| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 12/22/2010 | CN201681965U Light-emitting diode light source module |
| 12/22/2010 | CN201681964U Light-emitting diode encapsulating structure |
| 12/22/2010 | CN201681963U High-power LED chip with vertical structure |
| 12/22/2010 | CN201681962U Novel gallium nitride-based light emitting diode |
| 12/22/2010 | CN201681961U LED package of coarsening surface |
| 12/22/2010 | CN201681927U High-power LED chip integrated encapsulating structure |
| 12/22/2010 | CN201681926U High-color-rendering light source module |
| 12/22/2010 | CN201681925U High-efficient array type LED packaging structure |
| 12/22/2010 | CN201680228U Light-emitting component of LED backlight source adopting light guide plate with V-shaped groove |
| 12/22/2010 | CN201680225U Hybrid light-emitting component of LED backlight source |
| 12/22/2010 | CN201680210U Omni-directional lighting LED device |
| 12/22/2010 | CN201680207U LED (light-emitting diode) light source module |
| 12/22/2010 | CN1881579B Light emitting apparatus |
| 12/22/2010 | CN101926014A 半导体器件封装 The semiconductor device package |
| 12/22/2010 | CN101926013A Nitride semiconductor light-emitting device |
| 12/22/2010 | CN101926012A Method for manufacturing light emitting device |
| 12/22/2010 | CN101926011A Light emitting device |
| 12/22/2010 | CN101926002A Lighting unit with temperature compensation |
| 12/22/2010 | CN101925979A Method for manufacturing III nitride semiconductor, method for manufacturing III nitride semiconductor light emitting element, III nitride semiconductor light emitting element, and lamp |
| 12/22/2010 | CN101925772A Illumination device with LED and transmissive support comprising luminescent material |
| 12/22/2010 | CN101925665A 发光装置 Light-emitting device |
| 12/22/2010 | CN101925622A Curable composition, fluorine-containing cured product, optical material using cured product, and light-emitting device |
| 12/22/2010 | CN101924178A LED heat radiating device |
| 12/22/2010 | CN101924177A Light-emitting diode with light distributing function and preparation method thereof |
| 12/22/2010 | CN101924176A Light-emitting diode packaging structure and packaging method thereof |
| 12/22/2010 | CN101924175A Packaging device of light-emitting diode and packaging method thereof |
| 12/22/2010 | CN101924174A Light emitting device, method of manufacturing the same, light emitting device package, and lighting system |
| 12/22/2010 | CN101924173A High lighting effect pattern substrate and manufacturing method thereof |
| 12/22/2010 | CN101924172A Illumination device |
| 12/22/2010 | CN101924171A Illumination device |
| 12/22/2010 | CN101924170A Rotary positioning mechanism of LED die bonder |
| 12/22/2010 | CN101924169A Package structure of optical chip and manufacturing method thereof |
| 12/22/2010 | CN101924168A High-power light emitting diode (LED) |
| 12/22/2010 | CN101924117A Light emitting device with light emitting cells arrayed |
| 12/22/2010 | CN101924116A Extensible oversize light-emitting diode (LED) chip and manufacture method thereof |
| 12/22/2010 | CN101924100A Photoelectric device with variable resistor structure |
| 12/22/2010 | CN101924099A Light-emitting diode device |
| 12/22/2010 | CN101924065A Method for reducing injury caused by laser peeling |
| 12/22/2010 | CN101924021A Semiconductor device, as well as manufacture method and luminescent device thereof |
| 12/22/2010 | CN101924020A Semiconductor devices and methods of making thereof |
| 12/22/2010 | CN101922681A Light combining system of LED three-color light |
| 12/22/2010 | CN101922676A Large-angle secondary light-distribution lens of LED streetlamp and manufacturing method thereof |
| 12/22/2010 | CN101922624A High-power LED surface light source |
| 12/22/2010 | CN101921591A 绿光发光材料及其制备方法 Green light-emitting material and method |
| 12/22/2010 | CN101921589A Niobate or tantalite fluorescent material used for white light LED and preparation method thereof |
| 12/22/2010 | CN101921571A High-temperature resistant packaging adhesive for high-power LED lamp and preparation method thereof |
| 12/22/2010 | CN101921456A Resin composition for sealing an optical semiconductor device |
| 12/22/2010 | CN101920184A Photocatalysis biochemical device based on nitride light-emitting diode and preparation method thereof |
| 12/22/2010 | CN101393957B Adhering process for encapsulated LED |
| 12/22/2010 | CN101305410B LED driver and display device using the same |
| 12/22/2010 | CN101290959B Fluorescent powder coating method of light emitting diode apparatus |
| 12/22/2010 | CN101280890B Method for manufacturing LED light bulb |
| 12/22/2010 | CN101271942B Luminous element |
