Patents
Patents for C08L 79 - Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups (12,755)
12/2004
12/09/2004CA2527722A1 Biodegradable poly(beta-amino esters) and uses thereof
12/08/2004EP1484361A1 High temperature polymeric materials containing corona resistant composite filler, and methods relating thereto
12/08/2004EP1483320A2 Printing of organic conductive polymers containing additives
12/08/2004CN1178997C Wear resistant paint composition and method for producing paint
12/07/2004US6828390 First polyimide is the reaction product of an aromatic dianhydride and an aromatic diamine and a silylating end group, and second polyimide is polymerized in presence of first polyimide to form a single phase system
12/04/2004CA2469703A1 High temperature polymeric materials containing corona resistant composite filler, and methods relating thereto
12/02/2004WO2004104104A1 Flame resistant thermoplastic composition, articles thereof and method of making articles
12/02/2004WO2004103487A1 Articles prepared from compositions modified with organic fiber micropulp
12/02/2004CA2525508A1 Flame resistant thermoplastic composition, articles thereof and method of making articles
12/01/2004EP0720633B1 Fibre-containing plastics, process for producing the same, fibre-containing granulate, fibre-containing polymer compound
12/01/2004CN1551910A Adhesive for gas barrier laminates and laminated films
12/01/2004CN1550522A Resin composition and completed product
12/01/2004CN1177972C Creping method for cellulose paper width
11/2004
11/30/2004US6824884 Heat resistant resin composition, a heat resistant film or sheet thereof and a laminate comprising the film or the sheet as a susbstrate
11/25/2004WO2004102705A1 Polyimide matrix electrolyte
11/25/2004WO2004101693A1 Non-chromate conversion coating treatment for metals
11/25/2004US20040235586 Articles prepared from compositions modified with organic fiber micropulp
11/25/2004US20040232598 Flame resistant thermoplastic composition, articles thereof, and method of making articles
11/25/2004CA2525669A1 Polyimide matrix electrolyte
11/24/2004EP1478694A1 Polyetherimide composition, method, and article
11/24/2004EP1037112B1 Positive photosensitive resin precursor composition and process for producing the same
11/24/2004EP1023168B1 Fiber-reinforced phthalonitrile composite cured with low-reactivity aromatic amine curing agent
11/24/2004CN1548474A Prepn of polyimide film for copper to be clad on
11/24/2004CN1548473A Glue liquid no-halide fire-retardant copper-clad plate with the glue liquid and its making process
11/23/2004US6822032 Impact modified compositions of polyimide and polyamide resins
11/23/2004US6820738 Intermediate transfer member and image forming apparatus having the same
11/18/2004WO2004099331A2 Imide-linked maleimide and polymaleimide compounds
11/18/2004WO2004099314A1 Polyesters containing microfibers, and methods for making and using same
11/18/2004WO2004099289A1 Alignment agent for liquid crystal
11/18/2004US20040229166 Novel photosensitive resin compositions
11/18/2004US20040229127 dissolving a polyimide in at least one solvent, adding at least one lithium salt; is substantially optically clear which evidences the lack of phase separation of its respective components
11/17/2004EP1476406A1 Aqueous dispersions consisting of polycarbodiimides
11/17/2004EP0896014B1 Soluble polyimide resin, process for preparing the same, and polyimide resin solution composition
11/17/2004CN1176139C Macromolecule high-temperature unlubricated bearing material
11/17/2004CN1176076C Bis(dialkylmaleimide) derivatives and polyetherimide for optical communications
11/16/2004US6818734 Polybenzazole article superior in light resistance containing light-resisting agent selected from m-phenylenediamine, p-phenylenediamine, o-aminophenol, 2-amino-4-nitrophenol, 2-aminophenol-4-sulfonamide, and 1,8-diaminonaphthalene
11/16/2004US6818097 Highly heat-resistant plasma etching electrode and dry etching device including the same
11/11/2004US20040225026 Imide-linked maleimide and polymaleimide compounds
11/11/2004US20040222413 Water dispersible polyanilines made with polymeric acid colloids for electronics applications
11/11/2004DE10317699B3 New polymer-chromophore complexes, useful e.g. in optoelectronic devices, have polymeric ammonium cation and hydroxyphenyl- or hydroxybenzylidene-(het)aryl-pentadienone, -butenone or ketotetralinylethene chromophore anion
11/10/2004EP1475225A1 Etfe lining member
11/10/2004EP0916141B1 Composition for producing a conductive composite material containing a polyaniline, and resulting composite material
11/10/2004CN1175289C Polyvinyl alcohol type polarization film, polyvinyl alcohol type polarization plate and colored LCD projector with the polarization plate
11/10/2004CN1175060C Water-based primer composition for fluororesin coating
11/09/2004US6815476 Phosphate flame retardant polymers
11/09/2004US6815466 Comprises polyamine and/or polyepichlorohydrin formed by emulsion polymerization; colloidally and sedimentation stable; stain resistance
11/04/2004WO2004094545A1 Thermosetting liquid coating composition for aluminum wheel and method of coating aluminum wheel
11/04/2004WO2004094499A1 Thermosetting resin composition, multilayer body using same, and circuit board
11/04/2004US20040220335 Method of manufacture of polyester molding compositions and articles produced therefrom
11/04/2004US20040216840 Silane adduct, manufacturing thereof and method for coupling organic die attach adhesive and inorganic materials using the same
