| Patents for C09J 177 - Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers (1,629) |
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| 10/23/2002 | EP1251157A1 Polyamide and conductive filler adhesive |
| 10/17/2002 | US20020151620 As adhesive esters or amides of a carboxylic acid with a hydroxyl and/or amine functional unsaturated group, for example maleic acid, diallyl ester |
| 10/17/2002 | US20020150408 Imageable seamed belts having polyamide adhesive between interlocking seaming members |
| 10/16/2002 | EP1249638A2 Imageable seamed belts having polyamide adhesive between interlocking seaming members |
| 10/16/2002 | EP0603384B1 Hot melt adhesive composition |
| 10/08/2002 | WO2001094492A1 Impact-resistant epoxy resin compositions |
| 10/08/2002 | CA2405584A1 Impact-resistant epoxy resin compositions |
| 10/02/2002 | CN1091778C Weather-resistant polyamides and method of their production |
| 09/18/2002 | EP1240252A2 Thermoplastic compositions comprising crystalline and amorphous polymers |
| 09/18/2002 | CN1091300C Lead-on-chip semiconductor device package and its mfg. method |
| 09/17/2002 | US6451927 Room-temperature flowable polymerizable compound in a non-flowable polymer matrix which are particularly useful in the threadlocking and sealing applications |
| 09/17/2002 | US6451912 Polyolefin/copolyamide RF active adhesive film |
| 09/04/2002 | CN1090218C Adhesive for lignocellulose and process for preparing lignocellulose pressed board |
| 09/04/2002 | CN1090217C High-solids and powder coatings from hydroxy-functional acrylic resins |
| 08/28/2002 | CN1366546A Adhesive composition comprising particulate thermoplastic component |
| 08/28/2002 | CN1365862A Method and equipment for producing flexible cloth possessing hot melt adhesive coating layer applied by wire mesh |
| 08/21/2002 | EP1233045A2 Bonding agent for improving the adhesion between rubbers and reinforcing elements |
| 08/21/2002 | CN1089466C 芯片卡 Chip Card |
| 08/15/2002 | WO2002062895A1 A polyamide/polyisobutylene composition and method of its preparation |
| 08/15/2002 | US20020111439 Polymerizable compositions in non-flowable forms |
| 08/14/2002 | EP1231247A1 Process for producing adhesive for fusion bonding, adhesive for fusion bonding obtained by the process, and adhesive fabric containing the adhesive for fusion bonding |
| 08/13/2002 | US6433054 Comprised of polyurethane, polyester, or polyamide elastomer, acrylate polymer, fatty acid or ester, and optionally a drug; made without extruding; nonirritating; good adhesive strength without sticking to skin |
| 08/08/2002 | DE10105402A1 Haftmittel zur Erhöhung der Haftfestigkeit zwischen Kautschuken und Festigkeitsträgern Adhesive to increase the adhesion between rubber and reinforcing materials |
| 08/07/2002 | CN1362461A Polyamide thermosol |
| 08/07/2002 | CN1362460A Polyamide thermosol and its prepn |
| 08/07/2002 | CA2370407A1 Adhesives for increasing the adhesion between rubbers and reinforcing materials |
| 07/30/2002 | CA2074257C Electrical connection |
| 07/18/2002 | WO2002038693A3 Uv-resistant flocking adhesive for polymer substrates |
| 07/18/2002 | US20020094376 Screen imprinting a paste forming a barrier-layer, subsequent powdering with a hot-melt adhesive powder and removing excess of powder not adhering to the paint imprint by blower/suction means prior to the coating being dried and sintered |
| 07/17/2002 | EP1223244A2 Method and device for the patterned coating of flexible sheets with a hot-melt adhesive |
| 07/16/2002 | US6420045 Block polymerization of polyamide with a polyether; hot melt adhesive |
| 07/16/2002 | CA2041839C Moisture curable polyurethane compositions |
| 07/11/2002 | WO1999035189A3 Thermoplastic compositions comprising crystalline and amorphous polymers |
| 07/10/2002 | CN1357589A Multi-purpose polyamide hot melt adhesive and its prepn |
| 07/03/2002 | EP1084206B1 Metal reinforced thermoplastic elastomers |
| 06/26/2002 | EP1216826A2 Laminate with one EVOH layer |
| 06/20/2002 | US20020077011 Strength and structural integrity of the substrate materials |
| 06/12/2002 | EP0964792B1 Adhesive systems for a one or multi step adhesive binding method, method for adhesive binding of printed matter |
| 06/06/2002 | US20020066526 Joint to be adhered to nylon resin moldings |
| 05/29/2002 | DE10055559A1 UV-beständiger Beflockungsklebstoff für Polymere Substrate UV-resistant flocking for Polymeric substrates |
| 05/23/2002 | WO2002000764A3 Melt-adhesives for sealing off rocks or building materials |
| 05/16/2002 | WO2002038693A2 Uv-resistant flocking adhesive for polymer substrates |
| 05/16/2002 | CA2428316A1 Uv-resistant flocking adhesive for polymer substrates |
| 05/02/2002 | WO2002034850A1 Varnish containing polyamide resin and use thereof |
| 05/01/2002 | CN1346862A Crosslinked base layer for sandwich fixed by two-point method and sticking method |
| 04/25/2002 | DE10050231A1 Vernetzende Basisschicht für Fixiereinlagen nach dem Doppelpunkt- und Pastenverfahren Crosslinking base layer of fusible after the colon and paste method |
| 04/18/2002 | US20020045019 Fixing label |
| 04/18/2002 | US20020043333 Copolymers containing polyamide blocks and polyether blocks based on ethoxylated amines |
