| Patents for C09J 177 - Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers (1,629) |
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| 08/12/2004 | WO2004067668A1 Polyolefin and copolyamide based thermofusible adhesive composition with improved thermal behavior |
| 08/12/2004 | US20040158027 Polyesteramide copolymer |
| 08/04/2004 | CN1518585A Hot melt adhesive composition and process for preparation of textile product |
| 07/13/2004 | US6761978 Polyamide and conductive filler adhesive |
| 07/07/2004 | CN1156551C Polyamide thermosol and its prepn. |
| 06/30/2004 | CN1508358A Special composite material for railway rail |
| 06/03/2004 | US20040105990 Backing, adhesive layer, and protective member, where the adhesive layer comprises a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent; improved adhesion, heat resistance, low modulus of elasticity |
| 06/01/2004 | US6743741 Process for producing adhesive for fusion bonding, adhesive for fusion bonding obtained by the process, and adhesive fabric containing the adhesive for fusion bonding |
| 05/19/2004 | EP1272587B1 Impact-resistant epoxy resin compositions |
| 05/12/2004 | CN1149271C Bonding process |
| 05/05/2004 | CN1493639A Long carbon chain nylon hot melt glue and its synthesis method |
| 04/28/2004 | CN1147556C Method for preparing polyamide hot-melt adhesive |
| 04/27/2004 | US6727320 Polymerizable compositions in non-flowable forms |
| 04/14/2004 | CN1145682C Small chip adhesion agent for microelectronic device |
| 04/07/2004 | CN1144853C Method for controlling the melt index of polyamide thermosol |
| 03/25/2004 | WO2004024842A1 Smoke suppressant hot melt adhesive composition |
| 03/24/2004 | EP1399519A1 Devices, compositions, and methods incorporating adhesives whose preformance is enhanced by organophilic clay constitutents |
| 03/18/2004 | US20040054058 Smoke suppressant hot melt adhesive composition |
| 03/17/2004 | EP1397415A1 Polyesteramide copolymer |
| 03/10/2004 | EP1395640A1 Hot melt adhesive composition and process for the preparation of a textile product |
| 03/03/2004 | EP1392788A1 Heat-sensitive adhesive insert for heat-insulating composite metal sections |
| 02/18/2004 | EP0863935B1 Aqueous dispersions of polyamides |
| 02/12/2004 | US20040028482 Melt-adhesives for sealing off rocks or building materials |
| 02/05/2004 | US20040024127 An addition-condensation copolymer consisting of a polyolefin backbone and polyamide graft through an unsaturated monomer chosen from carboxylic acids, anhydrides, epoxides; processing around 180 degrees Celsius |
| 02/05/2004 | US20040024124 A curable blends comprising a cycloalkanone solvent, is easily desolventized during film formation, also epoxy resins; good workability, used in spin coating, screen printing, adhesive layer on printed circuits |
| 01/15/2004 | WO2004005391A1 Polymeric compositions containing polymers and ionic liquids |
| 01/15/2004 | US20040010093 Polyesterurethane copolymer |
| 01/15/2004 | CA2491587A1 Polymeric compositions containing polymers and ionic liquids |
| 01/13/2004 | US6677427 Enzyme-catalyzed polyamides and compositions and processes of preparing and using the same |
| 01/02/2004 | EP1126768B1 Polymerizable compositions in non-flowable forms |
| 12/30/2003 | US6670442 Thermoplastic polyamides derived from polymerized fatty acid components containing more than 6% by weight of trimeric acid |
| 12/04/2003 | WO2003038005A3 Polymerizable compositions in non-flowable forms |
| 11/26/2003 | CN1458215A Method for determining polyamide thermosol formula |
| 11/18/2003 | CA2063497C Moisture curable polyurethane composition |
| 10/23/2003 | US20030199635 With elastic modulus in flexure less than 150 MPa at 23 degrees C and having crystalline melting point of 60-100 degrees C; useful for making films, tanks, geomembrane protective fabrics and coatings by extrusion |
| 10/21/2003 | US6635138 Method of immobilizing circuitry fingers |
| 10/02/2003 | US20030187154 Corrosion and aging resistance; hot melt adhesive |
| 09/10/2003 | EP1342764A2 Hot melt adhesive based on graft copolymers with polyamide blocks |
| 09/10/2003 | EP1341863A2 Uv-resistant flocking adhesive for polymer substrates |
| 09/10/2003 | CN1441023A Thermal smelting adhesive based on polyamide block graft copolymer |
| 08/26/2003 | CA2418785A1 Hot-melt adhesives made from polyamide block graft copolymers |
| 08/19/2003 | US6607629 Process for the perfect binding of printed articles |
| 08/14/2003 | US20030150557 Adhesively bonded chip-and wafer stacks |
| 08/13/2003 | CN1436244A Enzyme-catalyzed polyamides and compositions and processes of preparing and using same |
| 08/13/2003 | CN1117829C Gel-form pressure-sensitive adhesive, and adhesive material and adhisive medicinal preparation both contg. same |
| 08/06/2003 | EP1333077A1 Varnish containing polyamide resin and use thereof |
| 08/06/2003 | CN1434091A Thermal adhesive composition and adhesive raw material |
| 07/09/2003 | EP1325072A1 Mixture of grafted polyamide-block and flexible polyolefin copolymers |
