Patents for H05K 1 - Printed circuits (98,583)
06/2013
06/26/2013EP2607121A1 Electric heating device, in particular for a motor vehicle
06/26/2013CN203027640U Electronic component substrate and fixation element for installing electronic components onto printed circuit board
06/26/2013CN203027605U Circuit board provided with built-in type resistor
06/26/2013CN203027604U Printed circuit board
06/26/2013CN203027603U Circuit board
06/26/2013CN203027602U 印刷电路板 A printed circuit board
06/26/2013CN203027601U FPC (Flexible Printed Circuit) gold finger
06/26/2013CN203027600U Pin structure of PCB (Printed Circuit Board)
06/26/2013CN203027599U High-flexibility double-sided FPC (flexible printed circuit)
06/26/2013CN203027598U Fastener and circuit board of fastener
06/26/2013CN203027597U Power adapter and electrostatic discharge protective circuit thereof
06/26/2013CN203027596U Flexible circuit board and combination thereof
06/26/2013CN203027595U Grounding device of printed circuit board and electronic device
06/26/2013CN203027594U Wiring structure of annular earth wire
06/26/2013CN203027593U Special reinforcement plate for FPC (flexible printed circuit)
06/26/2013CN203027592U Dual-sided FPC (flexible printed circuit)
06/26/2013CN203027591U PCB board
06/26/2013CN203027590U Printed circuit board
06/26/2013CN203027319U Anti-bubble structure of camera module for mobile phone
06/26/2013CN203026515U Circuit substrate of high-concentration solar cell
06/26/2013CN203019621U Circuit board of locking device and injection mold for circuit board
06/26/2013CN103181247A 高频电路基板 High frequency circuit board
06/26/2013CN103181245A Electrical junction box
06/26/2013CN103181244A Printed circuit board for population with luminous bodies
06/26/2013CN103181045A Metal core substrate and electrical connection box using said metal core substrate
06/26/2013CN103180913A Low-temperature sintering conductive paste, conductive film using same, and method for forming conductive film
06/26/2013CN103180371A Prepreg, laminate, metal foil-clad laminate, circuit board and LED module
06/26/2013CN103180138A Metal-clad laminate, method for producing same, and flexible printed board
06/26/2013CN103179810A Method of manufacturing multi-layer circuit board and multi-layer circuit board manufactured by using the method
06/26/2013CN103179808A 多层印刷电路板及其制作方法 Multilayer printed circuit board and its manufacturing method
06/26/2013CN103179802A Metal half-hole forming method and printed circuit board manufacture method
06/26/2013CN103179796A Circuit board manufacturing method and circuit board manufactured by same
06/26/2013CN103179794A Circuit board and production method thereof
06/26/2013CN103179790A Mixed-compressing printed circuit board and manufacture method thereof
06/26/2013CN103179788A Printed circuit board for molded underfill and printed circuit board molding structure
06/26/2013CN103179787A Structure and method for packaging three-axis sensor
06/26/2013CN103179786A Circuit board, display module, and electronic apparatus
06/26/2013CN103179785A Circuit board and manufacture method thereof
06/26/2013CN103179784A Multi-layer electronic structure having the function of integrated Faraday shielding
06/26/2013CN103179783A 印刷电路板 A printed circuit board
06/26/2013CN103179782A Impedance-controlled low-loss single-ended via hole structure
06/26/2013CN103179781A Method for improving thermal conduction capability of printed board of surface-mounted device
06/26/2013CN103179780A Multi-layer wiring substrate and manufacturing method thereof
06/26/2013CN103179779A Circuit substrate
06/26/2013CN103179778A Printed circuit board
06/26/2013CN103179777A Fixing seat
06/26/2013CN103179776A Signal transmission line with testing points
06/26/2013CN103178326A Antenna and on-off key integrated FPC (flexible circuit board) and mobile terminal
06/26/2013CN103178037A 电子部件与电子装置 The electronic component and the electronic device
06/26/2013CN103175456A Method for detecting position alignment offset and printed circuit board (PCB) in manufacture process
06/26/2013CN103170618A Metal microparticle dispersion, process for production of electrically conductive substrate, and electrically conductive substrate
