| Patents for H01L 33 - Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof (99,364) |
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| 01/16/2013 | CN102881784A C delta-doped p-type GaN/AlGaN structure, LED epitaxial wafer structure and fabrication method |
| 01/16/2013 | CN102881783A Method for cutting light emitting diode chip through deep etching |
| 01/16/2013 | CN102881782A Segmenting method of optical device substrate |
| 01/16/2013 | CN102881781A Light-emitting diodes (leds) and forming method thereof |
| 01/16/2013 | CN102881780A Luminous module and manufacturing method thereof |
| 01/16/2013 | CN102881779A Method for manufacturing light emitting diode packaging structure |
| 01/16/2013 | CN102881718A Nitride-based semiconductor device having excellent stability |
| 01/16/2013 | CN102881706A A light-emitting element a method for manufacturing the same |
| 01/16/2013 | CN102881686A Light-emitting diode (LED) light source module |
| 01/16/2013 | CN102881685A Light-emitting diode (LED) chip on board (COB) packaging light source |
| 01/16/2013 | CN102881684A LED (light-emitting diode) packaging structure and method |
| 01/16/2013 | CN102881570A Method for manufacturing semiconductor material |
| 01/16/2013 | CN102881230A Glass window advertising screen with internally embedded LED (light-emitting diode) and manufacture method thereof |
| 01/16/2013 | CN102878458A Integrated optical component |
| 01/16/2013 | CN102878456A High-power LED (light-emitting diode) lamp module of chip-on-board |
| 01/16/2013 | CN102876282A Preparation method of transparent organic silica glue for encapsulating nano SiO2 modified COB-LEDs |
| 01/16/2013 | CN102876281A Preparation method for nano TiO2 modified high-refractive index organic silica gel for chip on board-light emitting diode (COB-LED) pressing strip |
| 01/16/2013 | CN102875811A Preparation method for phenyl vinyl MQ silicone resin |
| 01/16/2013 | CN102244167B Method for preparing single chip white light LED (light-emitting diode) |
| 01/16/2013 | CN102237481B Surface mounted type power light-emitting diode (LED) bracket manufacturing method and product manufactured thereby |
| 01/16/2013 | CN102237459B Method for preparing light emergent structure of light-emitting diode (LED) device |
| 01/16/2013 | CN102227008B Preparation method of P type GaN layer of LED chip |
| 01/16/2013 | CN102176498B Manufacturing method of LED chip |
| 01/16/2013 | CN102176451B LED packaging base |
| 01/16/2013 | CN102157633B Separation method of LED (light emitting diode) epitaxy chip |
| 01/16/2013 | CN102130084B Semiconductor chip assembly with a post/base heat spreader and a signal post |
| 01/16/2013 | CN102106000B Light-emitting devices |
| 01/16/2013 | CN102074638B Light-emitting diode package and manufacturing method thereof |
| 01/16/2013 | CN102046690B Optical semiconductor sealing resin composition and optical semiconductor device using same |
| 01/16/2013 | CN101971380B Optoelectronic component |
| 01/16/2013 | CN101958316B LED integrated packaging power source module |
| 01/16/2013 | CN101880528B Single-matrix white fluorescent powder, manufacturing method thereof and light emitting device manufactured thereby |
| 01/16/2013 | CN101867003B 发光装置 Light-emitting device |
| 01/16/2013 | CN101859866B Support for manufacturing LED and method for encapsulating high-power white light LED |
| 01/16/2013 | CN101851508B Europium-activated silicate green fluorescent powder and application thereof in white light-emitting diode |
| 01/16/2013 | CN101846249B Light emitting device for AC power operation |
| 01/16/2013 | CN101834235B Light-emitting diode packaging structure and manufacture method thereof |
| 01/16/2013 | CN101820044B Metal substrate and light-emitting diode encapsulation method of metal substrate |
| 01/16/2013 | CN101807659B Method for packaging white LED locally sprayed with fluorescent powder and fluorescent powder local coating structure |
| 01/16/2013 | CN101765923B LED illumination device |
| 01/16/2013 | CN101747893B Aluminate red fluorescent powder and preparation method thereof |
| 01/16/2013 | CN101621099B 电路结构 Circuit structure |
| 01/16/2013 | CN101587831B Semiconductor component structure and method for manufacturing semiconductor component |
| 01/16/2013 | CN101533819B Semiconductor packaging structure, lead frame and conductive part which are applied to semiconductor packaging structure |
| 01/16/2013 | CN101510542B Encapsulation structure and manufacturing method for high power light-emitting diode chip |
| 01/16/2013 | CN101398153B Led assembly |
| 01/16/2013 | CN101368102B Warm white LED and its bromide fluorescent powder |
| 01/16/2013 | CN101331621B Light emitting device |
| 01/16/2013 | CN101248537B Led with roughened high refractive index surface layer for high light extraction |
| 01/15/2013 | US8355420 Light-emitting device and manufacturing method therof |
