| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 12/30/2010 | US20100328638 Led light source, its manufacturing method, and led-based photolithography apparatus and method |
| 12/30/2010 | US20100327783 Staggered composition quantum well method and device |
| 12/30/2010 | US20100327753 Stacked body, light emitting device, and image formation device |
| 12/30/2010 | US20100327752 Light source unit, lighting apparatus and notice bearing apparatus |
| 12/30/2010 | US20100327734 Luminescent material |
| 12/30/2010 | US20100327312 Group III nitride semiconductor light-emitting device and method for producing the same |
| 12/30/2010 | US20100327311 Group iii nitride semiconductor light emitting device and production method thereof, and lamp |
| 12/30/2010 | US20100327310 Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange |
| 12/30/2010 | US20100327309 Voltage-operated layered arrangement |
| 12/30/2010 | US20100327308 Light emitting diode package and method of manufacturing the same |
| 12/30/2010 | US20100327307 Optoelectronic Component |
| 12/30/2010 | US20100327306 Led based light source for improved color saturation |
| 12/30/2010 | US20100327305 Photonic structures for efficient light extraction and conversion in multi-color light emitting devices |
| 12/30/2010 | US20100327303 Light-emitting diode lamp with uniform resin coating |
| 12/30/2010 | US20100327302 Led module |
| 12/30/2010 | US20100327301 Led lighting device |
| 12/30/2010 | US20100327300 Contact for a semiconductor light emitting device |
| 12/30/2010 | US20100327299 P-contact layer for a iii-p semiconductor light emitting device |
| 12/30/2010 | US20100327298 Light-emitting element and method of making the same |
| 12/30/2010 | US20100327296 Display apparatus |
| 12/30/2010 | US20100327295 Led package structure with external cutting chamfer and method for manufacturing the same |
| 12/30/2010 | US20100327294 Led package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same |
| 12/30/2010 | US20100327290 Manufacturing method of semiconductor device, manufacturing method of display device, semiconductor device, display device, and electronic device |
| 12/30/2010 | US20100327289 Flat display panel, uv sensor and fabrication method thereof |
| 12/30/2010 | US20100327287 Display Device And Manufacturing Method Of The Same |
| 12/30/2010 | US20100327285 Semiconductor device and manufacturing method of semiconductor device and display device and manufacturing method of display device |
| 12/30/2010 | US20100327275 Organic el panel and its manufacturing method |
| 12/30/2010 | US20100327267 Organic electroluminescence device and production method thereof |
| 12/30/2010 | US20100327257 Optical semiconductor device and method for manufacturing the same |
| 12/30/2010 | US20100327256 Controlling pit formation in a iii-nitride device |
| 12/30/2010 | US20100327228 Group iii nitride semiconductor epitaxial substrate and method for manufacturing the same |
| 12/30/2010 | US20100326876 Method of Storing GaN Substrate, Stored Substrate, and Semiconductor Device and Method of Its Manufacture |
| 12/30/2010 | US20100326519 Hidden organic optoelectronic devices with a light scattering layer |
| 12/30/2010 | DE202010008942U1 Ein Beleuchtungsmodul A lighting module |
| 12/30/2010 | DE202010008705U1 Arrayartiges Multi-Chip-Gehäuse für LEDs Array-like multi-chip package for LEDs |
| 12/30/2010 | DE202010008702U1 LED-Verkapselung auf Waferebene LED encapsulation at the wafer level |
| 12/30/2010 | DE10261908B4 Verfahren zur Herstellung eines konversionslichtemittierenden Elementes auf der Basis von Halbleiterlichtquellen A method for producing a conversion light emitting element based on semiconductor light sources |
| 12/30/2010 | DE102009031009A1 Radiation-emitting device is provided with carrier, radiation-emitting semiconductor chip, which is mounted on upper side of carrier at carrier, and protective cap |
| 12/30/2010 | DE102009031008A1 Optoelektronisches Bauteil The optoelectronic device |
| 12/30/2010 | DE102009030458A1 Light emitting semiconductor component i.e. LED, has semiconductor light emission structure formed on one of surfaces of removal structure, carrier arranged on other surface of removal structure, and channel formed in removal structure |
| 12/30/2010 | DE102009030205A1 Luminescent substance with europium-doped silicate luminophore, useful in LED, comprises alkaline-, rare-earth metal orthosilicate, and solid solution in form of mixed phases arranged between alkaline- and rare-earth metal oxyorthosilicate |
| 12/30/2010 | DE102009025266A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device |
| 12/29/2010 | WO2010150994A2 Light-emitting diode having a wavelength conversion material layer, and method for fabricating same |
| 12/29/2010 | WO2010150972A2 Semiconductor light-emitting device and method for manufacturing same |
