| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 02/12/1986 | EP0170767A2 Substrate for printed circuits |
| 02/11/1986 | US4570039 Keyswitch structure |
| 02/11/1986 | US4570031 High capacitance laminated buss and method of manufacture |
| 02/11/1986 | US4569885 Heat treatment to obtain dimensional stability |
| 02/11/1986 | US4569876 Providing good electrical connection by embedding conductive material in holes in the insulator |
| 02/11/1986 | US4569692 Low thermal expansivity and high thermal conductivity substrate |
| 02/11/1986 | CA1200640A1 Bismaleimide triazine polymer compositions for making circuit boards |
| 02/11/1986 | CA1200588A1 Device for indicating the positions of printed circuit cards relative to their connectors |
| 02/11/1986 | CA1200585A1 High capacitance laminated bus |
| 02/05/1986 | EP0170480A2 Flexible electrical connectors |
| 02/05/1986 | EP0170477A2 Multilayer systems and their method of production |
| 02/05/1986 | EP0170065A1 Molded electrical device, molded circuit board substrate and molded chip carrier |
| 02/05/1986 | EP0170063A2 Copper-type conductive coating composition |
| 02/05/1986 | EP0170012A2 Metal-ceramic composite element and process for its production |
| 02/05/1986 | EP0169865A1 Epoxy resin composition and process for preparing laminates therefrom |
| 02/04/1986 | US4569077 Transducer mounting assembly |
| 02/04/1986 | US4568999 Multilayer ceramic capacitor on printed circuit |
| 02/04/1986 | US4568987 Amplifier input circuit having a figure eight conductive pattern |
| 02/04/1986 | US4568971 Method and apparatus for successively positioning sheets of material with precision for punching aligning holes in the sheets enabling the sheets to be used in the manufacture of composite circuit boards |
| 02/04/1986 | US4568896 High frequency circuit device |
| 02/04/1986 | US4568603 Fiber-reinforced syntactic foam composites prepared from polyglycidyl aromatic amine and polycarboxylic acid anhydride |
| 02/04/1986 | US4568586 Metal layer is firmly bonded to deramic substrate after cooling and solidification of eutectic interlayer |
| 02/04/1986 | US4568571 Treating with metal chloride solution and with noble metal-containing activator solution |
| 02/04/1986 | US4568134 Printed circuit board keying system |
| 02/04/1986 | CA1200321A1 Modular semiconductor device |
| 02/04/1986 | CA1200320A1 Planar contact array switch having improved ground path for dissipating electrostatic discharges |
| 02/04/1986 | CA1200296A1 Thick film resistor circuits |
| 01/30/1986 | WO1986000749A1 High frequency transformer |
| 01/29/1986 | EP0169788A2 Mounting structure of flat-lead package-type electronic component |
| 01/29/1986 | EP0169694A2 Component providing high frequency signal suppression |
| 01/29/1986 | EP0169530A2 Multilayer printed circuit board |
| 01/29/1986 | EP0169226A1 Improvements in electrical capacitors. |
| 01/28/1986 | US4567543 Double-sided flexible electronic circuit module |
| 01/28/1986 | US4567542 Alumina ceramic containing borosilicate-lead-glass and one high dielectric ceramic layer |
| 01/28/1986 | US4567428 Detection of catastrophic failure of dielectric, improper connection, and temperature of a printed circuit assembly via one wire |
| 01/28/1986 | US4567151 Binder glass of Bi2 O3 -SiO2 -GeO2 (-PbO optional) admixed with ZnO/ZnO and Bi2 O3 |
| 01/28/1986 | US4567111 Conductive pigment-coated surfaces |
| 01/28/1986 | US4566231 Vibration damping stiffener |
| 01/28/1986 | US4566186 Multilayer interconnect circuitry using photoimageable dielectric |
| 01/22/1986 | EP0169060A2 Solderable conductive compositions, their use as coatings on substrates, and compositions useful in forming them |
| 01/22/1986 | EP0169059A2 Flexible, directly solderable conductive compositions, compositions useful in forming them, and their use as coatings on substrates |
| 01/22/1986 | EP0168849A1 Starting mixture for an insulating composition, silk screen printing ink comprising such a mixture for the manufacture of hybrid microcircuits on a colaminate substrate |
| 01/22/1986 | EP0168609A1 Method for repairing pinholes in dielectric layers |
| 01/22/1986 | EP0168509A1 Manufacture of connection holes in plastic plates and application of the method |
| 01/22/1986 | EP0168444A1 Circuit with optical bus. |
| 01/21/1986 | US4565922 Key card apparatus |
| 01/16/1986 | WO1986000490A1 Control board for ac motors |
| 01/16/1986 | WO1986000470A1 Method for fabricating electronic elements |
| 01/15/1986 | EP0168228A2 Display device |