| 01/15/2013 | US8355098 Wavelength conversion member, light source assembly including the wavelength conversion member and liquid crystal display including the light source assembly |
| 01/15/2013 | US8354978 Display apparatus |
| 01/15/2013 | US8354779 Heat sink with helical fins and electrostatic augmentation |
| 01/15/2013 | US8354689 Light emitting devices having dopant front loaded tunnel barrier layers |
| 01/15/2013 | US8354688 Semiconductor chip assembly with bump/base/ledge heat spreader, dual adhesives and cavity in bump |
| 01/15/2013 | US8354687 Efficient thermal management and packaging for group III nitride based UV devices |
| 01/15/2013 | US8354686 Light emitting device array |
| 01/15/2013 | US8354685 Semiconductor light emitting device |
| 01/15/2013 | US8354683 Semiconductor element |
| 01/15/2013 | US8354682 Radiation emitting element |
| 01/15/2013 | US8354681 Semiconductor light-emitting element and manufacturing method thereof |
| 01/15/2013 | US8354680 AC light emitting diode having full-wave light emitting cell and half-wave light emitting cell |
| 01/15/2013 | US8354679 Microcavity light emitting diode method of manufacture |
| 01/15/2013 | US8354669 Organic light-emitting display device and method of manufacturing the same |
| 01/15/2013 | US8354665 Semiconductor light-emitting devices for generating arbitrary color |
| 01/15/2013 | US8354663 Micro-pixel ultraviolet light emitting diode |
| 01/15/2013 | US8354289 Method for manufacturing gallium nitride wafer |
| 01/15/2013 | US8354286 Method of manufacturing silicon optoelectronic device, silicon optoelectronic device manufactured by the method, and image input and/or output apparatus using the silicon optoelectronic device |
| 01/15/2013 | US8354285 Light emitting panel and manufacturing method of light emitting panel |
| 01/15/2013 | US8353613 Light guide plate and display apparatus comprising the same |
| 01/15/2013 | CA2585063C Light-emitting device |
| 01/10/2013 | WO2013006782A1 Led lighting device having a phosphor composition |
| 01/10/2013 | WO2013005858A1 Curable silicon composition, cured product thereof, and optical semiconductor device |
| 01/10/2013 | WO2013005794A1 Composition for forming fluorescent sheet |
| 01/10/2013 | WO2013005793A1 Resin composition for forming fluorescent sheet |
| 01/10/2013 | WO2013005792A1 Illumination device |
| 01/10/2013 | WO2013005791A1 Resin composition for forming fluorescent sheet |
| 01/10/2013 | WO2013005789A1 Method of manufacture for nitride semiconductor light emitting element, wafer, and nitride semiconductor light emitting element |
| 01/10/2013 | WO2013005717A1 Insulating reflective substrate and method for producing same |
| 01/10/2013 | WO2013005655A1 Light-emitting element breakdown detector and method for detecting light-emitting element breakdown |
| 01/10/2013 | WO2013005652A1 Light-emitting element breakdown detector and method for detecting light-emitting element breakdown |
| 01/10/2013 | WO2013005646A1 Method for manufacturing semiconductor light-emitting element |
| 01/10/2013 | WO2013005633A1 Compound comprising isocyanuric skeleton, epoxy groups, and organopolysiloxane or silsesquioxane skeleton having sih groups, thermosetting resin composition comprising compound as agent for imparting adhesion, cured product, and sealing member for optical semiconductor |
| 01/10/2013 | WO2013005494A1 Cell for light-emitting device and light-emitting device |
| 01/10/2013 | WO2013005493A1 Method for producing cell for light-emitting device and method for producing light-emitting device |
| 01/10/2013 | WO2013005488A1 Light emitting device and display device |
| 01/10/2013 | WO2013005487A1 Light emitting device and display device |
| 01/10/2013 | WO2013005399A1 Lighting apparatus used in photography and mobile electronic device provided with same |
| 01/10/2013 | WO2013005391A1 Nitride semiconductor light-emitting element and method of manufacturing thereof |
| 01/10/2013 | WO2013005356A1 Rare-earth aluminum garnet type fluorescent substance and light-emitting device obtained using same |
| 01/10/2013 | WO2013005147A1 Light guide |
| 01/10/2013 | WO2013004735A1 Method for producing a conversion element, and conversion element |
| 01/10/2013 | WO2013004496A2 Optoelectronic semiconductor component and module comprising a plurality of such components |
| 01/10/2013 | WO2013004455A1 Method for producing a lighting device and lighting device |
| 01/10/2013 | WO2013004137A1 Light source module and lighting device |
| 01/10/2013 | WO2012148224A3 Light-emitting-device package and a production method therefor |
| 01/10/2013 | WO2012144819A3 Led package having a thermoelectric device, and method for manufacturing same |
| 01/10/2013 | WO2012128966A3 Light emitting diode package comprising encapsulant with index matched thixotropic agent |
| 01/10/2013 | US20130012276 Optical electronic package |
| 01/10/2013 | US20130011953 Method for manufacturing semiconductor light-emitting device |