Patents for B24B 37 - Lapping machines or devices; Accessories (20,836)
03/2013
03/06/2013CN102950538A Polishing device for plate-shaped body and polishing system
03/06/2013CN102950537A Method for chemical mechanical polishing copper
03/06/2013CN102950536A Chemical-mechanical grinding device and method
03/06/2013CN101722475B CMP pad dressers with hybridized abrasive surface and related methods
03/05/2013US8389409 Method for producing a semiconductor wafer
03/05/2013US8388799 Composition for forming polishing layer of chemical mechanical polishing pad, chemical mechanical polishing pad and chemical mechanical polishing method
03/05/2013US8388411 Method for polishing the edge of a semiconductor wafer
03/05/2013US8387902 Recycling method and recycling apparatus of slurry for use in wafer polishing
02/2013
02/28/2013US20130052917 Polishing apparatus, polishing pad, and polishing information management system
02/28/2013DE112011100688T5 Verfahren zum Herstellen eines Halbleiterwafers A method of manufacturing a semiconductor wafer
02/28/2013DE102007031299B4 Doppelseitenbearbeitungsmaschine zum Bearbeiten eines Werkstücks Double sided machining for machining a workpiece
02/27/2013CN202752992U Rotating shaft center-hole grinding and positioning device
02/27/2013CN202752991U Optical fiber connector grinding disc
02/27/2013CN102947919A Composition for polishing silicon carbide substrate and method for polishing silicon carbide substrate
02/27/2013CN102941530A Polishing apparatus and substrate
02/27/2013CN102941529A Planetary motion grinding device
02/27/2013CN102941528A Aluminum alloy material with high-precision super-smooth surface, polishing disk, polishing agent and polishing method
02/27/2013CN102941527A 研磨抛光装置 Polishing apparatus
02/27/2013CN102941522A Polishing apparatus
02/27/2013CN102161178B Workpiece dismantling and mounting structure of grinding machine
02/27/2013CN101678529B Methods and apparatus for polishing a semiconductor wafer
02/26/2013US8382555 Substrate supporting unit, and apparatus and method for polishing substrate using the same
02/26/2013US8382554 Substrate polishing apparatus and method of polishing substrate using the same
02/21/2013WO2013024565A1 Stock removal evaluation method and wafer production method
02/21/2013US20130045663 Method and apparatus for optically measuring by interferometry the thickness of an object
02/20/2013EP2559060A2 Composition and method for polishing bulk silicon
02/20/2013CN202742198U Sliding structure of tool grinding machine
02/20/2013CN202742197U Supporting device for tool grinding machines
02/20/2013CN202742196U Clamp for precise grinding of inner hole of annular part
02/20/2013CN202742195U Special jig fixture for grinding non-standard optic-fiber connector
02/20/2013CN202742194U Novel diamond grinding sheet
02/20/2013CN202742193U Self-aligning device of steel ball lapping machine
02/20/2013CN202742192U Horizontal grinding machine imitating handwork
02/20/2013CN202742191U Piercing mill equipment for processing optical fiber ferrule
02/20/2013CN202742190U Grinding device for prefill valve
02/20/2013CN202742189U Gasoline grinding machine
02/20/2013CN202742188U Grinding miller
02/20/2013CN102939643A Composition and method for polishing bulk silicon
02/20/2013CN102935618A Grinding fluid, over-polishing and end point detection method and device and polishing device
02/20/2013CN102935615A Centering device for numerically controlled polycrystalline double-end-face grinding machines
02/20/2013CN102092001B Grinding device for ceramic bushing
02/20/2013CN102079067B Dual-station cross transposition full-automatic grinder
02/20/2013CN101823234B Polishing slurry feed system and polishing slurry mixture feed method of chemical mechanical polishing station
02/20/2013CN101249623B Grinding method and grinding device of circular disk shape substrate
02/19/2013US8380339 Customized polish pads for chemical mechanical planarization
02/19/2013US8376813 Retaining ring and articles for carrier head
02/19/2013US8376811 Method for the double sided polishing of a semiconductor wafer
02/19/2013US8376810 Method for chemically grinding a semiconductor wafer on both sides
