Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
10/1985
10/23/1985EP0158915A2 Epoxy composition and application thereof
10/23/1985EP0158876A2 Multilayer printed circuit board produced in multilayer- or piling technique
10/22/1985US4549246 Air dielectric variable capacitor utilizing a stator formed as part of the circuit layout on the substrate
10/22/1985US4548879 Solderable polymer thick films
10/22/1985US4548742 Pyrochlore, binder, metal chromates and organic medium
10/22/1985US4548456 Printed circuit board edge connectors
10/22/1985US4548452 High-density electrical contact pad pattern
10/22/1985US4548451 Pinless connector interposer and method for making the same
10/22/1985US4547961 Method of manufacture of miniaturized transformer
10/16/1985EP0158343A2 Process for preparing pressed multilayer composites, and product so obtained
10/16/1985EP0158027A2 Method for making copper-clad base material for conductive plates
10/15/1985US4547834 Structure for assembling complex electronic circuits
10/15/1985US4547795 Leadless chip carrier with frangible shorting bars
10/15/1985US4547767 Printed circuit board for activating and deactivating alarm systems
10/15/1985US4547625 Forming silica and borosilicate glass into mixture and sintering
10/15/1985US4547424 Bonded to substrate layer to prevent shrinkage
10/15/1985US4547421 Highly dispersed continuous glass fiber mats
10/15/1985US4547408 Stacking and compressing electroconductive metal foil, skin laminae, core, and second laminae
10/15/1985CA1195440A1 Housing for an ionization detector array in a tomographic scanner
10/15/1985CA1195431A2 Electronic package and accessory component assembly
10/15/1985CA1195393A1 Aperture-coupled microwave apparatus
10/09/1985EP0157590A2 Packaged electronic device
10/09/1985EP0157374A2 Radiation-polymerisable composition and process for applying markings to a solder resist layer
10/08/1985US4546413 Engineering change facility on both major surfaces of chip module
10/08/1985US4546412 Electronic device for automobile
10/08/1985US4546406 Inorganic semiconductor having selected thermal expansion properties; metal laminate substrates
10/08/1985US4546065 Embossing, sintering, deposition of conductive material
10/08/1985US4545928 Paste for forming a transparent, electrically conductive film
10/08/1985US4545119 Inserting conductive material into through-holes; ultrasonic weldi
10/08/1985CA1194973A1 Environmentally protected electronic control for a glassware forming machine
10/01/1985US4544989 Thin assembly for wiring substrate
10/01/1985US4544881 Device for testing the insulation of printed circuits
10/01/1985US4544642 High density, thermoconductivity, group 5 element
10/01/1985US4544577 Process for metallization of dielectric substrate through holes
10/01/1985US4544442 Forming patterns by the radiation vaporization of the cured coating on substrate bonded filaments
10/01/1985US4544238 Substrate having dummy conductors to prevent solder build-up
10/01/1985CA1194314A1 Method for producing multilayered glass-ceramic structure with copper-based conductors therein
09/1985
09/25/1985EP0155677A2 Paper-like product, method and apparatus for production thereof and prepreg formed of said paper-like product
09/25/1985EP0155473A1 Power semiconductor module and method of manufacture
09/25/1985EP0155469A1 Epoxy resin composition and a process for preparing laminates therefrom
09/25/1985EP0155386A1 Method of making connectors with a plurality of terminals
09/24/1985US4543553 Chip-type inductor
09/24/1985US4543544 LCC co-planar lead frame semiconductor IC package
09/24/1985US4543295 High temperature polyimide film laminates and process for preparation thereof
09/24/1985CA1194241A1 Printed wiring card stiffener bracket
09/24/1985CA1194240A1 Printed wiring card stiffener bracket
09/24/1985CA1194239A1 Device for controlling the insulation of printed circuits
