Patents for H05K 1 - Printed circuits (98,583) |
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02/13/1985 | EP0133010A2 Multilayered ceramic circuit board |
02/13/1985 | EP0132740A2 Method of forming a dielectric substrate |
02/13/1985 | EP0132664A2 Compliant pin for solderless termination to a printed wiring board |
02/13/1985 | EP0132583A2 Coextrusion of thermoplastic fluoropolymers with thermoplastic polymers |
02/12/1985 | US4499607 Geometrically-integrated architecture of microcircuits for high-speed computers |
02/12/1985 | US4499524 High value surface mounted capacitor |
02/12/1985 | US4499523 Electronic component assembly with a printed circuit board unit and cover |
02/12/1985 | US4499519 Decoupling capacitor and method of manufacture thereof |
02/12/1985 | US4499157 Surface pretreatment, electroless, then electrolytic deposition ofmetal |
02/12/1985 | US4499152 Metal oxide layer between coupler coated on substrate and thin metal film; antipeeling agents; printed circuits |
02/12/1985 | US4499145 Metal foil, silane-modified polyethylene, paper or glass containinng epoxy and dielectric; moisture and heat resistance |
02/12/1985 | US4499042 Production of heat-shrinkable polyimide films |
02/12/1985 | US4499010 Thermosetting resin, hydroquinone derivative copper powder, fatty mixture |
02/12/1985 | US4498947 Electrically selectable printing elements |
02/12/1985 | US4498727 Phospor-bronze base, gold binder layers |
02/12/1985 | US4498717 Printed wiring board interconnect arrangement |
02/12/1985 | CA1182591A1 Fabrication of semiconductor modules with ceramic substrates and detection of residual glass |
02/12/1985 | CA1182540A1 Header for imposing frictional force on terminal posts |
02/12/1985 | CA1182539A1 Dual-in-line package assembly |
02/12/1985 | CA1182480A1 Glass-ceramic coatings for use on metal substrates |
02/05/1985 | US4498064 Pushbutton tuner with staggered tuning coils |
02/05/1985 | US4497677 Method for manufacturing ceramic substrate |
02/05/1985 | CA1182035A1 Continuous production of electrical laminates |
01/31/1985 | WO1985000467A1 Electronic circuit chip connection assembly and method |
01/29/1985 | US4497012 Decoupling capacitor and method of manufacture thereof |
01/29/1985 | US4496875 Conductor composition and devices using it |
01/29/1985 | US4496812 Membrane panel |
01/29/1985 | US4496794 Coating metal foil with polyamide, polyimide, heating exposure anddevelopment |
01/29/1985 | US4496793 Multi-layer metal core circuit board laminate with a controlled thermal coefficient of expansion |
01/29/1985 | US4496695 Polyphenylene ether resin an epoxy compound, plus a maleimide and or cyanate ester component |
01/29/1985 | US4496607 Laser process for producing electrically conductive surfaces on insulators |
01/29/1985 | US4496415 Method for impregnating resin powder directly into a laminate lay up |
01/29/1985 | US4496311 Multilamp photoflash array fabrication |
01/29/1985 | CA1181827A1 Connector for printed-circuit boards |
01/29/1985 | CA1181824A1 Stripline cable with reduced crosstalk |
01/29/1985 | CA1181580A1 Curable ink or paint containing electrically conductive metal particles |
01/23/1985 | EP0132006A2 Decoupling capacitor integrated between an H.F. output line and an H.F. cavity |
01/23/1985 | EP0131778A1 Copper-containing thick-film conductor compositions |
01/23/1985 | EP0131737A1 Method of connecting two conductors |
01/22/1985 | US4495547 Bushing for use between a control knob and a housing |
01/22/1985 | US4495546 Hybrid integrated circuit component and printed circuit board mounting said component |
01/22/1985 | US4495479 Selective wiring for multilayer printed circuit board |
01/22/1985 | US4495399 Micro-arc milling of metallic and non-metallic substrates |
01/22/1985 | US4495378 Heat-removing circuit boards |
01/22/1985 | US4495253 Solderable plated plastic components and process for plating _ |
01/22/1985 | CA1181530A1 Circuit assembly and method of making same |
01/22/1985 | CA1181500A1 Multilayer bus bars and assembly techniques |
01/22/1985 | CA1181498A1 Miniaturized bus bar and assembly technique |
01/17/1985 | WO1985000247A1 Conductor composition and devices using it |
01/16/1985 | EP0131492A1 Components board comprising connection points, and process for marking these points |
01/16/1985 | EP0131265A2 High capacitive multilayer conductive bars |