02/14/2013WO2013021946A1 Composition for polishing compound semiconductor
02/14/2013US20130040461 Polishing composition and polishing method
02/14/2013DE10149712B4 Schleifscheibe Grinding wheel
02/13/2013CN202726721U 研磨辅助设备 Grinding aids
02/13/2013CN202726720U Abrasive cloth clamp
02/13/2013CN202726719U Sapphire ingot positioning surface orientating and machining clamp
02/13/2013CN202726718U Jig for length machining of round rods
02/13/2013CN202726717U Floating type hole grinding clamp
02/13/2013CN202726716U Rapid-installation floating type hole grinding clamp
02/13/2013CN202726715U Chuck for grinding and polishing square block crystal
02/13/2013CN202726714U Grinding polishing disk with circulation water cooling device
02/13/2013CN202726713U Grinding device
02/13/2013CN202726712U Grinding equipment for artificial joint ball head
02/13/2013CN202726711U 半自动研磨装置 Semi-automatic grinding device
02/13/2013CN202726710U Sizing block grinder
02/13/2013CN202726709U Grinding machine
02/13/2013CN202726682U Cut-in milling/ grinding /polishing processing internal/external curved surface system
02/13/2013CN102928893A Manufacturing method for optical planar substrate
02/13/2013CN102922419A Special clamp for grinding inclined planes of platy tool grains
02/13/2013CN102922418A Grinding fixture
02/13/2013CN102922417A Manufacturing technology for composite board
02/13/2013CN102922416A Cutter granule grinding clamp
02/13/2013CN102922415A Chemical mechanical polishing method capable of prolonging service life of polishing pad
02/13/2013CN102922414A 化学机械抛光装置 The chemical mechanical polishing apparatus
02/13/2013CN102922413A Chemical mechanical polishing method
02/13/2013CN102922412A Grinding device and grinding method
02/13/2013CN102922411A Chemical mechanical polishing method for preventing wafer from sliding
02/13/2013CN102922410A Method for treating surface of glass substrate
02/13/2013CN102922409A Method for grinding surface of glass substrate
02/13/2013CN102922408A Lathe tailstock hole grinding fixture
02/13/2013CN102922407A Grinding component for steam trap in nuclear power plant
02/13/2013CN102233544B Chemical mechanical polishing method
02/12/2013US8372304 Polishing slurry
02/12/2013US8371564 Suction apparatus, polishing apparatus, semiconductor device, and method of manufacturing a semiconductor device
02/07/2013US20130035022 Two-Part Plastic Retaining Ring
02/07/2013US20130035021 Polishing pad, manufacturing method therefor, and method for manufacturing a semiconductor device
02/07/2013US20130035020 Versatile workpiece refining
02/07/2013US20130032573 Method for polishing silicon wafer and polishing liquid therefor
02/07/2013US20130032571 Method for manufacturing an aluminosilicate glass substrate for hard disks
02/07/2013DE102011003006B4 Verfahren zur Bereitstellung jeweils einer ebenen Arbeitsschicht auf jeder der zwei Arbeitsscheiben einer Doppelseiten-Bearbeitungsvorrichtung A method for providing a level each work shift on each of the two work pane of a double sided machining device
02/06/2013EP2555229A1 Polishing agent, polishing method and method for manufacturing semiconductor integrated circuit device
02/06/2013EP2552644A1 Hydrostatic pad pressure modulation in a simultaneous double side wafer grinder
02/06/2013CN202716155U Loading angle adjustment automation device of optical fiber capillary glass tube
02/06/2013CN202716154U Grinding device of ball valve spool
02/06/2013CN102909653A Eight-head gearbox for floor grinding machine
02/06/2013CN102909652A Floating type hole lapping fixture
02/06/2013CN102909651A Polishing head for chemical polishing device and chemical polishing device with polishing head
02/06/2013CN102909650A Surface processing method of strip laser medium
02/06/2013CN102909649A Chemical and mechanical polishing equipment, chemical and mechanical polishing finishing point detection device and chemical and mechanical polishing finishing point detection method
02/06/2013CN102909648A 自动研磨装置 Automatic grinding device
02/06/2013CN102909647A On-line direct-current motor grinder
02/06/2013CN102909646A Chemical mechanical grinding method
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