Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364)
12/2012
12/19/2012CN202616290U LED with linear surface
12/19/2012CN202616289U Large-power integration packaging circuit board
12/19/2012CN202616288U Phosphor-coated LED with box dam
12/19/2012CN202616287U LED packaging part, lighting device and displaying device having the packaging part
12/19/2012CN202616286U Paster type nixie tube and digital display equipment
12/19/2012CN202616285U Semiconductor light emitting diode assembly structure
12/19/2012CN202616284U Substrate used for light emitting diode element and light emitting diode assembly possessing substrate
12/19/2012CN202616283U GaN-based light emitting diode
12/19/2012CN202616282U LED chip provided with pyramid array structure
12/19/2012CN202616281U A1GaInP systematic light emitting diode with double epitaxial structure
12/19/2012CN202616280U Imaging substrate of LED chip and LED chip
12/19/2012CN202616232U Light-emitting diode (LED) packaging structure
12/19/2012CN202616231U COB surface light source
12/19/2012CN202616230U Light emitting diode packaging structure
12/19/2012CN202616216U Adsorption platform for light emitting diode wafer
12/19/2012CN202613086U LED illuminator and LED lamp having the same
12/19/2012CN1938872B Semiconductor light emitting devices including flexible film having therein an optical element
12/19/2012CN1729268B Luminescent body and optical device including the same
12/19/2012CN1729267B Phosphor and optical device using same
12/19/2012CN102835190A Fluorescent substrate and method for producing the same, and display device
12/19/2012CN102834942A Led模块 Led Module
12/19/2012CN102834941A Light-emitting apparatus and method of manufacturing thereof
12/19/2012CN102834940A Led module and manufacturing method thereof
12/19/2012CN102834939A 氮化物半导体发光元件 The nitride semiconductor light emitting element
12/19/2012CN102834938A Light emitting diodes with n-polarity and associated methods of manufacturing
12/19/2012CN102834937A Light-emitting diode chip with current spreading layer
12/19/2012CN102834660A Illumination apparatus
12/19/2012CN102834465A Encapsulant for optical semiconductor device and optical semiconductor device using same
12/19/2012CN102833995A Full-automatic high-speed LED (light-emitting diode) plug-in chip mounter
12/19/2012CN102832331A Wafer level LED packaging structure
12/19/2012CN102832330A Wafer level LED packaging structure
12/19/2012CN102832329A Phosphor powder coating method of remote phosphor powder optical device
12/19/2012CN102832328A White-light LED (light-emitting diode) and preparation method thereof
12/19/2012CN102832327A Phosphor adhesive sheet, light emitting diode element, light emitting diode device, and producing method thereof
12/19/2012CN102832326A Encapsulating sheet and optical semiconductor element device
12/19/2012CN102832325A Packaging module of light-emitting diode (LED)
12/19/2012CN102832324A High-power LED (light emitting diode) packaging structure
12/19/2012CN102832323A Packaging process of high-power light-emitting diode (LED)
12/19/2012CN102832322A 发光二极管装置 Light-emitting diode device
12/19/2012CN102832321A Surface-mounted laser packaging structure
12/19/2012CN102832320A LED chip eutectic bonding process
12/19/2012CN102832319A Disk type integrated LED light source and preparation method thereof
12/19/2012CN102832318A Disc-shaped integrated flip-chip LED light source and preparation method thereof
12/19/2012CN102832317A Red LED packaging method
12/19/2012CN102832316A Method and device for improving color temperature consistency of white light LED (Light Emitting Diode) lighting device
12/19/2012CN102832315A Flip chip package structure of LED
12/19/2012CN102832314A Package carrier and package structure
12/19/2012CN102832313A Heat dissipation packaging unit and support structure thereof
12/19/2012CN102832312A Novel LED (light emitting diode) packaging structure
12/19/2012CN102832311A Light emitting diode structure
12/19/2012CN102832310A Light emitting diode structure
12/19/2012CN102832309A Gallium-nitride-based light-emitting diode (LED) of reflection layer with square annular structure
12/19/2012CN102832308A Patterned substrate for preparing light emitting diode (LED) flip chip
