| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 11/25/2010 | US20100295016 Fluorescent fiber containing semiconductor nanoparticles |
| 11/25/2010 | US20100295015 Light emitting device and light emitting device package having the same |
| 11/25/2010 | US20100295014 Improvements in external light efficiency of light emitting diodes |
| 11/25/2010 | US20100294957 Radiation-Emitting Semiconductor Body |
| 11/25/2010 | DE202010012412U1 Leuchtendes pneumatisches Massagegerät im Unterwasser Kelly pneumatic massager under water |
| 11/25/2010 | DE102009022255A1 Leuchtdiode mit Kühlkörper LED with heatsink |
| 11/25/2010 | DE102006052016B4 Beleuchtungssteuervorrichtung für eine Beleuchtungseinrichtung für ein Fahrzeug Lighting control device for a lighting device for a vehicle |
| 11/24/2010 | EP2254168A2 Light emitting device and light emitting device package having the same |
| 11/24/2010 | EP2254167A2 Light emitting device and light emitting device package having the same |
| 11/24/2010 | EP2254166A2 Light emitting device and light emitting device package having the same |
| 11/24/2010 | EP2254165A1 Infrared light emitting device |
| 11/24/2010 | EP2254164A1 Compound semiconductor light-emitting element and illumination device using the same, and method for manufacturing compound semiconductor light-emitting element |
| 11/24/2010 | EP2253973A1 Side light type illuminated light guide plate with overlapping lamp houses |
| 11/24/2010 | EP2253690A2 Light emitting device |
| 11/24/2010 | EP2253671A1 Silicone Resin Composition for Optical Semiconductor Devices and an Optical Semiconductor Device |
| 11/24/2010 | EP2253026A1 Led light engine kernel and method of making the kernel |
| 11/24/2010 | EP2253025A1 Broadband light emitting device lamps for providing white light output |
| 11/24/2010 | EP2253020A1 A new type of gapless semiconductor material |
| 11/24/2010 | EP2252830A1 Color variable light emitting device |
| 11/24/2010 | EP2239790A9 Method for manufacturing light emitting device |
| 11/24/2010 | EP2095435B1 Semiconductor light emitting device configured to emit multiple wavelengths of light |
| 11/24/2010 | EP1733441B1 Light emitting device and phosphor for the same |
| 11/24/2010 | EP1129478B1 Method and apparatus for improving accuracy of plasma etching process |
| 11/24/2010 | CN201655854U LED (light emitting diode) heat radiator |
| 11/24/2010 | CN201655853U Lead frame used for welding diode chips |
| 11/24/2010 | CN201655852U LED backlight light bar encapsulated by adopting surface mount technology |
| 11/24/2010 | CN201655851U Spatially uniform luminescent LED component |
| 11/24/2010 | CN201655850U Light-emitting diode (LED) capable of emitting parallel light |
| 11/24/2010 | CN201655849U LED strong-light device |
| 11/24/2010 | CN201655848U LED single wafer packaging device |
| 11/24/2010 | CN201655847U LED multi-wafer integrated encapsulation device |
| 11/24/2010 | CN201655846U Radiating structure of high-power light-emitting diode |
| 11/24/2010 | CN201655845U High-power LED (light-emitting diode) |
| 11/24/2010 | CN201655844U 3mm light emitting diode with improved package reliability |
| 11/24/2010 | CN201655843U LED encapsulation structure |
| 11/24/2010 | CN201655842U Surface mounted devices light-emitting diode encapsulating structure |
| 11/24/2010 | CN201655841U Heat-dissipating packaging optical strip of side entering-type LED backlight source |
| 11/24/2010 | CN201655840U High-reliability light-emitting diode |
| 11/24/2010 | CN201655839U Improved structure of luminous diode |
| 11/24/2010 | CN201655838U Fluid encapsulating structure for LED light source |
| 11/24/2010 | CN201655837U Heat-dissipating structure of LED light emitter |
| 11/24/2010 | CN201655836U Reflecting, radiating and sealing base of high power LED light source |
| 11/24/2010 | CN201655835U Fastening structure of die strip and aluminum ship of LED automatic glue-pouring equipment |
| 11/24/2010 | CN201655834U Cantilever structure of automatic glue applicator |
| 11/24/2010 | CN201655833U Large-power LED encapsulation base |
| 11/24/2010 | CN201655804U LED circuit boards fixedly connected by speed hump with cable tray |
| 11/24/2010 | CN201655803U Novel multi-chip LED package structure |
| 11/24/2010 | CN201655802U Sealing structure for light emitting diode |
| 11/24/2010 | CN201655800U Novel flexible circuit board of LED lighting array |