| 04/17/2002 | EP1197541A1 Raster-like coating of hot melt adhesive |
| 04/17/2002 | EP1196512A1 Adhesive composition comprising a particulate thermoplastic component |
| 04/11/2002 | WO2002028959A1 Mixture of grafted polyamide-block and flexible polyolefin copolymers |
| 04/11/2002 | US20020042455 Crosslinking base layer for fixing interlinings according to double dot and paste process |
| 04/11/2002 | CA2358375A1 Crosslinking base layer for fixing interlinings according to double dot and paste process |
| 04/10/2002 | EP1195419A2 Joint for nylon resin moldings |
| 04/10/2002 | EP1195410A1 Aqueous polyamide resin dispersion and process for producing the same |
| 03/27/2002 | EP1189957A1 Aqueous vinyl and/or acrylic polyamide and polymer dispersions |
| 03/21/2002 | WO2001096588A3 Enzyme-catalyzed polyamides and compositions and processes of preparing and using the same |
| 03/20/2002 | EP0866809B1 Modified polyalkadiene-containing compositions |
| 03/14/2002 | US20020031614 Moisture crosslinking; computer controlled nozzles |
| 03/13/2002 | CN1080752C Thermal state high strength hot melt adhesive with polyamide or polyester amide structure |
| 03/12/2002 | US6355750 Curable adhesive comprising siloxane-containing maleimide compound and free radical- or photoinitiator; semiconductors, integrated circuits |
| 03/05/2002 | US6353084 Biodegradable polyestreramide and a process of preparing |
| 02/21/2002 | US20020022670 Low-melting copolyamide and their use as hot-melt adhesives |
| 02/19/2002 | CA2192108C Polyamide-containing antistatic and adhesive compositions |
| 02/05/2002 | US6344269 Well-suited for untreated high-density polyethylene articles; transfer portion comprising protective lacquer layer of a release agent and at least one of a hard polyester resin and an acrylic resin, polyamide ink, and adhesive |
| 01/24/2002 | US20020010256 Useful as a bookbinding adhesive |
| 01/24/2002 | DE10031992A1 Schmelzklebstoffe zur Abdichtung von Gestein oder Baumaterial Hot melt adhesives for sealing rock or building material |
| 01/17/2002 | US20020007042 Die attach adhesives for use in microelectronic devices |
| 01/16/2002 | EP1126768A4 Polymerizable compositions in non-flowable forms |
| 01/10/2002 | DE10032075A1 Elektrostatische Beschichtung von Formteilen mit thermoplastischen und vernetzbaren Copolyamidschmelzklebern Electrostatic coating of moldings with thermoplastic and cross-linkable Copolyamidschmelzklebern |
| 01/09/2002 | EP0977806B1 Thermoplastic elastomer composition adapted for adhesion to polar materials |
| 01/08/2002 | CA2130901C Stable polyamide resin dispersions containing piperazine and methods for the manufacture thereof |
| 01/03/2002 | WO2002000764A2 Melt-adhesives for sealing off rocks or building materials |
| 01/03/2002 | DE10029298A1 Befestigungsetikett Fixing label |
| 01/02/2002 | EP1166891A2 Electrostatic coating of molded pieces with thermoplastic and crosslinkable copolyamide hot-melt adhesives |
| 01/02/2002 | CN1329651A Adhesive powder |
| 01/01/2002 | US6335101 Used to store or transport materials, for example fluids and solids, in the form of a container or pipe |
| 01/01/2002 | CA2351929A1 Electrostatic coating of moldings with thermoplastic and crosslinkable copolyamide hot-melt adhesives |
| 01/01/2002 | CA2041532C Urethane sealant having improved sag properties |
| 12/27/2001 | WO2001056415A3 Handcovering |
| 12/26/2001 | CN1328588A Impact-resistant epoxide resin compositions |
| 12/26/2001 | CN1076746C Multipurpose liquid binding agent for building material and its production method |
| 12/20/2001 | WO2001096588A2 Enzyme-catalyzed polyamides and compositions and processes of preparing and using the same |
| 12/19/2001 | EP1164100A2 Attaching label |
| 12/18/2001 | US6331355 Copolyamides, copolyesters, spacer, separating and lubricating agent film free of separating layer, can be rolled up and unrolled without interlayer |
| 12/05/2001 | EP0870418B1 Electronic assembly with semi-crystalline copolymer adhesive |
| 11/29/2001 | DE10022701A1 Niedrigschmelzende Copolyamide sowie deren Verwendung als Schmelzklebemittel Low-melting copolyamides and their use as melt adhesives |
| 11/22/2001 | WO2001088039A1 Polyolefin/copolyamide rf active adhesive film |
| 11/22/2001 | CA2404692A1 Polyolefin/copolyamide rf active adhesive film |
| 11/21/2001 | CN1322769A Copolymer with polyamide block using ethoxyamine as main composition and polyether block |
| 11/14/2001 | EP1153957A2 Low-melting copolyamides and their use as hot-melt adhesives |
| 11/14/2001 | CN1321715A Adhesive of fixing matrix for microelectronic device |
| 11/07/2001 | EP1151053A1 Adhesive powder |
| 10/24/2001 | CN1318610A Two-component nylon fastener latex |
| 10/23/2001 | US6307003 Compostable adhesive |
| 10/23/2001 | US6306954 Adhesiveness |
| 10/17/2001 | EP1146065A1 Die attach adhesives for use in microelectronic devices |
| 10/14/2001 | CA2343632A1 Die attach adhesives for use in microelectronic devices |
| 10/11/2001 | WO2001074963A1 Adhesive composition comprising a particulate thermoplastic component |
| 10/11/2001 | CA2378078A1 Adhesive composition comprising a particulate thermoplastic component |