Patents for H05K 1 - Printed circuits (98,583)
11/1983
11/22/1983US4417297 Printed circuit board
11/22/1983US4417296 Method of connecting surface mounted packages to a circuit board and the resulting connector
11/22/1983US4417170 Flexible circuit interconnect for piezoelectric element
11/22/1983US4417114 Connector for attaching an electrical component to a flat sheet
11/22/1983US4416932 Ceramic substrate with metal particle dispersion, inorganic metal oxide binder, and organo-titanate
11/22/1983US4416914 Ink of metal powder and polymer
11/22/1983CA1157600A1 Epoxide-containing compositions and their polymerisation
11/22/1983CA1157572A1 Photoflash device having die-stamped circuit board assembly with flexure means to prevent switch cutting
11/22/1983CA1157364A1 Continuous process for producing a metal clad laminate
11/15/1983US4415624 Resistor contains ruthenium oxide or conductor contains precious metal and bismuth oxide in glass frit
11/15/1983US4415607 Method of manufacturing printed circuit network devices
11/15/1983US4415403 Method of fabricating an electrostatic print head
11/15/1983US4415212 Connector receptacle for printed circuit boards
11/15/1983US4414741 Process for interconnecting components on a PCB
11/10/1983WO1983003943A1 Improved bonding means and methods for polymer coated devices
11/09/1983EP0093633A1 Substrate for an electric circuit, and method for its production
11/08/1983US4414281 Glass-ceramic articles having metallic surfaces
11/08/1983US4414264 Chip carrier substrates of hybrid woven glass cloths
11/08/1983US4414143 Conductor compositions
11/08/1983US4413766 Method of forming a conductor pattern including fine conductor runs on a ceramic substrate
11/08/1983US4413510 Coating adhesion testing
11/08/1983CA1156768A1 Printed wiring board substrates for ceramic chip carriers
11/02/1983EP0092731A1 A pocket electronic calculator
11/02/1983EP0092555A1 Tag-shaped identification device attachable to an object.
11/01/1983US4413309 Printed circuit board
11/01/1983US4413308 Printed wiring board construction
11/01/1983US4413061 Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
11/01/1983US4412712 Circuit board positioning arrangement
11/01/1983US4412377 Method for manufacturing a hybrid integrated circuit device
10/1983
10/26/1983EP0092489A2 Indicator lamp for printed circuits
10/26/1983EP0092155A2 Conductor compositions
10/26/1983EP0092086A1 Connection assembly for a plate-like electrical device
10/26/1983EP0092020A2 Composite structure, particularly for use as a printed-circuit board
10/26/1983EP0092019A2 Improved semiconductor package
10/25/1983US4412272 Flexible printed circuit card assembly
10/25/1983US4411982 Method of making flexible printed circuits
10/25/1983US4411980 Expose to images, applying conductive metal, heating, then electroless plating or soldering metal areas
10/25/1983US4411952 Direct bonding to metallic foils
10/25/1983CA1155967A1 Medium film deposition of electric circuits
10/25/1983CA1155943A1 Carrier socket for leadless integrated circuit devices
10/25/1983CA1155816A1 Improved connect switch for photoflash unit
10/25/1983CA1155736A1 Method of etching polyimide
10/18/1983US4410927 Casing for an electrical component having improved strength and heat transfer characteristics
10/18/1983US4410874 Large area hybrid microcircuit assembly
10/18/1983US4410686 Norbornyl modified polyesteramides and process for preparing same
10/18/1983US4410598 Process for preparation of insulating coatings upon steel
10/18/1983US4410574 Printed circuit boards and methods for making same
10/18/1983US4410457 Conductive paste
10/18/1983US4410388 Production of metal clad laminates
10/18/1983US4410307 Conductive ink for flash lamp array circuit
10/18/1983US4410223 Module mounting assembly
10/18/1983CA1155480A1 Photoflash unit having reflector with openings surrounded by transparent regions
10/12/1983EP0091376A1 Lead format for tape automated bonding
10/12/1983EP0091375A2 Programmable deskewing of automatic test equipment
10/12/1983EP0091080A2 Strain relief device
10/12/1983EP0090820A1 Thin layered electronic circuit and manufacturing method thereof.
