device produced by using the sheet |
| 01/12/2005 | EP1496078A1 Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition containing the same, film-forming material and adhesive for electronic parts made thereof |
| 01/12/2005 | EP1461387A4 Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s) |
| 01/12/2005 | EP1263876B1 Pipes containing heat insulating material |
| 01/12/2005 | CN1563194A Electro-optical polarized polymer containing nano ferroelectric crystals, and preparation method |
| 01/12/2005 | CN1563149A Coupled reaction method for preparing nano hybridization material of polyimide-oxide of silicon |
| 01/11/2005 | US6841629 Modified polyphenylene ether resin |
| 01/11/2005 | US6841615 Composite Adhesive |
| 01/06/2005 | WO2005000964A1 Conductive endless belt and image-forming device using same |
| 01/06/2005 | US20050004281 High performance plastic pallets |
| 01/06/2005 | US20050003109 Dye type polarizing plate |
| 01/05/2005 | EP1000108B1 Aqueous polyimide process |
| 01/05/2005 | CN1183044C Floculant for treating sewage |
| 01/04/2005 | US6838141 Laminated structure which comprises a rubber layer of an EPDM terpolymer or an ethylene-propylene copolymer and a laminate comprising a metal foil and a resin |
| 12/30/2004 | US20040266956 Resin composition |
| 12/30/2004 | US20040265601 Adhesion, heat resistance; bonding polyimide to copper foils |
| 12/30/2004 | US20040261611 Compressor |
| 12/30/2004 | DE10326380A1 Verträgliche Blends von thermoplastischen Formmassen Compatible blends of thermoplastic molding compositions |
| 12/29/2004 | WO2004113446A2 Polyimide resin with reduced mold deposit |
| 12/29/2004 | WO2004055921A3 Organic electroluminescent component with triplet emitter complex |
| 12/29/2004 | EP1491587A2 Resin composition |
| 12/29/2004 | EP1490429A2 Compositions consisting of cationic polymers comprising amidinium groups and ionic liquids |
| 12/28/2004 | US6835785 Polyphenylene ether oligomer compound, derivatives thereof and use thereof |
| 12/23/2004 | US20040260055 Polyimide resin with reduced mold deposit |
| 12/23/2004 | US20040260053 Polyimide resin and cast-on-copper laminate |
| 12/22/2004 | EP1489261A1 Compressor |
| 12/22/2004 | EP1489127A1 Polyimide resin and cast-on-copper laminate |
| 12/22/2004 | EP1487900A1 Preparation of polyimide polymers |
| 12/22/2004 | CN1556939A 正感光性聚酰亚胺树脂组合物 Positive photosensitive polyimide resin composition |
| 12/16/2004 | US20040254286 moldings, films and/or monofilament comprising polyethylene terephthalate co/homopolymers and inorganic or organic fibers, formed by melt spinning |
| 12/15/2004 | EP1486535A1 Compatible blends from thermoplastic mouldings |
| 12/15/2004 | EP1486519A1 A kind of functional olefin mother grain and the method of it and the use of it |
| 12/15/2004 | CN1555563A Conductive materials with electrical stability for use in electronics devices |
| 12/14/2004 | US6831132 Useful as adhesives in microelectronics industry; film adhesives may be used to produce microelectronic assemblies with very thin bond lines without compromising adhesive strength |
| 12/09/2004 | WO2004106414A1 Dispersions of rigid-chain conjugated polymers, method for the production and use thereof for producing electronic components |
| 12/09/2004 | WO2004106411A2 Biodegradable poly(beta-amino esters) and uses thereof |
| 12/09/2004 | US20040249115 Polymerizing L-aspartic acid in the presence of an end capping initiator to form a polysuccinimide; and hydrolyzing the polysuccinimide to form the poly(succinimide-aspartate) copolymer |
| 12/09/2004 | US20040249114 Polymerizing a dicarboxylic amino acid in the presence of an end capping initiator to form the polymeric material |
| 12/09/2004 | US20040249041 comprises polyimide films; useful in high voltage wire insulation |
| 12/09/2004 | US20040247908 Dry film; polyimides; mixture containing sulfur compound |