Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/1986
06/10/1986US4593457 Method for making gallium arsenide NPN transistor with self-aligned base enhancement to emitter region and metal contact
06/10/1986US4593454 Process for manufacturing an integrated circuit with tantalum silicide connections utilizing self-aligned oxidation
06/10/1986US4593453 Two-level transistor structures and method utilizing minimal area therefor
06/10/1986CN85109668A Integrated circuit comprising capacitances of different capacitance values
06/10/1986CN85109507A Method for manufacturing a semiconductor device
06/10/1986CN85108671A Semiconductor integrated circuit device and manufacturing process thereof
06/10/1986CN85108626A Electronic device manufacturing methods
06/10/1986CN85108189A Method and apparatus for applying a layer of photosensitive material to a semiconductor wafer
06/10/1986CN85104651A Mos isolation processing.
06/10/1986CN85104650A Mos rear end processing
06/10/1986CA1205923A1 Control of substrate injection in lateral bipolar transistors
06/10/1986CA1205922A1 Self-aligned manufacture of fet
06/10/1986CA1205844A1 Electron emitter assembly
06/05/1986WO1986003341A1 Trench transistor
06/05/1986WO1986003340A1 Semiconductor device provided with a metal layer
06/05/1986WO1986003339A1 Method for fabricating semiconductor devices and devices formed thereby
06/05/1986WO1986003338A1 Apparatus and method for fabricating modules comprising stacked circuit-carrying layers
06/05/1986WO1986003337A1 Process for fabricating dimensionally stable interconnect boards and product produced thereby
06/05/1986WO1986003336A1 Ethylene glycol etch for processes using metal silicides
06/05/1986WO1986003335A1 Method for manufacturing trench gate mos structures in ics and accordingly fabricated devices
06/05/1986WO1986003334A2 Semiconductors having shallow, hyperabrupt doped regions, and process for preparation thereof using ion implanted impurities
06/05/1986WO1986003333A2 High-performance trench capacitors for dram cells
06/05/1986WO1986003231A1 Chemical beam deposition method
06/05/1986WO1986003228A1 Method for deposition of gallium arsenide from vapor phase gallium-arsenic complexes
06/05/1986EP0181341A4 Infrared panel emitter and method of producing the same.
06/04/1986EP0183624A2 L-fast fabrication process for high speed bipolar analog large scale integrated circuits
06/04/1986EP0183623A2 Precision high-value MOS capacitors
06/04/1986EP0183562A2 Polysilicon diodes
06/04/1986EP0183561A2 Microwave plasma processing process and apparatus
06/04/1986EP0183517A2 Semiconductor memory device wirings
06/04/1986EP0183474A2 Semiconductor device
06/04/1986EP0183297A1 Method and apparatus for applying a layer of photosensitive material to a semiconductor wafer
06/04/1986EP0183204A2 Process for fabricating semiconductor integrated circuit devices
06/04/1986EP0183146A2 Semiconductor devices consisting of epitaxial material
06/04/1986EP0183138A1 Method of producing highly integrated circuits of MOS transistors
06/04/1986EP0183125A2 Positioning system
06/04/1986EP0183047A2 Process for the photochemical vapor depositiom of hetero-linked polymers
06/04/1986EP0183032A2 High density CMOS integrated circuit manufacturing process
06/04/1986EP0182998A1 Method for making metal contact studs between first level metal and regions of a semiconductor device compatible with polyimide-filled deep trench isolation schemes
06/04/1986EP0182977A1 Method for making studs for interconnecting metallization layers at different levels in semiconductor chip
06/04/1986EP0182876A1 Tri-well cmos technology.
