Patents for C09J 177 - Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers (1,629)
10/2001
10/10/2001EP1143775A2 Electronic assembly with semi-crystalline copolymer adhesive
10/09/2001US6300413 Hot-melt adhesives; useful for the coating and/or lamination of sheet-like structures
09/2001
09/26/2001EP1136512A1 Copolymers having polyamide blocks and polyether blocks derived from ethoxylated amines
09/12/2001CN1070879C Biologically degradable polymers, processes for manufacturing the same and the use thereof for producing biodegradable moulded articles
08/2001
08/30/2001US20010018491 Curable composition
08/29/2001EP1126768A1 Polymerizable compositions in non-flowable forms
08/23/2001DE10004355A1 Handschuh Glove
08/16/2001EP1123348A2 Impact-resistant epoxide resin compositions
08/09/2001WO2001056415A2 Handcovering
08/08/2001EP1122284A1 Curable compositions
07/2001
07/24/2001US6265530 Die attach adhesives for use in microelectronic devices
06/2001
06/20/2001EP0881967B1 See-through food packaging structures having a polyamide food contact-layer to remove compounds causing food discoloration
05/2001
05/30/2001CN1066478C Polyamide hot-melt adhesive and its prepn. method
05/09/2001EP0973842A4 Use of polyamide dispersion for filter cartridges
03/2001
03/27/2001US6207730 Epoxy and microsphere adhesive composition
03/22/2001DE19944159A1 Emissionsarmer, biologisch abbaubarer Klebstoff Low-emission, biodegradable glue
03/21/2001EP1085072A2 Low-emission biodegradable adhesive
03/21/2001EP1084206A1 Metal reinforced thermoplastic elastomers
03/21/2001CN1288033A Low diffusing biological degradation adhesion agent
02/2001
02/27/2001CA2116872C Hot melt adhesive composition
02/14/2001CN1283662A Petroleum fermented nylon 1212 not-fusible colloid and its preparing process
02/07/2001EP0893968A4 Poly(amino acid) adhesive tissue grafts
01/2001
01/30/2001CA2170752C Process for coating hot melt adhesives
01/18/2001WO2001004230A1 Process for producing adhesive for fusion bonding, adhesive for fusion bonding obtained by the process, and adhesive fabric containing the adhesive for fusion bonding
01/17/2001EP1069164A1 A composition of matter, a phase change ink, and a method of reducing a coefficient of friction of a phase change ink formulations
01/16/2001US6174937 For ink jet printing
01/04/2001DE10005639A1 Graft copolymer useful as blend component for modifying performance characteristics of molding composition, comprises polyamine and polyamide-forming monomers
01/03/2001EP1065232A2 Polyamide graft copolymers
01/03/2001EP1064318A1 Thermofusible and crosslinkable polyamide and one of the methods for obtaining same and adhesive comprising same
01/03/2001CN1278853A Gel-form pressure-sensitive adhesive, and adhesive material and adhesive medicinal preparation both containing the same
12/2000
12/29/2000CA2312583A1 Polyamide graft copolymers
11/2000
11/30/2000WO2000071594A1 Aqueous vinyl and/or acrylic polyamide and polymer dispersions
11/30/2000DE19924139A1 Primer composition for moisture-cured polyurethane adhesive for use e.g. on PVC window profiles, contains thermoplastic polymer, volatile solvent and tertiary amine or organometallic polyurethane catalyst
11/15/2000CN1273146A Flake with interrupted plane coated reactive adhesive and method for manufacturing thereof
11/02/2000WO2000064979A1 Aqueous polyamide resin dispersion and process for producing the same
10/2000
10/26/2000DE19916627A1 Folie mit einem unterbrochen flächig aufgetragenen reaktiven Haftmittel und Verfahren zu ihrer Herstellung Film with a surface applied interrupted reactive adhesives and methods for their preparation
10/25/2000EP1045889A1 Moisture-activable adhesive reinforcement strings and tear opening tapes for corrugated and cartonstock containers
10/18/2000EP1045015A2 Foil with segmented layer of reactive adhesive and method for its manufacture
10/04/2000CN1268432A Composite layered products contg. more than one layer
09/2000
09/27/2000CN1268201A Fast setting water sensitive polyamides havig a high Tg
09/06/2000EP0865473B1 Radiation cross-linkable branched polyester compositions which are water-dispersible and processes
09/05/2000US6114464 Thermosetting aqueous compostions
08/2000
08/31/2000DE19908640A1 Mehrschichtverbund Multilayer
08/30/2000EP1031411A2 Multilayer composite
08/29/2000US6111058 Formed by reacting a mixture consisting essentially of from 95 to 99.9% by weight of a polyesteramide, from 0.1 to 5% by weight of a divinyl ether, and from 0 to 5 mol % of compound capable of forming ester linkages
08/27/2000CA2299589A1 Composite having more than one layer
08/16/2000EP0980401A4 Aqueous dispersions of polyamides
08/16/2000EP0980400A4 Aqueous dispersions of polyamides