| 12/29/2010 | WO2010150880A1 White color reflecting material and process for production thereof |
| 12/29/2010 | WO2010150830A1 Light-emitting device |
| 12/29/2010 | WO2010150824A1 Lead frame for optical semiconductor device, process for manufacturing lead frame for optical semiconductor device, and optical semiconductor device |
| 12/29/2010 | WO2010150810A1 Light reflecting substrate and process for manufacture thereof |
| 12/29/2010 | WO2010150809A1 Nitride semiconductor light emitting diode |
| 12/29/2010 | WO2010150754A1 Light-emitting device |
| 12/29/2010 | WO2010150546A1 Planar light emitting device and production method for same |
| 12/29/2010 | WO2010150501A1 Light emitting element, method of producing same, lamp, electronic equipment, and mechanical apparatus |
| 12/29/2010 | WO2010150459A1 Light emitting module |
| 12/29/2010 | WO2010150444A1 Light-emitting element drive device, flat illumination device, and liquid crystal display device |
| 12/29/2010 | WO2010150114A2 Contact for a semiconductor light emitting device |
| 12/29/2010 | WO2010149978A1 Light emitting semiconductor device |
| 12/29/2010 | WO2010149939A1 Light-emitting diode with a built-in planar optical element having refractive index modulation |
| 12/29/2010 | WO2010149539A1 Optical projection apparatus comprising two light sources |
| 12/29/2010 | WO2010149027A1 Light-emitting unit array, method for fabricating the same and projection apparatus |
| 12/29/2010 | WO2010148641A1 Light-emitting diode lamp with uniform resin coating |
| 12/29/2010 | WO2010122471A3 Illumination device with a phosphor |
| 12/29/2010 | WO2010098848A3 An efficient irradiation system using curved reflective surfaces |
| 12/29/2010 | EP2267804A2 Method for manufacturing light emitting apparatus, light emitting apparatus, and mounting base thereof |
| 12/29/2010 | EP2267803A2 LED with current confinement structure and surface roughening |
| 12/29/2010 | EP2267802A2 High efficiency group III nitride LED with lenticular surface |
| 12/29/2010 | EP2267801A1 Light-emitting semiconductor chip and light-emitting semiconductor component |
| 12/29/2010 | EP2267800A2 Semiconductor chip for optoelectronics and method for producing same |
| 12/29/2010 | EP2267799A1 Light-emitting diode package |
| 12/29/2010 | EP2267798A1 Optoelectronic device |
| 12/29/2010 | EP2267797A1 Optoelectronic device |
| 12/29/2010 | EP2267796A2 Separation method of nitride semiconductor layer, semiconductor device, manufacturing method thereof, semiconductor wafer, and manufacturing method thereof |
| 12/29/2010 | EP2267773A2 LED package structure for increasing light-emitting efficiency and controlling light-projecting angle and method for manufacturing the same |
| 12/29/2010 | EP2267354A2 LED package structure with standby bonding pads for increasing wire-bonding yield and method for manufacturing the same |
| 12/29/2010 | EP2267194A2 Thin-film single crystal growing method |
| 12/29/2010 | EP2267189A1 High surface quality gan wafer and method of fabricating same |
| 12/29/2010 | EP2266149A1 Underfill process for flip-chip leds |
| 12/29/2010 | EP2266148A1 Low index spacer layer in led devices |
| 12/29/2010 | EP2266139A1 Optoelectronic component and method for producing an optoelectronic component |
| 12/29/2010 | EP1890340B1 Method for producing a porcelain enameled substrate for light-emitting device mounting. |
| 12/29/2010 | CN201689922U Light-emitting diode radiating device |
| 12/29/2010 | CN201689921U Semiconductor luminescent lamp connecting plate |
| 12/29/2010 | CN201689920U Semiconductor luminescent lamp connection plate |
| 12/29/2010 | CN201689919U LED-SMD lead frame structure |
| 12/29/2010 | CN201689918U Packaging structure of light emitting diode |
| 12/29/2010 | CN201689917U High-power LED support and LED lamp |
| 12/29/2010 | CN201689916U LED package structure |
| 12/29/2010 | CN201689915U Light-emitting diode |
| 12/29/2010 | CN201689914U Light emitting diode (LED) with surface mount plastic leaded chip carrier (PLCC) structure |
| 12/29/2010 | CN201689913U LED encapsulation structure with simple structure |
| 12/29/2010 | CN201689912U Semiconductor lighting lamp panel |
| 12/29/2010 | CN201689911U Encapsulation structure of light-emitting diode |
| 12/29/2010 | CN201689910U LED lamp core for illumination and three types of LED chips |
| 12/29/2010 | CN201689909U Improved LED support |
| 12/29/2010 | CN201689908U LED support |
| 12/29/2010 | CN201689907U LED (Light Emitting Diode) light emitting component |
| 12/29/2010 | CN201689906U Gallium-nitride-based high-brightness light emitting diode with projection structures |
| 12/29/2010 | CN201689905U LED packaging machine |
| 12/29/2010 | CN201689888U Multifunctional LED packing base board |
| 12/29/2010 | CN201689887U Large-area light-emitting diode module |
| 12/29/2010 | CN201689886U Base plate for lighting lamp with LED light source |