06/04/1986EP0182856A1 Gaseous lock for entrance and exit of tunnel, in which transport and processing of wafers take place under double floating condition
06/04/1986EP0182855A1 Apparatus for double floating wafer transport and processing
06/04/1986EP0096062B1 Non-volatile semiconductor memory device and manufacturing method therefor
06/03/1986USH73 Integrated circuit packages
06/03/1986US4593363 Simultaneous placement and wiring for VLSI chips
06/03/1986US4593362 Bay packing method and integrated circuit employing same
06/03/1986US4593307 High temperature stable ohmic contact to gallium arsenide
06/03/1986US4593301 High electron mobility semiconductor device employing selectively doped heterojunction and dual, undoped spacer layers
06/03/1986US4593300 Folded logic gate
06/03/1986US4593214 Circuit for discharging bootstrapped nodes in integrated circuits with the use of transistors designed to withstand only the normal voltage
06/03/1986US4593203 Semiconductor integrated circuit which allows adjustment of circuit characteristics in accordance with storage data of nonvolatile memory element
06/03/1986US4593200 Scan controller for ion implanter device
06/03/1986US4593168 Method and apparatus for the heat-treatment of a plate-like member
06/03/1986US4592985 Photoconductive member having amorphous silicon layers
06/03/1986US4592975 Repairing defects using novolak resin
06/03/1986US4592944 Method for providing a top seal coating on a substrate containing an electrically conductive pattern and coated article
06/03/1986US4592933 High efficiency homogeneous chemical vapor deposition
06/03/1986US4592927 Forming semiconductor oxide by evaporation
06/03/1986US4592926 Processing apparatus and method
06/03/1986US4592921 Measurement of electrical resistance
06/03/1986US4592802 Method of fabrication of aluminum contacts through a thick insulating layer in an integrated circuit
06/03/1986US4592801 Method of patterning thin film
06/03/1986US4592800 Method of inhibiting corrosion after aluminum etching
06/03/1986US4592799 Method of recrystallizing a polycrystalline, amorphous or small grain material
06/03/1986US4592794 Glass bonding method
06/03/1986US4592793 Heating to diffuse Group 5 element dope
06/03/1986US4592792 Using a mixture of silicon and chloride source gas; controlling temperature
06/03/1986US4592791 Indium phosphide substrate; growing an aluminum, indium arsenic intermetallic by liquid phase epitaxy
06/03/1986US4592650 Apparatus for projecting a pattern on a semiconductor substrate
06/03/1986US4592306 Apparatus for the deposition of multi-layer coatings
06/03/1986US4592132 Process for fabricating multi-level-metal integrated circuits at high yields
06/03/1986US4592131 Method for manufacturing resin-sealed semiconductor device
06/03/1986US4592128 Method for fabricating integrated circuits with polysilicon resistors
06/03/1986CA1205578A1 Method for manufacturing an integrated circuit device
06/03/1986CA1205577A1 Semiconductor device
06/03/1986CA1205576A1 Method of manufacturing an integrated circuit device
06/03/1986CA1205575A1 Method for manufacturing an integrated circuit device
06/03/1986CA1205574A1 Ion implanted memory cells for high density ram
06/03/1986CA1205571A1 Semiconductor device having cmos structures
06/03/1986CA1205538A1 Chip carrier connector
05/1986
05/28/1986EP0182718A2 Semiconductor memory device
05/28/1986EP0182717A2 A read only memory circuit
05/28/1986EP0182681A1 Oxidation furnace for semiconductor material wafers
05/28/1986EP0182651A2 Semiconductor substrate
05/28/1986EP0182587A2 A photo resist and a process for manufacturing an integrated circuit
05/28/1986EP0182477A2 Filter apparatus for use with an x-ray source
05/28/1986EP0182457A2 A dynamic random access memory circuit and a method of stabilizing current surges in such a memory circuit
05/28/1986EP0182455A2 Paired electrodes for plasma chambers
05/28/1986EP0182443A2 X-ray lithographic system, in particular gas control for the same, and method for fabricating a semiconductor substrate
05/28/1986EP0182422A2 High breakdown voltage semiconductor devices
05/28/1986EP0182400A1 Method of manufacturing a bipolar transistor having emitter series resistors
05/28/1986EP0182371A2 Protection film structure for functional devices
05/28/1986EP0182222A2 Semiconductor integrated circuit device constructed by polycell technique
05/28/1986EP0182218A2 Method for dicing semiconductor wafer
05/28/1986EP0182198A2 Single transistor electrically programmable device and method
05/28/1986EP0182184A2 Process for the bubble-free bonding of a large-area semiconductor component to a substrate by soldering
05/28/1986EP0182121A1 Semiconductor integrated circuit with CMOS gate array
05/28/1986EP0182067A2 Semiconductor device having increased immunity against alpha-particles and external noise
05/28/1986EP0182041A2 Integrated circuit chip with "bit-stacked" functional blocks