| 01/15/1986 | EP0167748A2 Compact electrical connection and distribution system for pluggable modular devices |
| 01/15/1986 | EP0167732A1 Method for producing a basic material for a hybrid circuit |
| 01/14/1986 | US4564563 Solderable conductor |
| 01/14/1986 | CA1199421A1 Electrical assembly including a conductor pattern bonded to a non-metallic substrate and method of fabricating such assembly |
| 01/08/1986 | EP0167344A2 Multilayer interconnect circuitry using photoimageable dielectric |
| 01/08/1986 | EP0167198A1 Starting mixture for an isolating composition containing a lead glass, screen printing ink comprising such a mixture, and use of this ink for protecting hybrid microcircuits on ceramic substrates |
| 01/08/1986 | EP0167051A1 Thermostable and irradiation-curable polymer system based on bisphenol and epichlorohydrine, and method for its preparation |
| 01/08/1986 | EP0167020A2 Flexible polyimide multilayer laminate |
| 01/08/1986 | EP0166762A1 Electrical circuitry |
| 01/07/1986 | US4563725 Electrical assembly |
| 01/07/1986 | US4563543 Stable interface between silver alloy and gold deposits |
| 01/07/1986 | US4563385 Hybrid glass cloth for printed circuit boards |
| 01/07/1986 | US4563383 Direct bond copper ceramic substrate for electronic applications |
| 01/07/1986 | US4563301 Electrically conductive low dimensional organomacrocycle compositions, articles and fabrication methods |
| 01/07/1986 | US4563242 Method for plating polyamide resin molded article |
| 01/03/1986 | WO1986000190A1 Method of forming electrically conductive circuit |
| 01/02/1986 | EP0166665A2 Method of making substrates for printed circuits, composition used in this process and substrates so obtained |
| 01/02/1986 | EP0166634A1 Electric voltage dividing device and electronic component containing a package including such a device |
| 01/02/1986 | EP0166624A2 Ultrathin chemically resistant marker and method of producing therefor |
| 01/02/1986 | EP0166451A2 Para-phenylene sulfide block copolymers; process for the production of the same and use thereof |
| 01/02/1986 | EP0166418A2 Flexible strip at the end of conductors on a printed-circuit foil |
| 01/02/1986 | EP0166401A2 Circuit module |
| 01/02/1986 | EP0166289A2 High density module for semiconductor device chips |
| 01/02/1986 | EP0166110A2 Circuit board arrangement |
| 01/02/1986 | EP0166105A2 Flexible board and process for making it |
| 12/31/1985 | US4562514 Polarized electronic component and its manufacturing process |
| 12/31/1985 | US4562513 Process for forming a high density metallurgy system on a substrate and structure thereof |
| 12/31/1985 | US4562301 Through-hole pin for laminated circuit substrates and method of insertion thereof |
| 12/31/1985 | US4562119 Flexible, printed circuit |
| 12/31/1985 | US4562092 Method of fabricating complex microcircuit boards, substrates and microcircuits and the substrates and microcircuits |
| 12/31/1985 | US4561891 Contains beryllium, dielectric, thermoconductivity |
| 12/31/1985 | US4561711 Connector saver assembly |
| 12/31/1985 | US4561709 Membrane type circuit having improved tail |
| 12/31/1985 | CA1198831A1 Nondestructive dimensional detection system |
| 12/31/1985 | CA1198830A1 Board to board interconnect structure |
| 12/31/1985 | CA1198829A1 High-speed wire wrap board |
| 12/31/1985 | CA1198662A1 Process for preparing high temperature polyimide film laminates |
| 12/27/1985 | EP0165705A1 Integrated circuit chip carrier |
| 12/27/1985 | EP0165692A2 Magnetic bubble memory component |
| 12/27/1985 | EP0165575A2 Method for forming vias in a planar structure |
| 12/27/1985 | EP0165530A1 Novel fiber glass composition |
| 12/27/1985 | EP0165524A2 Material for printed circuit substrates |
| 12/27/1985 | EP0165427A2 Semiconductor package substrate and manufacturing process |
| 12/27/1985 | EP0165423A1 Laminated material containing polyhydantoins |
| 12/24/1985 | US4561039 Thick film electronic circuit |
| 12/24/1985 | US4561010 Containing beryllium, boron or compounds thereof and nondiffusing metal (or) compound adjuvant |
| 12/24/1985 | US4561006 Integrated circuit package with integral heating circuit |
| 12/24/1985 | US4560962 Electroconductive layers separated by dielectric epoxy glass substrates |
| 12/24/1985 | US4560445 Continuous process for fabricating metallic patterns on a thin film substrate |
| 12/24/1985 | US4560220 Etched multichannel electrical connector |
| 12/18/1985 | EP0165182A1 Molecular electronic device with coded plug-in modules |