Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
09/2012
09/19/2012EP2499663A2 Etching process for semiconductors
09/19/2012CN202444007U LED (Light Emitting Diode) heat radiator
09/19/2012CN202444006U Packaging structure of bar light-emitting diode module
09/19/2012CN202444005U Waterproof light-emitting diode (LED)
09/19/2012CN202444004U High power support
09/19/2012CN202444003U Novel LED high-power module article
09/19/2012CN202444002U Lamp bead used for LED candle lamp
09/19/2012CN202443970U LED packaging structure adopting COB technology
09/19/2012CN102687296A White semiconductor light emitting device
09/19/2012CN102687295A Contacting an optoelectronic semiconductor component through a conversion element and corresponding optoelectronic semiconductor component
09/19/2012CN102687294A Solid state emitter package including red and blue emitters
09/19/2012CN102687293A Compound semiconductor device
09/19/2012CN102687292A Nitride semiconductor element and manufacturing method therefor
09/19/2012CN102687291A Optoelectronic semiconductor chip and method for fabrication thereof
09/19/2012CN102687290A Light-emitting semiconductor chip
09/19/2012CN102687289A Optoelectronic semiconductor chip and use of an intermediate layer based on AlGaN
09/19/2012CN102687288A III nitride semiconductor vertical-type-structure LED chip and process for production thereof
09/19/2012CN102687271A Thin-film semiconductor device with protection diode structure and method for producing a thin-film semiconductor device
09/19/2012CN102687247A N-type contact electrode comprising a group III nitride semiconductor, and method for forming same
09/19/2012CN102686990A Light-receiving module for light-emitting element and inspection device for light-emitting element
09/19/2012CN102686938A Light module
09/19/2012CN102686700A Halophosphate phosphor and white light emitting device
09/19/2012CN102686699A Strontium oxyorthosilicate phosphors having improved stability under a radiation load and resistance to atmospheric humidity
09/19/2012CN102686101A Multicolour light emitting diode lamp for use in plant cultivation, lighting device and plant cultivation method
09/19/2012CN102686021A Electronic device
09/19/2012CN102683571A High-power light emitting diode (LED) radiating structure
09/19/2012CN102683570A White light LED (Light Emitting Diode) packaged on composite ceramic substrate and preparation method thereof
09/19/2012CN102683569A High-heat-conductivity LED (light-emitting diode) high-power packaging bracket
09/19/2012CN102683568A Heat conductive composite substrate having heat dissipation properties and manufacturing method thereof
09/19/2012CN102683567A Light-emitting diode structure with metal reflection surface and heat sink
09/19/2012CN102683566A High power LED (Light Emitting Diode) heat dissipation structure applying superconductive uniform temperature plate
09/19/2012CN102683565A Light emitting device using GaN LED chip
09/19/2012CN102683564A Method of manufacturing lead frame and light-emitting device package
09/19/2012CN102683563A Lead frame for luminous chip
09/19/2012CN102683562A Light-emitting diode element and light-emitting diode device
09/19/2012CN102683561A Optical element, optoelectronic component comprising said element, and the production thereof
09/19/2012CN102683560A Phosphor position in light emitting diodes
09/19/2012CN102683559A Light-emitting diode packaging structure and manufacturing method thereof
09/19/2012CN102683558A Semiconductor light emitting device wafer and method for manufacturing semiconductor light emitting device
09/19/2012CN102683557A Semiconductor light emitting device and method for manufacturing the same
09/19/2012CN102683556A White-light-emitting diode with fluorescent layer
09/19/2012CN102683555A Packaging structure and packaging method for light-emitting diode
09/19/2012CN102683554A High-light-effect light source module based on known good die (KGD) design technology and chip testability packaging method of high-light-effect light source module
09/19/2012CN102683553A LED (Light Emitting Diode) integrated packaging substrate with shortest bonding wire and light source module applying substrate
09/19/2012CN102683552A Surface mount light-emitting diode (LED) with waterproof function and bracket thereof
09/19/2012CN102683551A Outdoor display screen SMD (surface mount device) LED (light-emitting diode) structure
09/19/2012CN102683550A Semiconductor light-emitting device and manufacturing method thereof
09/19/2012CN102683549A Substrate used for installing leds and method for manufacturing led module
09/19/2012CN102683548A Semiconductor assembly