09/24/1985CA1194087A1 Wedge base lamp socket
09/18/1985EP0154909A2 Process and sheet material for the manufacture of printed circuits with through-connections
09/18/1985EP0154765A2 Apparatus for directly powering a multi-chip module from a power distribution bus
09/17/1985US4542441 Card guide
09/17/1985US4542438 Hybrid integrated circuit device
09/17/1985US4542106 Fiber glass composition
09/17/1985US4541894 Metallizable, essentially isotropic polymeric substrates well adopted for printed circuits
09/17/1985US4541882 Applying filaments according to pattern, coating to position
09/17/1985US4541677 Continuous strip of jumper cable assemblies
09/17/1985CA1193752A1 Electrical circuits
09/17/1985CA1193685A1 Mask for protecting tab contacts of circuit boards
09/17/1985CA1193618A1 Highly heat-conductive ceramic material
09/17/1985CA1193494A1 Method of and apparatus for the vapor deposition of material upon a substrate
09/10/1985US4540631 Treatment of polymer using silver
09/10/1985US4540621 Mixing with binder; casting into sheet, drying and sintering
09/10/1985US4540604 Thick film conductor compositions
09/10/1985US4540462 Substrate for semiconductor modules and method of manufacture
09/10/1985US4540449 Aluminum substrate for magnetic recording media
09/10/1985US4539747 Process for making electrical connections between two surfaces of a printed circuit board
09/10/1985CA1193350A1 Circuit structure
09/09/1985EP0135534A4 Thick film resistor circuits.
09/04/1985EP0153737A2 Circuit substrate having high thermal conductivity
09/04/1985EP0153650A2 Thin film hybrid circuit
09/03/1985US4539622 Hybrid integrated circuit device
09/03/1985US4539298 Highly heat-conductive ceramic material
09/03/1985US4539058 Forming multilayer ceramic substrates from large area green sheets
09/03/1985US4538865 Device for connecting printed wiring boards or sheets
09/03/1985US4538346 Method for manufacture of selectively coated carrier plate
09/03/1985CA1192735A1 Silver containing conductive coatings
08/1985
08/28/1985EP0153098A2 Copper foil laminate for use as a base plate or substrate for electronic devices
08/28/1985EP0152794A2 Multi-layered electrical interconnection structure
08/28/1985EP0152634A2 Method for manufacture of printed wiring board
08/27/1985US4538210 Mounting and contacting assembly for plate-shaped electrical device
08/27/1985US4538143 Light-emitting diode displayer
08/27/1985US4537794 Method of coating ceramics
08/27/1985US4536955 Devices for and methods of mounting integrated circuit packages on a printed circuit board
08/27/1985CA1192449A1 Metal ceramics composites and a method for producing said composites
08/20/1985US4536826 Snap-in bus bar
08/20/1985US4536824 Indirect cooling of electronic circuits
08/20/1985US4536733 High frequency inverter transformer for power supplies
08/20/1985US4536724 Voltage-controlled oscillator having three or more varactor diodes
08/20/1985US4536452 Free of mica phase
08/20/1985US4536435 Multilayer substrate including layers of an alumina and borosilicate-lead-glass ceramic material
08/20/1985US4536239 Multi-layer circuit board inspection system
08/20/1985CA1192062A1 Conductor compositions
08/20/1985CA1192040A1 Silk screen printing paste with lead glass which is to be fired in a non-oxidising atmosphere
08/15/1985WO1985003515A1 Epoxy resin composition and process for preparing laminates therefrom
08/14/1985EP0151236A1 Apparatus for and method of monitoring the operations of a plating process
08/14/1985EP0027825B1 Ceramic base
08/13/1985USRE31967 Gang bonding interconnect tape for semiconductive devices and method of making same
08/13/1985US4535388 High density wired module
08/13/1985US4535385 Circuit module with enhanced heat transfer and distribution
08/13/1985US4535376 Magnetic head incorporating an amorphous magnetic metallic film having a thickness equal to a track width
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