11/04/2004DE10297225T5 Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zur Herstellung von Halbleiterbauelementen und nach derartigen Verfahren hergestellte Halbleiterbauelemente Die attach adhesives for semiconductor applications, to processes for the production of semiconductor components and manufactured by such a method, semiconductor devices
11/04/2004DE10297224T5 Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zur Herstellung von Halbleiterbauelementen und nach derartigen Verfahren hergestellte Halbleiterbauelemente Die attach adhesives for semiconductor applications, to processes for the production of semiconductor components and manufactured by such a method, semiconductor devices
11/02/2004US6811601 Organic or inorganic pigment and ethoxylated, propoxylated and/or butoxylated polyethyleneimine
10/2004
10/27/2004EP1470187A1 Process for the preparation of a thermoplastic elastomer comprising a partially vulcanized rubber concentrate
10/27/2004EP1470175A1 Oligomeric chain extenders for processing, post-processing and recycling of condensation polymers, synthesis, compositions and applications
10/27/2004CN1539883A Conducting macromolecule polyaniline with silicon dioxide being adulterated, and preparing method, usage
10/27/2004CN1172991C Flame-retarding metal salt/polyimide composite material
10/26/2004US6808819 Polyimide resin, epoxy resin-curing catalyst, and an epoxy resin
10/26/2004US6808597 Methods of making and using creping adhesives comprised of polyamine-epihalohydrin resin/poly(vinyl alcohol) mixtures
10/26/2004US6807879 Cable assemblies and methods of producing same
10/21/2004WO2004028482A3 Packaged personal care compositions
10/21/2004US20040209010 Aqueous coating formulation suitable for use with high speed coaters such as rod and blade coaters, and ink jet recording materials prepared therefrom
10/20/2004EP1268644B1 Synergistic stabilizer compositions for thermoplastic polymers in prolonged contact with water
10/19/2004US6806353 Biodegradable plant protein composites and related methods
10/19/2004CA2229645C Multi-ply paper product
10/14/2004WO2004087792A2 Surface oxyfluorinated polymide, substrates coated therewith and composite material incorporating it
10/14/2004WO2004087226A1 An antimicrobial substrate, a method and a composition for producing it
10/13/2004EP1466934A1 Conductive polyaniline composition, film thereof, and processes for producing these
10/13/2004EP1465953A1 Novel uses of polymers
10/13/2004EP1465930A2 Supramolecular polymers
10/13/2004EP1109971B1 Process for obtaining stabilised creping compositions and process for production of creped paper
10/12/2004US6803446 Functionalized and processable conducting polymers
10/07/2004WO2004085538A1 Resin composition and transparent formed article
10/07/2004WO2004085535A1 Acetoacetylated polyvinyl polymers and curable coating compositions made therefrom
10/07/2004US20040198891 Polyamide-imide molding resins and methods for their preparation
10/07/2004US20040197699 polyimide from tetracarboxylic compound and a fluorine-containing diamine, especially hexafluoroisopropylidenedianiline, mixed with a polyamic acid and an acid-generating photoinitiator; passivation, buffer coating, and insulating films for semiconductors, multilayer printed circuits, organic EL devices
10/07/2004US20040197300 Mixture of polyaniline and calcium phosphate
10/07/2004US20040197064 Polyimide optical materials, polyimide precursor solutions and optical waveguide elements
10/07/2004US20040194665 Perylene derivatives and their application as dispersants
10/06/2004EP1464676A1 Crosslinkable elastomer composition and formed product comprising the same
10/06/2004CN1535299A 聚酰胺酸树脂组合物 Polyamic acid resin composition
10/05/2004CA2154469C Structured copolymers and their uses as absorbents, gels and carriers of metal ions
09/2004
09/30/2004US20040192880 Dielectric films and materials therefor
09/30/2004US20040191212 Phosphate-binding polymers for oral administration
09/29/2004EP1462471A1 Dielectric films and materials thereof
09/29/2004EP1462470A1 Dielectric films and materials therefor
09/29/2004EP1461436A1 Polycationic water soluble copolymer and method for transferring polyanionic macromolecules across biological barriers
09/29/2004EP1461387A1 Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s)
09/29/2004EP0998537B1 Adhesive composition for hot bonding and bonding method using same
09/29/2004CN1168781C Self-lubricating nano composite material and its preparation method
09/28/2004US6797392 Electronics
09/28/2004US6797367 Multilayer wiring board, semiconductor device mounting board using same, and method of manufacturing multilayer wiring board
09/23/2004WO2004081664A2 Novel photosensitive resin compositions
09/23/2004WO2004081103A2 Method for lowering the melt viscosity of an aromatic sulfone polymer composition, and method for manufacturing an aircraft component
09/23/2004US20040186217 Acetoacetylated polyvinyl polymers and curable coating compositions made therefrom
09/23/2004US20040182602 High frequency electronic circuit component
09/22/2004CN1167748C Preparation method of polyimide molybdenum disulfide intercalation composite material
09/22/2004CN1167745C 聚酯酰亚胺改性环氧树脂 Polyester-imide-modified epoxy resin
09/21/2004US6794327 Supramolecular structures and process for making the same
09/16/2004WO2004072205A3 Carbazole compounds and use of such compounds in organic electroluminescent devices
1 ... 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 ... 128