Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
02/2003
02/19/2003CN1397817A Light transmission appts.
02/19/2003CN1397588A Photocationic solidified resin compsn. and its application
02/18/2003US6522315 Display apparatus
02/18/2003US6522065 Single phosphor for creating white light with high luminosity and high CRI in a UV led device
02/18/2003US6522063 Light emitting diode
02/18/2003US6521999 Transparent electrode film and group III nitride semiconductor device
02/18/2003US6521940 High density electronic circuit modules
02/18/2003US6521917 Semiconductor structures using a group III-nitride quaternary material system with reduced phase separation
02/18/2003US6521916 Radiation emitter device having an encapsulant with different zones of thermal conductivity
02/18/2003US6521915 Light-emitting diode device
02/18/2003US6521914 III-Nitride Light-emitting device with increased light generating capability
02/18/2003US6521514 Pendeoepitaxial methods of fabricating gallium nitride semiconductor layers on sapphire substrates
02/18/2003US6520670 Light radiating device with large beam spot size and spatial optical communication device
02/18/2003US6520655 Lighting device
02/13/2003WO2003012884A1 Display system
02/13/2003WO2003012834A1 Coupled quantum dot and quantum well semiconductor device and method of making the same
02/13/2003WO2003012006A1 Colloidal nanocrystals with high photoluminescence quantum yields and methods of preparing the same
02/13/2003WO2002052335A3 Variable focal length micro lens array field curvature corrector
02/13/2003WO2002041364A9 Led packages having improved light extraction
02/13/2003US20030032297 Method to GaAs based lasers and a GaAs based laser
02/13/2003US20030032212 LED focusing cup in a stacked substrate
02/13/2003US20030031424 Optical connector and optical element
02/13/2003US20030031218 VCSEL structure and method of making same
02/13/2003US20030030368 Illumination unit having at least one LED as light source
02/13/2003US20030030068 Nitride-based semiconductor element
02/13/2003US20030030067 Upconversion luminescence materials and methods of making and using same
02/13/2003US20030030060 White semiconductor light-emitting device
02/13/2003CA2455230A1 Coupled quantum dot and quantum well semiconductor device and method of making the same
02/12/2003EP1149510B1 A led array employing a specifiable lattice relationship
02/12/2003CN2535926Y Light-emitting diode packaging structure
02/12/2003CN1397095A 发光二极管及半导体激光 Light-emitting diodes and semiconductor laser
02/12/2003CN1396667A Package of LED
02/11/2003US6518885 Ultra-thin outline package for integrated circuit
02/11/2003US6518602 Nitride compound semiconductor light emitting device and method for producing the same
02/11/2003US6518601 Light-emitting diode
02/11/2003US6518600 An encapsulated device comprises a solid state device, a first encapsulating material and a second encapsulating material having a higher thermal conductivity than the first encapsulating material. The solid state device may be an LED.
02/11/2003US6518599 Light-emitting device using group III nitride group compound semiconductor
02/11/2003US6518598 III-nitride LED having a spiral electrode
02/11/2003US6518082 Method for fabricating nitride semiconductor device
02/11/2003US6518079 Separation method for gallium nitride devices on lattice-mismatched substrates
02/11/2003US6518077 Method for making optoelectronic and microelectronic devices including cubic ZnMgO and/or CdMgO alloys
02/11/2003US6517259 Optical module and method of manufacturing the same, and optical transmission device
02/11/2003US6517252 Optical connector
02/11/2003US6517218 LED integrated heat sink
02/11/2003US6516516 Semiconductor chip package having clip-type outlead and fabrication method of same
02/06/2003WO2003010833A2 Flip chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding
02/06/2003WO2003010832A1 Light emitting device using led
02/06/2003WO2003010831A1 Semiconductor light emitting device comprising uneven substrate
02/06/2003WO2003010830A2 Multichip led package with in-package quantitative and spectral sensing capability and digital signal output
02/06/2003WO2003010817A2 Light emitting diodes including modifications for submount bonding and manufacturing methods therefor
02/06/2003WO2003010798A2 Bonding of light emitting diodes having shaped substrates and collets for bonding of light emitting diodes having shaped substrates
