Patents
Patents for H01L 27 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate (229,248)
01/1999
01/26/1999US5863833 Overcoating with refractory metal the nonconductive native oxide layer of first electroconductive material coated onto sides of contact hole, subsequent reaction with metal renders native oxide conductive to reduce contact resistance
01/26/1999US5863831 Process for fabricating semiconductor device with shallow p-type regions using dopant compounds containing elements of high solid solubility
01/26/1999US5863830 Process for the production of a structure having a thin semiconductor film on a substrate
01/26/1999US5863829 Subjecting bonded wafer to plasma assisted chemical etching to form thin film of active substrate and remove non-bonded peripheral portion of wafer
01/26/1999US5863823 Self-aligned edge control in silicon on insulator
01/26/1999US5863821 Method of fabricating a semiconductor memory device having a tree-typecapacitor
01/26/1999US5863818 Multilevel transistor fabrication method having an inverted, upper level transistor
01/26/1999US5863602 Coating silicon film onto inner wall of chamber using silicon-based gas, reducing pressure, causing silicon wafer to emit impurities, capture of inpurities by silicon film
01/26/1999US5863375 Apparatus and methods for wafer debonding using a liquid jet
01/26/1999CA2009068C Trench jfet integrated circuit elements
01/21/1999WO1999003205A1 Circuit arrangement, in particular for triggering an ignition end stage
01/21/1999WO1999003204A1 Sr flip flop
01/21/1999WO1999003158A1 High brightness, high efficiency organic light emitting device
01/21/1999WO1999003157A1 Laser ablation method to fabricate color organic light emitting diode displays
01/21/1999WO1999003152A2 Semiconductor device with memory capacitor and method of manufacturing such a device
01/21/1999WO1999003151A2 A process for manufacturing ic-components to be used at radio frequencies
01/21/1999WO1999003147A1 Thermally insulated integrated circuits
01/21/1999WO1999003087A2 Bonded active matrix organic light emitting device display and method of producing the same
01/21/1999WO1999003062A1 Noncontact ic card
01/21/1999WO1999002277A1 Sealing structure for organic light emitting devices
01/21/1999WO1998044552A3 Method of manufacturing a non-volatile memory combining an eprom with a standard cmos process
01/21/1999DE19832297A1 Driver circuit for TFT LCD or projection display
01/21/1999DE19831582A1 Current converter arrangement for AC motor drive
01/21/1999DE19816791A1 Schaltungsanordnung, insbesondere zum Ansteuern einer Zündendstufe Circuit arrangement, in particular for controlling an ignition
01/21/1999CA2296027A1 High brightness, high efficiency organic light emitting device
01/21/1999CA2296026A1 Bonded active matrix organic light emitting device display and method of producing the same
01/21/1999CA2295990A1 A process for manufacturing ic-components to be used at radio frequencies
01/21/1999CA2295676A1 Sealing structure for organic light emitting devices
01/21/1999CA2295567A1 Noncontact ic card
01/20/1999EP0892589A1 Organic electroluminescent display device
01/20/1999EP0892552A2 Photoelectric conversion apparatus
01/20/1999EP0892442A1 Process for manufacturing a metal-metal capacity in an integrated circuit and corresponding integrated circuit
01/20/1999EP0892440A1 Controllable conduction device
01/20/1999EP0892439A1 Integrated photosensor comprising a test circuit
01/20/1999EP0892438A2 Solid-state relay
01/20/1999EP0892437A2 Precision capacitor ladder using differential equal-perimeter pairs
01/20/1999EP0892436A2 Electrostatic protection structure for MOS circuits
01/20/1999EP0892435A1 Integrated semiconductor transistor with current sensing
01/20/1999EP0892430A1 Process for manufacturing an integrated circuit comprising an array of memory cells
01/20/1999EP0892429A2 Process for semiconductor device fabrication
01/20/1999EP0892426A2 Multi-layer approach for optimizing ferroelectric film performance
01/20/1999EP0892425A2 Fabriciation method for a platinum-metal pattern by means of a lift-off process
01/20/1999EP0892409A2 Semiconductor memory device
01/20/1999EP0892287A2 Enhanced light collection efficiency sensor with microlens array
01/20/1999EP0892028A2 Composition for an organic el element and method of manufacturing the organic el element
01/20/1999EP0891634A1 A semiconductor processing method for forming a contact pedestal for a storage node of a capacitor in integrated circuitry
01/20/1999EP0891631A1 Method and apparatus for fabricating silicon dioxide and silicon glass layers in integrated circuits
01/20/1999CN1205801A Process for prototyping of mixed signal applications and field programmable system on chip for applying said process