10/11/1983USRE31411 Radiation curable inks
10/11/1983US4409333 Method for the evaluation of solderability
10/11/1983US4409278 Heating materials, etched at interfaces, with bonding agent to provode eutecjtic composition
10/11/1983US4409261 Process for air firing oxidizable conductors
10/11/1983US4409135 Paste containing electrically conducting powder to form conducting solid filler in cavity in ceramic substrate
10/11/1983US4408875 Method of projecting circuit patterns
10/11/1983US4408817 P. C. Board bobbin construction
10/11/1983CA1154993A1 Prolonged tack toners including an organic polymer, solid plasticizer, conductive metal particles and glass frit
10/05/1983EP0090727A1 Electrically and thermally printed circuit board, process for making such a board and interconnection system utilizing such a board
10/05/1983EP0090714A1 System for electrical connection and heat evacuation by conduction for electronic components
10/05/1983EP0090696A1 Process for making printed circuit boards with a conductive rigid individual metallic support
10/05/1983EP0090693A1 Device for marking the position of printed circuit boards with respect to their connectors
10/05/1983EP0090215A2 Transparent conductive layer
10/05/1983EP0090151A1 Compositions convertible to reinforced conductive components and articles incorporating same
10/05/1983EP0090079A2 Substrate
10/04/1983US4408256 Microbox for electronic circuit and hybrid circuit having such a microbox
10/04/1983US4408003 Printed circuits
10/04/1983US4407883 Laminates for printed circuit boards
10/04/1983US4407685 Metallized film transfer process
10/04/1983US4407674 Thin silver nonplanar flakes
09/1983
09/29/1983WO1983003210A1 Liquids with reduced spreading tendency
09/28/1983EP0089559A2 Method for forming metal coatings for metallurgy patterns on dielectric substrates
09/28/1983EP0089452A1 Hearing aid with amplifier circuit
09/28/1983EP0089387A1 Preparation of copper-clad laminates
09/27/1983US4407007 Process and structure for minimizing delamination in the fabrication of multi-layer ceramic substrate
09/27/1983US4406844 Fabrication of semiconductor modules with ceramic substrates and detection of residual glass
09/27/1983US4406826 Heat curable conductive ink
09/27/1983US4406508 Dual-in-line package assembly
09/27/1983US4406062 Method of forming a multichannel connector
09/21/1983EP0089248A2 Dense mounting of semiconductor chip packages
09/20/1983US4405971 Electrical circuit apparatus
09/15/1983WO1983003182A1 Method for making electrical connections between the two faces of a printed circuit board
09/14/1983EP0088676A1 Electric terminal post for printed circuits and device making use of said terminal posts
09/14/1983EP0088591A2 On board memory for multi component manufacturing products
09/14/1983EP0088142A1 Electrical connector
09/13/1983US4404453 Laser bonding of microelectronic circuits
09/13/1983US4404237 Fabrication of electrical conductor by replacement of metallic powder in polymer with more noble metal
09/13/1983US4403818 Instrument panel for vehicles
09/07/1983EP0087881A1 Process for bonding, copper or copper-chromium alloy to ceramics, and bonded articles of ceramics and copper or copper-chromium alloy
09/07/1983EP0087796A2 Film carrier for an electrical conductor pattern
09/07/1983EP0087590A2 Electrochemical cell having solid electrodes and an intermediate ion-conductive ceramic solid electrolyte
09/06/1983US4403108 Miniaturized bus bar with capacitors and assembly technique
09/06/1983US4403107 Stamped circuit board
09/06/1983US4403102 Heat sink mounting