12/19/2012CN102832307A Light emitting device, light emitting device package and illuminating system comprising thereof
12/19/2012CN102832306A Epitaxial structure of high-brightness light emitting diode and implementation method thereof
12/19/2012CN102832305A Light emitting device
12/19/2012CN102832304A Manufacturing method of GaN-based semiconductor light-emitting diode (LED)
12/19/2012CN102832303A Preparation method of gallium nitride substrate high brightness light emitting diode
12/19/2012CN102832302A Method for manufacturing N electrode of GaN-based light-emitting diode (LED)
12/19/2012CN102832301A Method for growth of epitaxial layer of light emitting diode chip
12/19/2012CN102832300A Method of manufacturing semiconductor light emitting device
12/19/2012CN102832299A Preparation method of laminated transparent conducting layer LED (light emitting diode) chip
12/19/2012CN102832298A Manufacturing method of light emitting diode packaging structure
12/19/2012CN102832297A Preparation methods of semiconductor light emitting device and current diffusion layer
12/19/2012CN102832296A Manufacturing method of light emitting component
12/19/2012CN102832295A Method for fabricating package structure of light-emitting diode
12/19/2012CN102832294A Method for packaging LED light source and LED light source
12/19/2012CN102832225A Method for producing air bridge electrode interconnection array type light-emitting diode (LED) device
12/19/2012CN102832208A Light emitting device and illumination apparatus including same
12/19/2012CN102832155A Repair device, repair method, and component manufacturing method
12/19/2012CN102832142A Manufacturing method for packaging structure
12/19/2012CN102829445A Integrated LED (light-emitting diode) with balancing mechanism and manufacturing process thereof
12/19/2012CN102827604A Ultraviolet-excited white light phosphor for LED (light-emitting diode) and preparation method thereof
12/19/2012CN102827603A Fluorescent substance and process for producing the same, and light emitting device using said fluorescent substance
12/19/2012CN102827601A Fluoride fluorescent powder material and semiconductor light-emitting device thereof
12/19/2012CN102827477A Silicone resin composition, encapsulating layer, reflector, and optical semiconductor device
12/19/2012CN102222739B Method for encapsulating white light LED (Light Emitting Diode) display module
12/19/2012CN102214781B High-power LED (light emitting diode) capillary wetting and radiating device and radiating method
12/19/2012CN102169928B Manufacturing method of LED (Light Emitting Diode) lamp anti-reflection micronano structure
12/19/2012CN102157663B Led package and forming method
12/19/2012CN102157637B Method for roughening surface colloid of light-emitting device
12/19/2012CN102148313B Light-emitting diode device
12/19/2012CN102142503B 白光的产生方法以及白光发光二极管装置 Method for generating white light and white light emitting diode device of
12/19/2012CN102110762B Radiating device integrating radiating plate and electrode and manufacturing method thereof
12/19/2012CN102074629B Light emitting diode with sandwich-type current blocking structure
12/19/2012CN101939859B Light emitting apparatus and display apparatus having the same
12/19/2012CN101878543B Method for producing an optoelectronic component and optoelectronic component
12/19/2012CN101859859B High-brightness GaN-based light-emitting diode and preparation method thereof
12/19/2012CN101725850B 照明装置 Lighting device
12/19/2012CN101697366B LED via ion implant isolation
12/19/2012CN101517761B Optoelectronic component
12/19/2012CN101479860B Led package, emitter package and method for emitting light
12/18/2012US8335243 Optoelectronic semiconductor body and method for producing an optoelectronic semiconductor body
12/18/2012US8334587 Semiconductor light emitting device with first and second leads
12/18/2012US8334585 LED package and fabrication method thereof
12/18/2012US8334577 Semiconductor device
12/18/2012US8334549 Light emitting diode with current blocking region
12/18/2012US8334548 Semiconductor light emitting device
12/18/2012US8334547 Light-transmitting metal electrode having hyperfine structure and process for preparation thereof
12/18/2012US8334546 Light emitting diode
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