Patents
Patents for C08L 79 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups (12,755)
01/2004
01/15/2004US20040010094 Friction and aging resistance; fluid flow melt; gears
01/15/2004US20040010091 Reducing volatility organic compounds; crosslinking; automobile finishes
01/15/2004CA2491606A1 Non-stick coating and method of forming same
01/14/2004EP1381107A2 Proton conductive solid polymer electrolyte
01/14/2004CN1468391A 正感光性聚酰亚胺树脂组合物 Positive photosensitive polyimide resin composition
01/14/2004CN1468281A Method and compositions
01/14/2004CN1467242A Method for preparing polymer surface modified high-crosslinking ultra-thin hydrophilic coating
01/14/2004CN1134506C Thermoplastic resin composition
01/14/2004CN1134488C Acylation polymerized polyamines compounds
01/13/2004US6677099 Positive type photosensitive polyimide resin composition
01/13/2004US6677015 Polyamine/amide copolymer having high melt stiffness; easy cutting
01/08/2004WO2004003080A1 Highly durable polybenzazole composition, fiber and film
01/08/2004WO2004003057A1 Curable composition, cured article obtained therefrom, and polyimide resin for use in the same
01/08/2004US20040006174 For coating, storage stability
01/08/2004US20040005464 Anti-corrosion paint for steel with polyaniline
01/08/2004CA2490259A1 Highly durable polybenzazole composition, fiber and film
01/07/2004CN1466611A Low temperature bonding adhesive composition
01/06/2004US6673872 Blend of polyimide thermoplastic and low viscosity poly(arylene) ether
12/2003
12/31/2003WO2004000966A1 Heat curable adhesive composition, article, semiconductor apparatus and method
12/31/2003WO2002054515A3 Conductive polyamine-based electrolyte
12/31/2003CN1464898A 树脂组合物 Resin composition
12/31/2003CN1132886C Fast hardening aqueous coating composition and paint
12/25/2003WO2003107427A1 Interlayer dielectric and pre-applied die attach adhesive materials
12/25/2003US20030236359 Polyimide substrates having an interpenetrating network morphology and methods relating thereto
12/24/2003CN1131719C Gas permeable fabric
12/23/2003US6667107 Thermosetting resin composition and use thereof
12/18/2003WO2002016476A8 Polyamide-imide resin solution and the use thereof for producing wire enamels
12/17/2003EP1371681A2 Biaxially oriented, hydrolysis resistant film, method for its preparation and use
12/17/2003CN1131263C Compositions with fire-retardant characteristic and moulding performance and products containing same
12/16/2003US6664021 Photosensitive polymide precursor resin composition
12/10/2003EP1369450A1 Polyaryl ketone resin film and laminates therof with metal
12/10/2003EP1368110A1 Functionalised polyimide moulded body and functionalised polyimide membrane
12/09/2003US6660798 Mixtures of fluoropolymer dispersions
12/09/2003US6660796 Polyester molding composition
12/09/2003CA2162847C Liquid crystalline polymer blends with improved wear properties
12/04/2003WO2003100884A2 Sulfonated conducting polymer-grafted carbon material for fuel cell applications
12/04/2003US20030225221 A blends comprising one or more polyimides, polyamideimide copolymers, polysulfones, polyether sulfone copolymers, polyetherimide copolymers and a low viscosity polyphenylene ether; high glass transition temperature, melt processability
12/04/2003US20030225191 Hindered amine light stabilizers used for stabilization polyethylene, polypropylene or copolymers; photostability, heat or oxidation resistance
12/04/2003CA2486790A1 Sulfonated conducting polymer-grafted carbon material for fuel cell applications
12/02/2003US6657245 Resin-encapsulated semiconductor apparatus and process for its fabrication
12/02/2003US6656388 Polymeric complex consisting of a conductive polymer ionically bound to polyelectrolyte having acid functional groups
11/2003
11/27/2003WO2003002667A3 Moldable poly(arylene ether) thermosetting compositions, methods, and articles
11/27/2003US20030220455 Heat resistant resin composition and adhesive film
11/27/2003US20030219614 Biaxially oriented, hydrolysis-resistant film made from a thermoplastic with a hydrolysis stabilizer, process for producing the film, use of the film, and capacitors produced from the film
11/25/2003US6653436 Water dispersible epoxy resins
11/25/2003US6653433 Polyimide composition having improved peel strength when clad
11/25/2003US6652440 Electroactive polymers of high sulfur content for use in electrochemical cells
11/20/2003US20030216539 Weatherable block copolyestercarbonates, blends containing them, and method
11/20/2003US20030216506 Method of manufacture of polyester molding compositions and articles produced therefrom
11/20/2003US20030215734 Such as 2,2'-methylenebis(4-methyl-6-hydroxymethylphenol) for production of photosensitive polyimides
