| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 12/12/2012 | CN202601728U Light emitting diode (LED) packaging structure with double-layer lens structure |
| 12/12/2012 | CN202601727U LED light source having trapezoid bowl-cup support structure |
| 12/12/2012 | CN202601726U LED light source module packaging structure |
| 12/12/2012 | CN202601725U Light-emitting diode with electrostatic protection mechanism |
| 12/12/2012 | CN202601724U Light-emitting diode (LED) support frame |
| 12/12/2012 | CN202601723U LED support |
| 12/12/2012 | CN202601722U Light emitting diode (LED) light source |
| 12/12/2012 | CN202601721U Surface mounting LED with waterproof function and support thereof |
| 12/12/2012 | CN202601720U Light-emitting diode device |
| 12/12/2012 | CN202601719U Light-emitting device of light emitting diode (LED) chips based on silicon substrate |
| 12/12/2012 | CN202601718U LED (light-emitting diode) surface light source packaging piece |
| 12/12/2012 | CN202601717U Led bracket and led |
| 12/12/2012 | CN202601716U Blue-light LED chip |
| 12/12/2012 | CN202601715U LED (light-emitting diode) chip |
| 12/12/2012 | CN202601714U Combined electrode suitable for high-power GaN-based LED chip |
| 12/12/2012 | CN202601713U Light emitting diode substrate and light emitting diode |
| 12/12/2012 | CN202601712U Sapphire substrate wafer |
| 12/12/2012 | CN202601711U Vertical LED chip |
| 12/12/2012 | CN202601710U LED chip |
| 12/12/2012 | CN202601709U A die bonder controller and a die bonding system |
| 12/12/2012 | CN202601612U LED module group for commercial lighting |
| 12/12/2012 | CN202598416U Lock catch surface-mount structure for light-emitting diode (LED) light source |
| 12/12/2012 | CN202595026U Special pressure-sensitive adhesive tape for high-surface-energy epoxy package |
| 12/12/2012 | CN1996129B Light source device and liquid crystal display device using the same |
| 12/12/2012 | CN1992359B Light-emitting diode and method for manufacturing the same |
| 12/12/2012 | CN1919965B Composite phosphor powder, light emitting device using the same and method for manufacturing composite phosphor powder |
| 12/12/2012 | CN102823084A Method of manufacturing light-emitting device |
| 12/12/2012 | CN102823003A Interconnect for optoelectronic device |
| 12/12/2012 | CN102823002A Light-emitting device |
| 12/12/2012 | CN102823001A Light-emitting device |
| 12/12/2012 | CN102823000A Light-emitting device and process for production thereof |
| 12/12/2012 | CN102822999A Light emitting diode, method for manufacturing same, and light emitting diode lamp |
| 12/12/2012 | CN102822998A Semiconductor device and manufacturing method thereof |
| 12/12/2012 | CN102822997A Method of manufacture for light-emitting element and light-emitting element manufactured thereby |
| 12/12/2012 | CN102822996A Semiconductor light-emitting element |
| 12/12/2012 | CN102822995A Group iii nitride based light emitting diode structures with multiple quantum well structures having varying well thicknesses |
| 12/12/2012 | CN102822955A Semiconductor device mounting method |
| 12/12/2012 | CN102822314A Luminescent converter |
| 12/12/2012 | CN102822313A Surface-treated fluorescent bodies and process for production of surface-treated fluorescent bodies |
| 12/12/2012 | CN102820418A Insulated heat-conducting film-layer material for semiconductor illumination and preparation method of insulated heat-conducting film material |
| 12/12/2012 | CN102820417A Power LED (light emitting diode) heat conducting base |
| 12/12/2012 | CN102820416A Warm white light-emitting diode (LED) and manufacturing method thereof |
| 12/12/2012 | CN102820415A Stack-based light-emitting diode and manufacturing method thereof |
| 12/12/2012 | CN102820414A Fluorescent powder mixture and LED (Light-Emitting Diode) packaging device with color conversion function |
| 12/12/2012 | CN102820413A Fluorescent resin component and manufacturing method |
| 12/12/2012 | CN102820412A Chip package and manufacturing method thereof |
| 12/12/2012 | CN102820411A Light-emitting diode chip and manufacturing method and packaging method thereof |
| 12/12/2012 | CN102820410A Light-emitting component packaging structure |
| 12/12/2012 | CN102820409A High-power LED (Light Emitting Diode) bracket and high-power LED packaging structure |
| 12/12/2012 | CN102820408A Efficient LED chip packaging mechanism |
| 12/12/2012 | CN102820407A Bracket and LED (light emitting diode) lamp and module thereof |
| 12/12/2012 | CN102820406A Manufacturing method of LED (light emitting diode) packaging structure |
| 12/12/2012 | CN102820405A Integrated manufacturing method of silicon base plate and copper micro heat pipe of LED (light emitting diode) apparatus |
| 12/12/2012 | CN102820404A Light-emitting diode package |
| 12/12/2012 | CN102820403A Light emitting diode and supports thereof |