01/16/1985 | EP0131242A2 Multi-layer ceramic substrate and method for the production thereof |
01/15/1985 | US4494172 High-speed wire wrap board |
01/15/1985 | US4494170 Decoupling capacitor and method of manufacture thereof |
01/15/1985 | US4494169 Decoupling capacitor and method of manufacture thereof |
01/15/1985 | US4494100 Planar inductors |
01/15/1985 | US4494083 Impedance matching stripline transition for microwave signals |
01/15/1985 | US4493952 Membrane switch having integral switch tail insulator |
01/15/1985 | US4493856 Selective coating of metallurgical features of a dielectric substrate with diverse metals |
01/15/1985 | US4493789 Electroconductive paste and process for producing electroconductive metallized ceramics using the same |
01/15/1985 | US4493667 Multilamp photoflash array fabrication |
01/15/1985 | US4493639 Conductive ink for flashlamp array circuit |
01/15/1985 | US4493145 Integrated circuit device having easily cleaned region between mother board and chip carriers mounted thereon |
01/15/1985 | US4493137 Method of making a drive element assembly for ink jet printing |
01/15/1985 | CA1181142A1 Printed circuit board connector for use in computer systems |
01/15/1985 | CA1181124A1 Miniature photoflash unit with encapsulated flash lamps |
01/09/1985 | EP0130845A2 Interconnection apparatus for wiring harnesses |
01/09/1985 | EP0130844A2 Interconnection apparatus for wiring harnesses |
01/09/1985 | EP0130615A2 Process for making printed-circuit boards, and photolacquer for carrying out this process |
01/09/1985 | EP0130468A2 Protective coatings for conductors to prevent mechanical and electronic failures particularly during heat-treatment of their supporting structures |
01/09/1985 | EP0130462A2 Printed circuits |
01/09/1985 | EP0130430A2 Method of generating circuit boards using electroeroded sheet layers and circuit boards so produced |
01/09/1985 | EP0130410A2 Printed circuit board structure for metal package containing high-frequency component |
01/09/1985 | EP0130312A2 Continuous method of making layered products with metal layers |
01/08/1985 | US4492730 Metal plate, synethic resin and filler |
01/08/1985 | US4492460 Method of making representations of, and method of and means for making, printed circuit boards |
01/03/1985 | WO1985000085A1 Printed board for the surface soldering of integrated miniature circuits and manufacturing method of such printed boards |
01/03/1985 | WO1985000072A1 Inductive element, particularly repeater |
01/02/1985 | EP0130010A1 Conductor composition and devices using it |
01/02/1985 | EP0129982A2 Backpanel assemblies |
01/02/1985 | EP0129966A1 High cooling efficiency circuit module |
01/02/1985 | EP0129697A2 Method of making printed circuit boards |
01/02/1985 | CA1180403A Non-shorting pin system |
01/01/1985 | US4491895 Decoupling capacitor and method of manufacture thereof |
01/01/1985 | US4491622 Composites of glass-ceramic to metal seals and method of making the same |
12/27/1984 | EP0129294A1 PC board-transparent quiet connector for integrated circuits |
12/27/1984 | EP0129137A2 Method of forming an aperture in a dielectric substance and securing a conductive pin in said aperture |
12/25/1984 | US4490775 Universal programmable interface |
12/25/1984 | US4490737 Smooth glass insulating film over interconnects on an integrated circuit |
12/25/1984 | US4490690 Strip line cable |
12/25/1984 | US4490614 Housing for an ionization detector array in a tomographic scanner |
12/25/1984 | US4490457 Cold/dry substrate treatment technique which improves photolithographic limits of resolution and exposure tolerance |
12/25/1984 | US4490429 Process for manufacturing a multilayer circuit board |
12/25/1984 | US4489999 Socket and flexible PC board assembly and method for making |
12/19/1984 | EP0128843A1 Metallizable substrates for printed circuits, and process for their production |
12/19/1984 | EP0128799A1 Method of producing a hybrid circuit, and hybrid circuit obtained by this method |
12/19/1984 | EP0128476A2 Metallization of ceramics |
12/18/1984 | US4489365 Universal leadless chip carrier mounting pad |
12/18/1984 | US4489364 Chip carrier with embedded engineering change lines with severable periodically spaced bridging connectors on the chip supporting surface |
12/18/1984 | US4489181 Thermoplastic polycarbonate-polysulfone carbonate molding compositions |