09/19/2012CN102683547A Light emitting diode package structure
09/19/2012CN102683546A Semiconductor package structure and manufacturing method thereof
09/19/2012CN102683545A Light source module for raising heat dissipation efficiency, and embedded packaging structure thereof
09/19/2012CN102683544A Paster type light-emitting diode
09/19/2012CN102683543A LED (Light Emitting Diode) packaging structure
09/19/2012CN102683542A Led封装结构 Led package structure
09/19/2012CN102683541A Light emitting diode packaging subassembly with die bonded through magnetic forces
09/19/2012CN102683540A Gallium-nitride-based light-emitting diode and manufacturing method thereof
09/19/2012CN102683539A Led structure
09/19/2012CN102683538A Light emitting diode package and method of manufacture
09/19/2012CN102683537A Light emitting diode
09/19/2012CN102683536A Electric refrigerating light assembly and manufacturing method thereof
09/19/2012CN102683535A Light-emitting device, light-emitting device module, and vehicle lighting unit
09/19/2012CN102683534A Vertical type alternating-current light-emitting diode device and manufacturing method thereof
09/19/2012CN102683533A Light emitting diode and manufacturing method thereof
09/19/2012CN102683532A Substrate containing imaging Distributed Bragg Reflector (DBR) structure
09/19/2012CN102683531A Flip-chip type semiconductor luminescent device structure and manufacture method thereof
09/19/2012CN102683530A Light emitting diode with large viewing angle and fabricating method thereof
09/19/2012CN102683529A Light-emitting diode device and method for manufacturing the same
09/19/2012CN102683528A Structure of light-emitting diode
09/19/2012CN102683527A Semiconductor light-emitting chip and manufacturing method thereof
09/19/2012CN102683526A Nitrides semiconductor light-emitting structure
09/19/2012CN102683525A Defect-controlling structure for epitaxial growth, light emitting device containing defect-controlling structure, and method of forming the same
09/19/2012CN102683524A Inversed LED (Light Emitting Diode) chip structure and preparation method of inversed LED chip
09/19/2012CN102683523A Method for extending light emitting diodes (LED) on low-dislocation gallium nitride (GaN) nanometer columns
09/19/2012CN102683522A Manufacture method of light-emitting diode with air bridge structure
09/19/2012CN102683521A LED manufacturing method
09/19/2012CN102683520A LED aluminium vapor chamber integrated radiating structure and preparation method thereof
09/19/2012CN102683519A Manufacturing method of wide-spectrum semiconductor super-radiation light-emitting diode
09/19/2012CN102683518A Preparation method for nanopore-shaped patterned sapphire substrate
09/19/2012CN102683517A Film LED (light-emitting diode) chip device as well as manufacturing method and application thereof
09/19/2012CN102683516A Light emitting device and projector
09/19/2012CN102683515A Apparatus and method for manufacturing light emitting device package
09/19/2012CN102683514A Light emitting diode package and method of manufacture
09/19/2012CN102683513A Optical semiconductor element and manufacturing method of the same
09/19/2012CN102683512A Light emitting device and projector
09/19/2012CN102683511A Method for producing light-emitting diode device
09/19/2012CN102683510A 发光装置以及投影仪 Light-emitting device and a projector
09/19/2012CN102683509A Led module
09/19/2012CN102683508A Methods of forming iii/v semiconductor materials, and semiconductor structures formed using such methods
09/19/2012CN102683507A Light source module structure and producing method of light source module
09/19/2012CN102683506A Nano-structure layer for gallium-nitride-based (GaN-based) light emitting diode (LED) epitaxial slice and preparation method thereof
09/19/2012CN102683460A Closed heat radiating device
09/19/2012CN102683391A Methods and devices for fabricating and assembling printable semiconductor elements
09/19/2012CN102683376A High-pressure light emitter, light emitter and illumination device
09/19/2012CN102683335A Light-emitting diode package structure
09/19/2012CN102683334A High-power LED packaging structure with super-heat-conducting temperature equalizing plate
09/19/2012CN102683326A Semiconductor light emitting diode chip, method of manufacturing thereof and method for quality control thereof
09/19/2012CN102683280A Method of semiconductor manufacturing process
09/19/2012CN102679187A LED (light-emitting diode) optical module for lighting, and LED chip
09/19/2012CN102676169A Fluorescent substance and light-emitting device employing the same
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