Patents
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
10/2010
10/14/2010US20100258795 Zinc oxide based semiconductor device and method of manufacturing the same
10/14/2010US20100258766 Phosphor and manufacturing method for the same, and light source
10/14/2010US20100258712 Optical sensors that reduce spectral reflections
10/14/2010DE202009017981U1 Halbleiter-Lichtemissionsvorrichtung und Halbleiter-Lichtemissionsvorrichtungs-Baugruppe, die diese verwendet Semiconductor light-emitting device and semiconductor light emitting device module that uses this
10/14/2010CA2758018A1 Luminescent converter for a phosphor-enhanced light source comprising organic and inorganic phosphors
10/13/2010EP2239791A2 Light emitting diode device and method for forming the same
10/13/2010EP2239790A2 Method for manufacturing light emitting device
10/13/2010EP2239743A1 Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, light-emitting device, and method for manufacturing light-emitting device
10/13/2010EP2239284A1 Curable composition, fluorine-containing cured product, optical material using the cured product, and light-emitting device
10/13/2010EP2238630A2 Semiconductor light emitting device comprising heterojunction
10/13/2010EP2238629A1 Light emitting device within magnetic field
10/13/2010EP2238384A1 Semiconductor package with incorporated light or temperature sensors and time multiplexing
10/13/2010EP1685211B1 Method for producing nitridosilicate-based compound, nitridosilicate phosphor, and light-emitting apparatus using the nitridosilicate phosphor
10/13/2010CN201608205U Led新型封装线路板 Led new package board
10/13/2010CN201608204U 一种led芯片封装结构 One kind of led chip package structure
10/13/2010CN201608203U 用于led模组点胶封装的治具及设备 Fixtures and equipment used for dispensing package led module
10/13/2010CN201608202U 贴片式led支架 SMD led bracket
10/13/2010CN201608201U 一种信号发射/接收二极管 A signal transmitting / receiving diode
10/13/2010CN201608200U 发光二极管封胶罩壳 Light-emitting diodes sealed plastic enclosure
10/13/2010CN201608182U Led灯支架 Led lamp holder
10/13/2010CN201608181U 单颗多面光源led支架 Single multi-faceted light led bracket
10/13/2010CN201608180U 多回路串并联应用芯片支架 Series-parallel multi-loop applications chip holder
10/13/2010CN201608179U 可桥接扩充多面发光芯片的导电支架 Bridgeable expand multi-faceted light emitting chip conductive frame
10/13/2010CN201606848U Led散热器及led灯 Led radiator and led lights
10/13/2010CN201606704U 带染色层的led灯 Led lights with dyed layer
10/13/2010CN201603666U 一种自动精密旋转喷式点胶机 An automatic precision rotary spray dispenser
10/13/2010CN1897073B Light source apparatus and display apparatus
10/13/2010CN1440579B Nitride semiconductor device
10/13/2010CN101861662A Light-emitting element
10/13/2010CN101861661A Gallium nitride semiconductor device on SOI and process for making same
10/13/2010CN101861660A Light source and illumination system having a predefined external appearance
10/13/2010CN101861659A Improved performance optically coated semiconductor devices and related methods of manufacture
10/13/2010CN101861640A Substrate processing method and substrate processed by this method
10/13/2010CN101859982A Nitride semiconductor element having multi-layered cushion structure and manufacturing method thereof
10/13/2010CN101859866A Support for manufacturing LED and method for encapsulating high-power white light LED
10/13/2010CN101859865A Gold-wire-free encapsulation method of large power white light LED part and white light LED part
10/13/2010CN101859864A High-power direct plug-in type light emitting diode
10/13/2010CN101859863A Sapphire base novel inverted structure and application thereof
10/13/2010CN101859862A 发光装置 Light-emitting device
10/13/2010CN101859861A GaN-based flip-chip light-emitting diode with double reflecting layers and preparation method thereof
10/13/2010CN101859860A AlGaInP-series light-emitting diode with double reflecting layers and preparation method thereof
10/13/2010CN101859859A High-brightness GaN-based light-emitting diode and preparation method thereof
10/13/2010CN101859858A Transparent conducting electrode based on graphene and manufacture method and applications thereof
10/13/2010CN101859857A LED device
10/13/2010CN101859856A Light-emitting diode (LED)
10/13/2010CN101859855A Quaternary upright lighting diode with double roughened surfaces and preparation method thereof
10/13/2010CN101859854A Light-emitting element
10/13/2010CN101859853A Nitride semiconductor light emitting diode