06/26/2013CN102300406B Embedded-type circuit board and production method thereof
06/26/2013CN101946567B Printed circuit board
06/26/2013CN101932439B Metal foil laminated polyimide resin substrate
06/26/2013CN101925657B Heat capacity control material and method of part mounting
06/26/2013CN101652244B Metal-resin laminate
06/25/2013US8472207 Electronic device having liquid crystal polymer solder mask and outer sealing layers, and associated methods
06/25/2013US8472204 Advanced mezzanine card for hosting a PMC or XMC
06/25/2013US8472202 System for connecting electrical cables to a printed circuit board
06/25/2013US8472201 Circuit module
06/25/2013US8472199 System including a plurality of encapsulated semiconductor chips
06/25/2013US8471156 Method for forming a via in a substrate and substrate with a via
06/25/2013US8471155 Metal plugged substrates with no adhesive between metal and polyimide
06/25/2013US8471154 Stackable variable height via package and method
06/25/2013US8471153 Multilayer printed wiring board including a capacitor section
06/25/2013US8471152 Microstructure and microstructure manufacture method
06/25/2013US8471151 Layout method for bridging electrode capable of shielding bright spot and structure of the bridging electrode
06/25/2013US8470938 Resin composition for printed wiring board, prepreg, and laminate obtained with the same
06/25/2013US8470936 Liquid epoxy resin composition for semiconductor encapsulation
06/25/2013US8470450 Method of producing two-layered copper-clad laminate, and two-layered copper-clad laminate
06/25/2013US8469723 Re-configurable electrical connectors
06/23/2013CA2799894A1 Device for protecting an electronic printed circuit board
06/20/2013WO2013089687A1 Elastomer adhesions
06/20/2013WO2013089416A1 Printed circuit board and method of manufacturing the same
06/20/2013WO2013089128A1 Conductive composition, multilayer ceramic substrate, and method for manufacturing same
06/20/2013WO2013089062A1 Adhesive agent, and method for connecting electronic component
06/20/2013WO2013089061A1 Electrically conductive adhesive agent, and method for connecting electronic component
06/20/2013WO2013088957A1 Multilayer glass ceramic substrate with embedded resistor
06/20/2013WO2013088659A1 Metal-plated laminated board, and printed wiring board
06/20/2013WO2013088493A1 Circuit substrate, and method of manufacturing circuit substrate
06/20/2013WO2013088263A2 Heatsink interposer
06/20/2013WO2013088047A1 Thermally conductive and electrically insulating link between at least one electronic component and a completely or partially metal radiator
06/20/2013WO2013087745A1 Light-emitting component arrangement
06/20/2013WO2013087632A1 Control unit having a sacrificial structure
06/20/2013WO2013087494A1 System for regulating the temperature of an assembly of electronic components or for recovering the thermal energy dissipated by an assembly of electronic components
06/20/2013WO2013087371A1 Control unit for a motor vehicle
06/20/2013WO2013087081A1 Device for supplying electrical energy to a load, and system therefor
06/20/2013WO2013027856A3 Wiring board in which a component is mounted
06/20/2013US20130157102 Device mounting board, cell, and battery module
06/20/2013US20130157068 Pcb structure with a silicone layer as adhesive
06/20/2013US20130157010 Transparent conductive film
06/20/2013US20130155653 Display devices, and display and electronic systems including the display devices
06/20/2013US20130155638 Ground device and portable terminal having the same
06/20/2013US20130155632 Flexible printed circuit board and combination thereof
06/20/2013US20130155631 Power generating device and power generating module using same
06/20/2013US20130153952 Light emitting device, and package array for light emitting device
06/20/2013US20130153390 Touch sensor and method for manufacturing the same
06/20/2013US20130153289 Crystal used for closing the top of the case of a portable object and method of welding a crystal of this type
06/20/2013US20130153282 Printed circuit board
06/20/2013US20130153281 Light source mount