| 12/22/2010 | CN101257077B Semiconductor light emitting diode device with photon crystal high reflection layer |
| 12/22/2010 | CN101099223B Light emitting diode with conducting metal substrate |
| 12/22/2010 | CN101083860B Drive device for light emitting diode element, light source device, and display |
| 12/21/2010 | US7856159 Optical element, optical module holder including optical element, optical module, and optical connector |
| 12/21/2010 | US7856045 Surface emitting semiconductor component |
| 12/21/2010 | US7855761 Liquid crystal display device |
| 12/21/2010 | US7855708 LED backlight luminance sensing for LCDs |
| 12/21/2010 | US7855501 LED with phosphor layer having different thickness or different phosphor concentration |
| 12/21/2010 | US7855459 Modified gold-tin system with increased melting temperature for wafer bonding |
| 12/21/2010 | US7855449 Cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device |
| 12/21/2010 | US7855425 Semiconductor device and method of manufacturing the same |
| 12/21/2010 | US7855398 Ceramic light emitting device package |
| 12/21/2010 | US7855397 Electronic assemblies providing active side heat pumping |
| 12/21/2010 | US7855396 Light emitting diode package structure |
| 12/21/2010 | US7855395 Light emitting diode package having multiple molding resins on a light emitting diode die |
| 12/21/2010 | US7855394 LED array package covered with a highly thermal conductive plate |
| 12/21/2010 | US7855393 Light emitting device with a non-activated luminescent material |
| 12/21/2010 | US7855392 Optoelectronic semiconductor component capable of centralizing emitted light |
| 12/21/2010 | US7855391 Lead frame and light emitting device package using the same |
| 12/21/2010 | US7855390 Package structure of light emitting diode for backlight |
| 12/21/2010 | US7855389 Semiconductor light-emitting device |
| 12/21/2010 | US7855386 N-type group III nitride semiconductor layered structure |
| 12/21/2010 | US7855092 Device for emitting white-color light |
| 12/21/2010 | US7854859 Activated by europium, includes magnesium, calcium, strontium or barium, and aluminum, silicon and boron, obtained by burning individual nitrides in a reducing atmosphere with ammonia, and absorbs near ultraviolet to blue light and emits red light; fluorescence lamps, displays, LCD backlights |
| 12/21/2010 | US7854804 Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same |
| 12/21/2010 | US7854539 Illumination device comprising a light source and a light-guide |
| 12/21/2010 | US7854535 Ceramic packaging for high brightness LED devices |
| 12/16/2010 | WO2010144591A2 High light extraction efficiency solid state light sources |
| 12/16/2010 | WO2010144252A2 Front end scribing of light emitting diode (led) wafers and resulting devices |
| 12/16/2010 | WO2010144213A2 Integrated circuit light emission device, module and fabrication process |
| 12/16/2010 | WO2010143895A2 Semiconductor substrate, semiconductor device, and manufacturing methods thereof |
| 12/16/2010 | WO2010143829A2 A led array board |
| 12/16/2010 | WO2010143778A1 Semiconductor substrate, fabrication method thereof, semiconductor device and fabrication method thereof |
| 12/16/2010 | WO2010143672A1 Jig, package, system substrate, and element mounting method |
| 12/16/2010 | WO2010143618A1 Fluorescent material and luminescent device |
| 12/16/2010 | WO2010143590A1 Β-sialon phosphor, use thereof and method for producing same |
| 12/16/2010 | WO2010143389A1 Semiconductor device |
| 12/16/2010 | WO2010143338A1 Light-emitting element driving device |
| 12/16/2010 | WO2010143225A1 Luminescent powder, method for producing same, luminescent element wherein luminescent powder is used, method for producing said luminescent element, and apparatus for producing luminescent powder |
| 12/16/2010 | WO2010143114A1 Led illumination device |
| 12/16/2010 | WO2010143093A1 Efficient light emitting device and method for manufacturing such a device |
| 12/16/2010 | WO2010143086A1 Led with remote phosphor layer and reflective submount |
| 12/16/2010 | WO2010141994A1 Process for producing a semiconductor-on-sapphire article |
| 12/16/2010 | WO2010101405A3 Luminescent device |
| 12/16/2010 | US20100317136 Method for producing semiconductor light emitting device, method for producing semiconductor device, method for producing device, method for growing nitride type iii-v group compound semiconductor layer, method for growing semiconductor layer, and method for growing layer |
| 12/16/2010 | US20100317133 Method for manufacturing a reflective surface sub-assembly for a light-emitting device |
| 12/16/2010 | US20100317132 Printed Assemblies of Ultrathin, Microscale Inorganic Light Emitting Diodes for Deformable and Semitransparent Displays |