10/13/2010CN101859852A Manufacturing process for improving capacity of aluminum gallium indium phosphorus light-emitting diodes
10/13/2010CN101859851A Wafer machining method
10/13/2010CN101859850A LED encapsulation structure
10/13/2010CN101859849A Light emitting diode device and method for forming the same
10/13/2010CN101859848A Photoelectric element
10/13/2010CN101859847A Light-emitting diode (LED) and manufacturing method thereof
10/13/2010CN101859846A Manufacture method of vertical LED
10/13/2010CN101859845A Luminous device and manufacturing method thereof
10/13/2010CN101859844A Light-emitting diode (LED) structure and manufacturing method thereof
10/13/2010CN101859843A Gallium nitride series light-emitting diode and manufacturing method thereof
10/13/2010CN101859842A Light emitting diode for increasing luminous efficiency
10/13/2010CN101859841A Light-emitting diode (LED)
10/13/2010CN101859840A Light-emitting diode (LED) structure
10/13/2010CN101859839A Light-emitting diode (LED) chip
10/13/2010CN101859838A Light-emitting diode structure having weld pad reflection layers
10/13/2010CN101859837A Nitride series semiconductor luminescent assembly
10/13/2010CN101859836A Light-conducting type light-emitting diode and manufacturing method thereof
10/13/2010CN101859835A Light-emitting diode (LED) structure and manufacturing method thereof
10/13/2010CN101859834A Light-emitting diode (LED) and packaging structure thereof
10/13/2010CN101859833A Light emitting component with reflecting layer and structure of reflecting layer thereof
10/13/2010CN101859832A Anti-surge and electrostatic protection flip chip light-emitting diode sealing structure
10/13/2010CN101859831A Surge-resisting and anti-static light-emitting diode and manufacturing method thereof
10/13/2010CN101859830A Light-emitting diode (LED) chip
10/13/2010CN101859829A Structure of light-emitting diode having multidirectional light scattering and manufacturing method thereof
10/13/2010CN101859828A Manufacturing method of light-emitting diode (LED)
10/13/2010CN101859827A Light-emitting diode (LED)
10/13/2010CN101859826A Fixing method and structure of light-emitting diode (LED) wafer
10/13/2010CN101859825A Multi-layer quantum well nitride light-emitting diode with carrier providing layer
10/13/2010CN101859824A Light-emitting diode chip with dual-loop electrode design
10/13/2010CN101859823A Surface-mounting LED packaging structure and manufacture method thereof
10/13/2010CN101859822A Surge-resisting and anti-static diode structure and manufacturing method thereof
10/13/2010CN101859821A Gallium nitride light-emitting diode structure
10/13/2010CN101859820A Light-emitting diode (LED) structure
10/13/2010CN101859819A Light-emitting semiconductor connection structure and method thereof
10/13/2010CN101859818A Buffer layer structure of gallium nitride diode device
10/13/2010CN101859817A Manufacturing method of gallium nitride series light-emitting diode
10/13/2010CN101859816A Flip-chip type light-emitting diode capable of eliminating surge and static and manufacturing method thereof
10/13/2010CN101859815A Vertical light-emitting diode with woven structure and manufacturing method thereof
10/13/2010CN101859789A Alternating current light-emitting device with effect of increasing light extraction efficiency and manufacturing method thereof
10/13/2010CN101859788A Light-emitting diode (LED) element and driving method thereof
10/13/2010CN101859759A White LED light source package
10/13/2010CN101859758A High voltage low current surface emitting LED
10/13/2010CN101859757A Stack light-emitting diode chip structure and manufacturing method thereof
10/13/2010CN101859756A AC type flip-chip light-emitting diode structure and preparation method thereof
10/13/2010CN101859728A Method of transferring device
10/13/2010CN101858660A Heat storage device
10/13/2010CN101858586A Structure for integrating light-emitting diode (LED) circuit on heat radiating substrate
10/13/2010CN101858498A Alternating current light-emitting diode structure having over-current protection
10/13/2010CN101857676A Metal oxide fine particle-containing silicone resin composition
10/13/2010CN101515626B Method for manufacturing LED chip substrate structure
10/13/2010CN101488550B Manufacturing method for LED in high In ingredient multiple InGaN/GaN quantum wells structure
10/13/2010CN101471418B Lead wire holder of LED