08/08/2000US6100370 Softener-free polyamide and molding composition and use thereof
07/2000
07/25/2000US6093270 Bonding substrates with a nonreactive, anhydrous, crystalline solid adhesive, by rubbing the solid adhesive against the substrate(s) to convert part of adhesive to amorphous form and form a tacky film, joining substrates and crystallizing
07/18/2000CA2001761C Interleaf layer in fiber reinforced resin laminate composites
07/13/2000WO2000020483A3 Impact-resistant epoxide resin compositions
06/2000
06/29/2000WO2000037538A1 Hotmelt adhesives based on polyamides
06/29/2000CA2356208A1 Hotmelt adhesives based on polyamides
06/28/2000EP1013734A1 Gel-form pressure-sensitive adhesive, and adhesive material and adhesive medicinal preparation both containing the same
06/28/2000EP1013694A1 Hotmelt adhesives based on polyamides
06/15/2000WO2000034406A1 Adhesive powder
06/14/2000EP1007788A1 FAST SETTING WATER SENSITIVE POLYAMIDES HAVING A HIGH Tg
06/08/2000DE19856254A1 Klebstoffpulver Adhesive powder
06/07/2000CN1255937A Adhesive resin compsn. and heat-shrinkable articles made by using same
06/07/2000CN1255524A Copolyamide thermosol and its preparing process
05/2000
05/11/2000WO2000025628A1 Polymerizable compositions in non-flowable forms
04/2000
04/20/2000DE19845607A1 Schlagfeste Epoxidharz-Zusammensetzungen Resistant epoxy resin compositions
04/13/2000WO2000020483A2 Impact-resistant epoxide resin compositions
04/13/2000CA2346634A1 Impact-resistant epoxide resin compositions
04/12/2000EP0991731A1 Rollable, single-coated hot melt adhesive film with no interlayer
04/05/2000CN1249716A Adhesive system for one or multi step adhesive binding method, method for adhesive binding of printed matter
04/04/2000CA2081106C Stable polyamide resin dispersions and methods for the manufacture thereof
03/2000
03/29/2000EP0902796B1 Thermosetting, aqueous compositions
03/29/2000CN1248603A Small chip adhesion agent for microelectronic device
03/28/2000US6042902 (1)blend of poly(alpha-olefins) comprising isotactic polypropylene and a polymer of a second lower alpha-olefin with small amount of higher poly(alpha-olefins) or (2)polyamides; gas barriers
03/28/2000CA2044527C Multilayer films and composite materials including polyamide- and modified co-polyolefin- based suitable for gluing.
03/22/2000CN1248199A Multilayer structure comprising material coated with block polyamide and block hydrophilic copolymers
03/08/2000EP0568707B1 Resin composition and multilayered laminate
02/2000
02/23/2000EP0980401A1 Aqueous dispersions of polyamides
02/23/2000EP0980400A1 Aqueous dispersions of polyamides
02/15/2000US6025458 Degradable polydioxaneone-based materials
02/09/2000EP0977806A1 Thermoplastic elastomer composition adapted for adhesion to polar materials
01/2000
01/26/2000EP0973842A1 Use of polyamide dispersion for filter cartridges
01/11/2000US6013373 Blend of poly(propylene-graft-maleic anhydride) and dimer acid based polyamide; lamination, coextrusion
01/05/2000EP0969068A1 Adhesive resin composition and heat-shrinkable articles made by using the same
01/05/2000EP0969065A2 Die attach adhesives for use in microelectronic
12/1999
12/23/1999WO1999066003A1 Long open time hotmelts based on polyamides
12/23/1999CA2335375A1 Long open time hotmelts based on polyamides
12/22/1999EP0965627A1 Long open time hotmelts based on polyamides
12/22/1999EP0964792A1 Adhesive systems for a one or multi step adhesive binding method, method for adhesive binding of printed matter
12/08/1999EP0961686A1 Multilayer structure comprising a material coated with block polyamide and block hydrophilic copolymers
11/1999
11/23/1999US5989385 Polyamide adhesives having improved bookbinding characteristics
11/11/1999DE19820661A1 Weichmacherfreies Polyamid und Formmasse und dessen Verwendung Plasticizer-free and polyamide molding composition and its use
11/10/1999EP0955326A1 Plasticizer free polyamide,moulded products therefrom and their use
11/09/1999US5980690 Creping adhesives containing oxazoline polymers and methods of use thereof
11/04/1999WO1999055793A1 Metal reinforced thermoplastic elastomers
10/1999
10/21/1999WO1999052486A1 Oil resistant polyamide based adhesive
09/1999
09/23/1999WO1999047584A1 Thermofusible and crosslinkable polyamide and one of the methods for obtaining same and adhesive comprising same
09/22/1999EP0716667B1 Process for coating hot melt adhesives
09/15/1999CN1228459A Cross-linking bottom liner for adhesive lining cloth by double layer point coating technique
09/14/1999US5952071 Curable adhesive system
09/08/1999EP0940461A1 Raster-like coating of Hot melt adhesive
09/07/1999US5948880 Aqueous dispersions of polyamides
09/07/1999US5948709 Oil resistant polyamide based adhesive
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