| 07/09/2003 | CN1113748C Composite material containing more than one layer |
| 07/08/2003 | US6590063 For production of mono- and multifilaments, fibers, films and nets |
| 07/08/2003 | US6589606 Electrostatic coating of moldings with thermoplastic and crosslinkable copolyamide hot-melt adhesives |
| 06/05/2003 | WO2003046078A1 Thermoplastic resin composition for ic cards |
| 06/04/2003 | EP1013734B1 Gel-form pressure-sensitive adhesive, and adhesive material and adhesive medicinal preparation both containing the same |
| 06/04/2003 | CN1422316A Impact-resistant epoxy resin compositions |
| 05/29/2003 | US20030100654 Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
| 05/08/2003 | WO2003038005A2 Polymerizable compositions in non-flowable forms |
| 05/07/2003 | CN1415686A Method for preparing polyamide hot-melt adhesive |
| 05/07/2003 | CN1415685A Method for controlling the melt index of polyamide hot-melt adhesive |
| 05/01/2003 | US20030083436 Composition, method of making, and method of using adhesive composition |
| 04/16/2003 | EP0928317B1 Process of preparing aqueous dispersions of polyamides |
| 04/16/2003 | CN1410499A Long carbon chain nylon thermosol and its preparation method |
| 04/15/2003 | US6548621 Trimellitic anhydride halide and bis(o-aminophenol) monomers; semiconductor dielectrics |
| 04/15/2003 | US6548579 Adhesive composition comprising a particulate thermoplastic component |
| 04/02/2003 | EP1297054A2 Melt-adhesives for sealing off rocks or building materials |
| 04/02/2003 | CN1104482C Adhesive for lignocellulose forming board adhesive, said lignocellulose forming board and its manufacturing |
| 04/02/2003 | CN1104441C Modified polyalkadiene-containing compositions |
| 03/25/2003 | US6538073 Polyamide graft copolymers |
| 03/12/2003 | EP1290211A2 Enzyme-catalyzed polyamides and compositions and processes of preparing and using the same |
| 03/12/2003 | CN1401724A High-temp.-resistant hot-melt adhesive |
| 03/05/2003 | EP1286833A1 Method for producing document cards comprising several layers and document cards produced therewith |
| 03/04/2003 | US6528615 Hot melt adhesives obtained from the condensation of polyamide blocks containing carboxylic acid ends with polyetherdiols, such as ethoxylated primary amines |
| 02/26/2003 | EP1285028A1 Polyolefin/copolyamide rf active adhesive film |
| 02/26/2003 | CN1102169C Petroleum fermented nylon 1212 not-fusible colloid and its preparing process |
| 02/20/2003 | US20030035971 Structure comprising a fluoropolymer layer and a piperazine-based tie resin |
| 02/12/2003 | EP1283235A2 Composition, method of making, and method of using adhesive composition |
| 02/12/2003 | CN1396810A Handcovering |
| 02/11/2003 | US6517946 Curable composition |
| 02/05/2003 | CN1394894A Composition and its preparing method, method for using adhensive composition |
| 02/04/2003 | US6515048 Adhesive powder |
| 01/29/2003 | CN1393501A Modified polyamide thermosol |
| 01/29/2003 | CN1393500A Hot melt composition and viscous lining cloth using composition |
| 01/23/2003 | US20030015690 Process for forming a mixed solvent adhesive solution |
| 01/22/2003 | CN1392887A MIxture of grafted polyamide-block and flexible polyolefin copolymers |
| 01/22/2003 | CN1392213A Adhesive structure including fluoride containing polymer layer and using piperazine as main component |
| 01/09/2003 | WO2003002682A1 Devices, compositions, and methods incorporating adhesives whose preformance is enhanced by organophilic clay constituents |
| 01/08/2003 | EP1272587A1 Impact-resistant epoxy resin compositions |
| 01/02/2003 | EP1270211A1 Structure comprising a fluoropolymer layer and a piperazine based bonding agent |
| 12/19/2002 | CA2389878A1 Structure consisting of a fluoropolymer and a piperazine-based binder |
| 12/12/2002 | US20020188065 Polyolefin/copolyamide RF active adhesive film |
| 12/11/2002 | EP0991731B1 Rollable, single-coated hot melt adhesive film with no interlayer |
| 12/10/2002 | CA2061769C Three component aminoamide acrylate resin compositions |
| 11/28/2002 | US20020177645 Polyamide and conductive filler adhesive |
| 11/21/2002 | WO2002092662A1 Polyesteramide copolymer |
| 11/20/2002 | EP0907689B1 High-solids and powder coatings from hydroxy-functional acrylic resins |
| 11/13/2002 | CN1094146C Copolyamide thermosol and its preparing process |
| 10/31/2002 | WO2002086009A1 Hot/melt adhesive composition and process for the preparation of a textile product |
| 10/31/2002 | WO2002086008A1 Heat-sensitive adhesive insert for heat-insulating composite metal sections |
| 10/31/2002 | US20020157780 Low viscosity mixtue of a monomer and/or polymeric adhesive which is crosslinkable by ultraviolet or stronger electromagnetic radiation, useful in one-step or multistep perfect binding of books and other print articles |
| 10/30/2002 | EP1251756A2 Handcovering |
| 10/29/2002 | US6472475 Olefinically unsaturated and the other capable of curing by esterification, prepared in such a way that it cures by two different chemical reaction mechanisms which can be activated successively and catalyzed at least substantially |