02/06/2003WO2003010739A1 Led display
02/06/2003US20030027963 Polymerizing a bis(hydrocarbylthio)methylaromatic compound to form a sulfide-substituted polyarylenevinylene and oxidizing the sulfide group
02/06/2003US20030027372 Semiconductor device having leads provided with interrupter for molten resin
02/06/2003US20030027369 Light-emitting device, method of manufacturing a light-emitting device, and electronic equipment
02/06/2003US20030027099 Stacked layer structure, light-emitting device, lamp, and light source unit
02/06/2003US20030026553 Optical chip packaging via through hole
02/06/2003US20030026096 LED-based planar light source
02/06/2003US20030025657 Light emitting unit
02/06/2003US20030025450 LED lamp and LED lamp manufacturing method
02/06/2003US20030025449 Hybrid LED
02/06/2003US20030025212 Semiconductor LED flip-chip with high reflectivity dielectric coating on the mesa
02/06/2003US20030025170 Surface-mountable light-emitting diode structural element
02/06/2003US20030025169 Adjustable in-line leads for light emitting device package
02/06/2003US20030025121 Robust Group III light emitting diode for high reliability in standard packaging applications
02/06/2003US20030025120 Integrated LED driving device with current sharing for multiple LED strings
02/06/2003US20030025117 Semiconductor light-emitting device having a reflective case
02/06/2003US20030025115 III nitride compound semiconductor device
02/06/2003US20030025113 Semiconductor structures having reduced contact resistance
02/06/2003US20030024475 Method and apparatus for producing group-III nitrides
02/06/2003US20030024438 Pigment with day-light fluorescence
02/06/2003CA2454797A1 Flip-chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding
02/06/2003CA2454735A1 Bonding of light emitting diodes having shaped substrates and collets for bonding of light emitting diodes having shaped substrates
02/06/2003CA2453581A1 Light emitting diodes including modifications for submount bonding and manufacturing methods therefor
02/05/2003EP1282171A2 LED-based planar light-source
02/05/2003EP1281205A2 Optoelectronic component and method for the production thereof
02/05/2003EP1281101A1 Assembly of a display device and an illumination system
02/05/2003CN2534679Y Light emitting diode module with improved radiating effect
02/05/2003CN2534462Y Luminous diode lights using wide angle luminous diode
02/05/2003CN1395323A Luminescent device, method and electronic equipment for manufacturing luminescent device
02/05/2003CN1395321A Semiconductor light-emitting component
02/05/2003CN1395320A Semiconductor light-emitting device double-heterogeneity structure and light-emitting diode
02/04/2003US6515434 Control circuit for LED and corresponding operating method
02/04/2003US6515313 High efficiency light emitters with reduced polarization-induced charges
02/04/2003US6515311 Gallium nitride based semiconductor light emitting device
02/04/2003US6515308 Nitride-based VCSEL or light emitting diode with p-n tunnel junction current injection
02/04/2003US6515306 Light emitting diode
02/04/2003US6514782 Method of making a III-nitride light-emitting device with increased light generating capability
02/04/2003US6513949 LED/phosphor-LED hybrid lighting systems
01/2003
01/31/2003CA2396019A1 Led-based planar light source
01/30/2003WO2003009399A1 Gallium nitride-based led and a production method therefor
01/30/2003WO2003009398A2 Structure and method for fabricating an optical bus
01/30/2003WO2003009344A2 Iii-v arsenide nitride semiconductor substrate
01/30/2003WO2002091488A3 Semiconductor device including an optically-active material
01/30/2003WO2002009242A3 Optical structure on compliant substrate
01/30/2003WO2001097295A3 Micro-size led and detector arrays for minidisplay hyper-bright light emitting diodes, lighting, and uv detector and imaging sensor applications
01/30/2003US20030022407 Manufacturing method of lighting device
01/30/2003US20030022406 Method for making a vertical-cavity surface emitting laser with improved current confinement
01/30/2003US20030022028 Group III nitride compound semiconductor device and group III nitride compound semiconductor light-emitting device
01/30/2003US20030021982 Preparation of graded semiconductor films by the layer-by-layer assembly of nanoparticles