01/20/1999CN1205553A Prodn. method of wafer end electrode
01/20/1999CN1205552A Prodn. method of wafer and electrode
01/20/1999CN1205551A Microcomputer and multichip module
01/20/1999CN1205523A Read only memory
01/19/1999US5862197 Charge coupled device having CCIR/EIA mode coversion function
01/19/1999US5862147 Semiconductor device on semiconductor wafer having simple wirings for test and capable of being tested in a short time
01/19/1999US5862096 Semiconductor memory device having optimally arranged internal down-converting circuitry
01/19/1999US5862090 Semiconductor memory device having cell array divided into a plurality of cell blocks
01/19/1999US5862082 Two transistor flash EEprom cell and method of operating same
01/19/1999US5862081 Multi-state flash EEPROM system with defect management including an error correction scheme
01/19/1999US5862080 Multi-state flash EEprom system with defect handling
01/19/1999US5862076 Fast EPROM array
01/19/1999US5862031 ESD protection circuit for integrated circuits having a bipolar differential input
01/19/1999US5861929 Active matrix color display with multiple cells and connection through substrate
01/19/1999US5861913 Heat-sensitive infrared-light image sensor with circuitry for canceling temperature-dependent drift components
01/19/1999US5861680 Photonic device and process for fabricating the same
01/19/1999US5861655 Photoelectric conversion apparatus and image reading apparatus with good crosstalk characteristics
01/19/1999US5861650 Semiconductor device comprising an FPGA
01/19/1999US5861649 Trench-type semiconductor memory device
01/19/1999US5861648 Capacitor unit of a booster circuit whose low-voltage operating point margin can be expanded while an increase in area occupied thereby is suppressed
01/19/1999US5861645 For storing a signal charge
01/19/1999US5861642 Semiconductor device having charge transfer device equipped with three semiconductor layers of same conductivity type with mutually different concentrations
01/19/1999US5861641 Customizable logic array device
01/19/1999US5861639 Breakover-triggered dipole component having a controlled sensitivity
01/19/1999US5861626 Mercury cadmium telluride infrared filters and detectors and methods of fabrication
01/19/1999US5861621 Photosensor circuit having an initial setting unit
01/19/1999US5861620 Photoelectric converting apparatus
01/19/1999US5861347 Method for forming a high voltage gate dielectric for use in integrated circuit
01/19/1999US5861336 High-frequency wireless communication system on a single ultrathin silicon on sapphire chip
01/19/1999US5861333 Thermal oxidation to create a silicon oxide film, removal of silicon nitride and silicon oxide pad by photolithography and dry etching, doping to create buried n+ type impurity
01/19/1999US5861332 Strontium oxide thin film deposited over ruthenium dioxide, is changed to srruo3 during deposition of the high dielectric film carried out at high temperature; improved chemical, thermal stability of the lower electrode
01/19/1999US5861331 Method for fabricating capacitors of a dynamic random access memory
01/19/1999US5861330 Forming implants with hybrid resists which do not require additional masking steps at the well edges; implants reduce the lifetime of minority carriers in the parasitic transistor, reducing gain of the parasitic transistor
01/19/1999US5861328 Method of fabricating GMR devices
01/19/1999US5861326 Method for manufacturing semiconductor integrated circuit
01/15/1999CA2242512A1 Integrated photosensor
01/14/1999WO1999001939A1 Ladder type resistance circuit, and digital-analog converter and semiconductor device using the same
01/14/1999WO1999001899A1 Method of transferring thin film devices, thin film device, thin film integrated circuit device, active matrix substrate, liquid crystal display, and electronic apparatus
01/14/1999WO1999001857A1 Display
01/14/1999WO1999001856A1 Display
01/14/1999WO1999001688A1 Thermal microvalves
01/14/1999DE19813457A1 Non-volatile memory production, e.g. EEPROM
01/14/1999DE19810579A1 Integrated semiconductor switching arrangement and Zener diode e.g. for IC voltage regulator
01/14/1999DE19807012A1 Non-volatile memory array of EEPROM cells
01/14/1999DE19807010A1 Non-volatile memory e.g. EEPROM production
01/14/1999DE19807009A1 Non volatile memory e.g. EEPROM production
01/14/1999DE19756527A1 Wafer with circuit pattern in element forming and peripheral regions
01/14/1999DE19729277A1 Transferable polarisation trap arrangement for opto-electronic signal processing
01/13/1999EP0891122A1 Organic electroluminescent device
01/13/1999EP0891045A1 A coupling charge compensation device for VLSI circuits
01/13/1999EP0890994A2 Power MOSFET and fabrication method
01/13/1999EP0890993A2 MOS controllable power semiconductor device