| 11/24/2010 | CN201655798U Radiator of multi-chip combined LED (Light-emitting diode) |
| 11/24/2010 | CN201655796U Packaging structure of light emitting diode |
| 11/24/2010 | CN201651936U LED packaging structure provided with glass cover |
| 11/24/2010 | CN201651846U White-light LED light source |
| 11/24/2010 | CN201644323U Automatic glue dispensing mechanism |
| 11/24/2010 | CN101897048A Contact for a semiconductor light emitting device |
| 11/24/2010 | CN101897047A Light emitting device with bonded interface |
| 11/24/2010 | CN101897046A Semiconductor light emitting device and method of fabricating the same |
| 11/24/2010 | CN101897045A Light emitting diode and method for manufacturing the same |
| 11/24/2010 | CN101897044A Semiconductor component emitting polarized radiation |
| 11/24/2010 | CN101897043A Arrangement comprising at least one optoelectronic semiconductor component |
| 11/24/2010 | CN101897042A Radiation-emitting device |
| 11/24/2010 | CN101897041A Side emitting device with hybrid top reflector |
| 11/24/2010 | CN101897040A Side emitting device with hybrid top reflector |
| 11/24/2010 | CN101897039A Side emitting device with hybrid top reflector |
| 11/24/2010 | CN101897038A Down-converted light emitting diode with simplified light extraction |
| 11/24/2010 | CN101896993A Fabrication of semiconductor devices |
| 11/24/2010 | CN101896761A Surface illumination unit, surface illumination light source, and surface illumination device |
| 11/24/2010 | CN101896648A Multilayer substrate including GaN layer, method for manufacturing the multilayer substrate including GaN layer, and device |
| 11/24/2010 | CN101896575A Conversion LED |
| 11/24/2010 | CN101896549A Photosemiconductor package sealing resin material |
| 11/24/2010 | CN101896050A Thermal power electronic device, method for cooling electronic device, and light-emitting diode |
| 11/24/2010 | CN101894902A LED substrate and manufacturing method thereof |
| 11/24/2010 | CN101894901A Package for multiple light emitting diodes |
| 11/24/2010 | CN101894900A Method for manufacturing white light LED by single crystals |
| 11/24/2010 | CN101894899A Light emitting device, backlight module device and illumination device |
| 11/24/2010 | CN101894898A LED and package method thereof |
| 11/24/2010 | CN101894897A High-performance glass encapsulation method of light emitting diode |
| 11/24/2010 | CN101894896A Glass ball cavity encapsulation method of light emitting diode |
| 11/24/2010 | CN101894895A Light emitting device and light emitting device package having the same |
| 11/24/2010 | CN101894894A Light emitting device and light emitting device package having the same |
| 11/24/2010 | CN101894893A Electroluminescent device based on double-layer MgZnO film heterojunctions |
| 11/24/2010 | CN101894892A LED wafer package and manufacturing method thereof |
| 11/24/2010 | CN101894891A LED wafer package and lighting device using same |
| 11/24/2010 | CN101894890A Method for improving LED light extraction efficiency by utilizing zinc oxide |
| 11/24/2010 | CN101894889A Method for preparing white light LED |
| 11/24/2010 | CN101894833A LED module and LED lighting device |
| 11/24/2010 | CN101894824A Bearing structure of electronic component and preparation method thereof |
| 11/24/2010 | CN101894765A Manufacturing method of LED device |
| 11/24/2010 | CN101893212A Packaging body for luminous source |
| 11/24/2010 | CN101893205A Led focusing optical system |
| 11/24/2010 | CN101893175A LED illuminating lamp, lamp wick and lamp thereof |
| 11/24/2010 | CN101893168A White light luminous diode packaging unit, illuminator and manufacturing method thereof |
| 11/24/2010 | CN101892467A Integrating multi-reaction chamber flow process epitaxial growth method and system |
| 11/24/2010 | CN101892054A White emitting fluorescent powder for LED and preparation method thereof |
| 11/24/2010 | CN101892052A Red light luminescent material, manufacturing method thereof and white light emitting device |
| 11/24/2010 | CN101891893A Preparation method of phenyl-based hydrogen-based silicone resin for encapsulating LED |
| 11/24/2010 | CN101436631B Method for packaging LED |
| 11/24/2010 | CN101399306B InP-InAsP nanowire LED and preparation thereof |
| 11/24/2010 | CN101154702B Packaging tool of light emitting diode |
| 11/23/2010 | US7839087 Light emitting device and method of manufacturing the same |