| 12/12/2012 | CN102820402A 半导体封装结构 The semiconductor package structure |
| 12/12/2012 | CN102820401A Packaging shell and LED module comprising same |
| 12/12/2012 | CN102820400A LED packaged structure and surface roughening method for same |
| 12/12/2012 | CN102820399A Semiconductor light-emitting device |
| 12/12/2012 | CN102820398A Distributed Bragg reflection and small area metal contact composite three-dimensional electrode |
| 12/12/2012 | CN102820397A Light emitting diode, light emitting device package including the same and lighting system |
| 12/12/2012 | CN102820396A Current diffusion layer, light emitting diode device and manufacturing method thereof |
| 12/12/2012 | CN102820395A LED structure comprising quantum barriers with gradient potential barrier heights and method for manufacturing LED structure |
| 12/12/2012 | CN102820394A LED structure with aluminum-component-gradient electron blocking layer |
| 12/12/2012 | CN102820393A Composite substrate structure and fabrication method thereof |
| 12/12/2012 | CN102820392A Epitaxial wafer of light-emitting diode and manufacturing method thereof |
| 12/12/2012 | CN102820391A Silicon-based near-infrared quantum-dot electroluminescent device and preparation method thereof |
| 12/12/2012 | CN102820390A Light-emitting diode (LED) structure and manufacturing method thereof |
| 12/12/2012 | CN102820389A ELO (epitaxial lift-off) technology-based light emitting diode with inversed structure and preparation method thereof |
| 12/12/2012 | CN102820388A Manufacturing method of LED base plate, LED base plate and white light LED structure |
| 12/12/2012 | CN102820387A Manufacturing method of LED element |
| 12/12/2012 | CN102820386A Method for manufacturing epitaxial substrate, light-emitting diode and method for manufacturing light-emitting diode |
| 12/12/2012 | CN102820385A Method for manufacturing semiconductor device |
| 12/12/2012 | CN102820384A Method for manufacturing light emitting diode packaging structure |
| 12/12/2012 | CN102820316A LED display microarray and preparation method thereof |
| 12/12/2012 | CN102820315A Direct-light-emitting-type micro display array device and preparation method thereof |
| 12/12/2012 | CN102820314A Linear high voltage LED (Light Emitting Diode) chip and implementation method thereof |
| 12/12/2012 | CN102820248A Feeding system of die bonder |
| 12/12/2012 | CN102820234A Method of sealing and molding an optical device with resin |
| 12/12/2012 | CN102818145A Combined type LED (light-emitting diode) module without radiator, and production method thereof |
| 12/12/2012 | CN102817005A Film-forming device and light-emitting device |
| 12/12/2012 | CN102816565A Phosphor and manufacturing method therefore, and light emission device using the phosphor |
| 12/12/2012 | CN102816437A Silica gel for packaging of light emitting diode (LED) and preparation method thereof |
| 12/12/2012 | CN102816432A Resin composition and transparent encapsulant formed using the same, and electronic device including encapsulant |
| 12/12/2012 | CN102208502B Method for making light emitting diode invisible electrode with gallium-nitride-based vertical structure |
| 12/12/2012 | CN102054927B Light-emitting diode package |
| 12/12/2012 | CN101993513B Packaging material composite and method for manufacturing packaging materials |
| 12/12/2012 | CN101931042B Routing method and packaging structure of LED electrode lead as well as display and light-emitting device |
| 12/12/2012 | CN101894902B LED substrate and manufacturing method thereof |
| 12/12/2012 | CN101714605B AlGaInp system LED chip with current regulating layer and preparing method thereof |
| 12/12/2012 | CN101694862B Warm white light light-emitting diode (LED) and lithium matter fluorescent powder thereof |
| 12/12/2012 | CN101681975B Main substrate of nitride-based illuminating device |
| 12/12/2012 | CN101673787B Semiconductor luminous device and packaging structure thereof |
| 12/12/2012 | CN101667614B Light-emitting diode (LED) device and manufacturing method thereof |
| 12/12/2012 | CN101592760B Opto-electric hybrid module and manufacturing method thereof |
| 12/12/2012 | CN101553605B Group iii element nitride substrate, substrate with epitaxial layer, processes for producing these, and process for producing semiconductor element |
| 12/12/2012 | CN101358133B White light emitting diode and sulphide fluorescent material thereof |
| 12/11/2012 | US8330950 Method of manufacturing nitride semiconductor device including SiC substrate and apparatus for manufacturing nitride semiconductor device |
| 12/11/2012 | US8330349 Yellow emitting Ce3+ doped calcium silicate phosphor and white light emitting diodes including Ce3+ doped calcium silicate phosphor |
| 12/11/2012 | US8330192 Method for modification of built in potential of diodes |