11/19/2003EP1362489A1 Wireless local loop antenna
11/18/2003US6649676 Mixture of poly(ether)sulfone, fluorinated polyolefin and anionic surfactants
11/13/2003WO2002059907A8 Electrically conducting plasticizer composition and process for the production thereof
11/13/2003US20030212187 Fine particle size of filler; smoothness surface; electronics
11/13/2003US20030211345 Electronics
11/12/2003EP1361208A1 Amino group containing phenol derivative
11/12/2003EP1360700A1 High conductivity polyaniline compositions and uses therefor
11/12/2003EP1360171A1 Novolak cyanate-based prepolymer compositions
11/11/2003US6646060 Resin composition containing crystalline polyimide
11/11/2003US6646040 Intermediate transfer member of image forming apparatus having polyimide resin film containing oxidized carbon black; uniform electrical resistance
11/11/2003US6646031 Polyetherimide resin/polyester resin blends having improved visual clarity
11/06/2003WO2003091310A1 Molded polyester for housing
11/06/2003WO2002046288A3 Flame retardant resin composition and molded products thereof
11/05/2003EP1358658A1 Aqueous conductive dispersions of polyaniline having enhanced viscosity
11/05/2003CN1453830A Plasma etching electrode with excellent heat resistance and dry etching apparatus using the same
11/04/2003US6642300 Weight stability under oxygen or carbon tetrafluoride plasma irradiation
11/04/2003US6642282 Porous para-oriented aromatic polyamide film, prepreg thereof, and base substrate for printed circuit board
10/2003
10/30/2003WO2003089518A1 Injection moldable polyamide resin compositions containing poly carbo-di-imides and articles made therefrom
10/29/2003EP1357576A2 Highly heat-resistant plasma etching electrode and dry etching device including the same
10/29/2003CN1451684A Stabilizator mixture
10/29/2003CN1125853C Aqueous dispension of polymer with high characteristic viscosity and preparation and use thereof
10/28/2003US6639069 Method of preparing and uses of cucurbituril devices
10/28/2003US6638631 Stress relieving films comprising crosslinked mixtures of polysiloxanes, polyimides, polyamideimides copolymers and/or polyamides used as interfaces for semiconductors or printed circuits
10/28/2003US6638352 For use in printed circuit boards; semiconductors
10/23/2003WO2003087226A1 Filler reinforced polyether imide resin composition and molded article thereof
10/23/2003WO2003031191B1 Aqueous coating composition for wide format ink jet recording material
10/23/2003US20030199638 Film adhesives containing maleimide compounds and methods for use thereof
10/23/2003US20030199629 Compositions for imparting desired properties to materials
10/23/2003US20030199618 Stabilizer mixtures
10/23/2003US20030196759 Highly heat-resistant plasma etching electrode and dry etching device including the same
10/22/2003EP0843703B1 An electrically conductive thermoplastic elastomeric composition and its use
10/22/2003CN1451033A High tracking index liquid crystalline polymers and related applications
10/21/2003US6635138 Method of immobilizing circuitry fingers
10/21/2003CA2202419C Highly branched polyamidoamines and their preparation
10/21/2003CA2018785C Polymer base blend compositions containing destructurized starch
10/16/2003WO2003085050A2 Compositions consisting of cationic polymers comprising amidinium groups and ionic liquids
10/16/2003WO2003085020A1 Cationically modified, anionic polyurethane dispersions
10/16/2003US20030194562 Curable end groups, such as allyl, (meth)acryloyloxy, glycidyloxy and cyanate groups; printed wiring board
10/16/2003CA2479941A1 Compositions of cationic polymers with amidinium groups and ionic liquids
10/15/2003CN1449424A Polyamide-imide resin solution and the use thereof for producing wire enamels
10/15/2003CN1124316C Aqueous compositions
10/14/2003US6632925 Soybean protein and polylactic acid; nontoxic
10/14/2003US6632847 Polymer composition, membrane containing said composition, method for the production and uses thereof
10/14/2003US6632523 Polyimidesiloxane made from a dianhydride, an aromatic diamine and a siloxanediamine, an epoxy resin, and a cyanate; tape
10/09/2003WO2003082940A1 Film adhesives containing maleimide and related compounds and methods for use thereof
10/09/2003WO2003082348A1 Nanogel networks including polyion polymer fragments and biological agent compositions thereof
10/09/2003US20030191239 Stabilizer mixtures
10/08/2003CN1447838A Polymeric compsns. for dewatering sewage sludges
10/08/2003CN1447749A Single coat non-stick coating system and articles coated with same
10/08/2003CN1447748A Single coat non-stick coating system and articles coated with same
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